Renesas AT25DF011-XMHN-T
- Part No.:
- AT25DF011-XMHN-T
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF011-XMHN-T.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,034
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Product details
Overview
AT25DF011-XMHN-T from Renesas Electronics is a 1-Mbit SPI serial Flash memory IC designed for code shadowing and embedded data storage in resource-constrained systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock frequency, and features 6 ns clock-to-output timing - enabling fast boot and firmware update in IoT edge nodes and portable medical devices.
For engineers reviewing the AