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Renesas AT25DF011-XMHNGU-T
- Part No.:
- AT25DF011-XMHNGU-T
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF011-XMHNGU-T.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,296
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Product details
Overview
AT25DF011-XMHNGU-T from Renesas Electronics is a 1-Mbit serial SPI Flash memory IC designed for code shadowing and embedded data storage in resource-constrained systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock frequency, and features 6 ns clock-to-output timing - enabling fast boot and firmware update in IoT edge nodes and industrial controllers.
For engineers reviewing the AT25DF011-XMHNGU-T datasheet, AT25DF011-XMHNGU-T pinout, AT25DF011-XMHNGU-T application, or AT25DF011-XMHNGU-T equivalent, key selection criteria include dual-read throughput, ultra-low deep power-down current (200 nA), flexible erase granularity (256-byte page / 4-kB & 32-kB blocks), OTP security register, and industrial temperature support up to +125 °C.
Technical Context
The AT25DF011-XMHNGU-T implements a dedicated SPI interface with hardware-controlled write protection via WP pin and HOLD pin for transaction suspension without chip deselection. Its memory architecture supports three erase granularities - page (256 B), uniform block (4 kB and 32 kB), and full-chip - optimized for co-located code and data segments.
Dual-Output Read mode uses both SI and SO pins as outputs (I/O0/I/O1) to deliver two bits per SCK falling edge, doubling read bandwidth versus standard Read Array (03h). The device integrates a 128-byte OTP security register (64-byte factory-unique ID + 64-byte user-programmable) and reports program/erase status via Status Register bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Mbit (128 KBytes) - sufficient for bootloader, firmware image, and configuration data in compact MCU-based designs. |
| Supply Voltage Range | 1.65 V to 3.6 V - enables direct interfacing with 1.8 V and 3.3 V logic domains without level shifters. |
| Max Clock Frequency | 104 MHz - supports high-speed instruction fetch and firmware updates with minimal latency. |
| Read Timing (tV) | 6 ns clock-to-output - ensures tight setup/hold margins for high-frequency SPI masters. |
| Erase Granularity | 256-byte page / 4-kB block / 32-kB block - allows precise overwriting of code modules or data logs without disturbing adjacent sectors. |
| Power-Down Current | 200 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes and wearable devices. |
| Endurance & Retention | 100,000 P/E cycles at -40 °C to +85 °C; 20-year data retention - meets long-life requirements for industrial and automotive control units. |
Pinout & Package
AT25DF011-XMHNGU-T is packaged in an 8-pad Ultra Thin DFN (2 mm × 3 mm × 0.6 mm), RoHS-compliant, halide-free package with wettable flank leads for automated optical inspection (AOI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select input | Active-low enable signal; rising edge ends operations, falling edge initiates command sequence - critical for multi-device SPI bus arbitration. |
| SCK | Serial clock input | Drives all data latching (rising edge) and output timing (falling edge); supports up to 104 MHz - defines maximum system throughput. |
| SI (I/O0) | Serial input / Dual-Read output | Primary command/address/data input; becomes I/O0 during Dual-Output Read (3Bh) - enables 2-bit-per-cycle reads to reduce firmware load time. |
| SO (I/O1) | Serial output / Dual-Read output | Standard data output; remains I/O1 during Dual-Output Read - pairs with SI to double effective read bandwidth. |
| WP | Hardware write protect input | Active-low pin that locks protected sectors when BPL bit is set - provides tamper-resistant firmware protection independent of software state. |
| HOLD | Communication pause input | Active-low signal suspends ongoing SPI transfers without deselecting chip - preserves internal state during host interrupt handling. |
| VCC | Power supply | Single 1.65–3.6 V rail powers core logic and memory array - eliminates need for charge pumps or auxiliary supplies. |
| GND | Ground reference | Common return path for all signals and power - requires low-impedance PCB connection to minimize noise coupling into sensitive read paths. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output Read (3Bh) | Enables 2-bit-per-clock-cycle reads using SI+SO pins, increasing effective read bandwidth by 100% vs standard Read Array (03h) at same SCK frequency. |
| Flexible Erase Architecture | Supports 256-byte page, 4-kB block, 32-kB block, and full-chip erase - minimizes wasted space when updating partial firmware images or logging data. |
| 128-byte OTP Security Register | Contains 64-byte factory-programmed unique identifier and 64-byte user-programmable field - enables secure device authentication and ESN binding without external crypto ICs. |
| Ultra-Deep Power-Down Mode | Draws only 200 nA (typical) - ideal for battery-powered applications requiring multi-year shelf life or infrequent wake-up events. |
| Industrial Temperature Range | Rated for -40 °C to +125 °C at 1.7–3.6 V - supports operation in under-hood automotive ECUs and industrial motor drives. |
Applications
| Secure Firmware Storage | IoT Edge Node Boot Memory |
|---|---|
Use Scenario: Storing signed bootloader and application firmware in a battery-powered smart meter with anti-tampering requirements. IC Role / Device Role / Timing Role: Non-volatile code storage with hardware write protection (WP pin) and OTP-based device identity binding. Use Value: Prevents unauthorized firmware modification via hardware lock; unique factory ID enables secure cloud onboarding and OTA update authorization. | Use Scenario: Providing fast-boot code storage for a Cortex-M4-based environmental sensor node operating on coin-cell battery. IC Role / Device Role / Timing Role: Primary SPI flash for executing boot code and storing calibration data; leverages Dual-Output Read for sub-100 ms firmware load. Use Value: 6 ns tV and 104 MHz clock support reduce boot latency; 200 nA ultra-deep power-down extends 10-year battery life. |
| Industrial PLC Configuration Memory | Automotive Body Control Module Data Log |
Use Scenario: Holding runtime configuration parameters and firmware patches in a DIN-rail mounted programmable logic controller. IC Role / Device Role / Timing Role: Reliable data storage with 100,000 P/E cycles and 20-year retention; uses 4-kB block erase for atomic parameter updates. Use Value: Eliminates need for separate EEPROM; uniform 4-kB erase ensures deterministic write time (<50 ms) for safety-critical configuration changes. | Use Scenario: Recording diagnostic event logs in a body control module exposed to under-hood temperatures up to +125 °C. IC Role / Device Role / Timing Role: High-temperature non-volatile data logger; leverages 32-kB block erase for efficient log rotation. Use Value: Rated operation at -40 °C to +125 °C ensures reliability in harsh environments; 350 ms typical 32-kB erase enables rapid log clearing without system interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q80DVSSIG | 8-Mbit density, 133 MHz max clock, Quad SPI support (not Dual-Output), no OTP register. | Better suited for larger firmware images; lacks hardware-secured serialization capability. | Select when higher capacity and quad interface are required; not drop-in due to different pinout and command set. |
| Micron MT25QL01GBBB8E12-0SIT | 1-Gbit density, 133 MHz, Octal DTR interface, built-in ECC, 1.7–2.0 V supply only. | Targeted at high-performance applications with error correction needs; incompatible voltage range for 3.3 V systems. | Choose for mission-critical systems needing ECC and higher bandwidth; requires redesign for voltage and interface compatibility. |
Compared with W25Q80DVSSIG and MT25QL01GBBB8E12-0SIT, the AT25DF011-XMHNGU-T offers optimal balance of low-power operation (200 nA), integrated OTP security, and industrial temperature support in a compact DFN package - making it uniquely suitable for cost-sensitive, battery-operated, and security-aware embedded designs where 1-Mbit capacity suffices.
Availability
AT25DF011-XMHNGU-T is available at Aetrix Electronics and suitable for secure firmware storage, IoT edge node boot memory, and industrial PLC configuration requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for AT25DF011-XMHNGU-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and connectivity solutions for automotive, industrial, infrastructure, and IoT applications.
The AT25DF011-XMHNGU-T belongs to Renesas' serial Flash memory product line, engineered for reliable, low-voltage, low-power code and data storage in space-constrained embedded systems with stringent security and longevity requirements.
FAQ
What is the maximum operating frequency supported by the AT25DF011-XMHNGU-T?
The AT25DF011-XMHNGU-T supports a maximum operating frequency of 104 MHz for all commands including Read Array (03h), Dual-Output Read (3Bh), and program/erase operations. This rating applies across the full industrial temperature range (-40 °C to +85 °C) and voltage range (1.65 V to 3.6 V), enabling high-throughput firmware loading and real-time data access in performance-sensitive applications.
Does the AT25DF011-XMHNGU-T support Dual-Output Read, and how does it differ from standard SPI Read?
Yes, the AT25DF011-XMHNGU-T supports Dual-Output Read using opcode 3Bh. Unlike standard Read Array (03h), which outputs data only on SO, Dual-Output Read uses both SI and SO pins as outputs (I/O0/I/O1), delivering two bits per SCK falling edge. This doubles effective read bandwidth without increasing clock frequency - reducing firmware load time by up to 50% compared to 03h at the same SCK rate.
What is the purpose and structure of the OTP Security Register in the AT25DF011-XMHNGU-T?
The AT25DF011-XMHNGU-T includes a 128-byte One-Time Programmable (OTP) Security Register divided into two 64-byte sections: the first is factory-programmed with a unique device identifier (ESN), and the second is user-programmable for keys, certificates, or custom serialization data. Once programmed, OTP bytes cannot be altered - providing hardware-enforced security for device authentication, secure boot, and firmware integrity verification.
How does the AT25DF011-XMHNGU-T handle power-down modes, and what are their current draw specifications?
The AT25DF011-XMHNGU-T offers two ultra-low-power states: Deep Power-Down draws 5 µA (typical), and Ultra-Deep Power-Down draws just 200 nA (typical). Both are entered via dedicated commands (B9h and 79h respectively) and exited with standard CS toggling. These modes are essential for battery-powered applications requiring multi-year standby, such as smart utility meters and wireless sensors.
What erase block sizes are available on the AT25DF011-XMHNGU-T, and why is this flexibility important?
The AT25DF011-XMHNGU-T supports four erase granularities: 256-byte page, 4-kB block, 32-kB block, and full-chip. This flexibility allows precise erasure of individual firmware modules or data logs without affecting unrelated memory regions - improving memory utilization efficiency, reducing wear on unused sectors, and enabling deterministic update times (e.g., 50 ms for 4-kB block erase) critical for real-time systems.
AT25DF011-XMHNGU-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 3.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF011-XMHNGU-T FAQ
1.How can I place an order for AT25DF011-XMHNGU-T through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF011-XMHNGU-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF011-XMHNGU-T reliable?
The price and inventory of AT25DF011-XMHNGU-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF011-XMHNGU-T is usually 5 days.
3.What payment methods are accepted for AT25DF011-XMHNGU-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF011-XMHNGU-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF011-XMHNGU-T?
AT25DF011-XMHNGU-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF011-XMHNGU-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF011-XMHNGU-T?
For technical support, including AT25DF011-XMHNGU-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF011-XMHNGU-T requirements.
6.How does Aetrix verify that AT25DF011-XMHNGU-T is sourced from the original manufacturer or authorized distributors?
All AT25DF011-XMHNGU-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF011-XMHNGU-T meets industry standards.
7.What is the process for return or replacement of AT25DF011-XMHNGU-T?
All AT25DF011-XMHNGU-T units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF011-XMHNGU-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF011-XMHNGU-T part is unused and in its original packaging.
Return procedure for AT25DF011-XMHNGU-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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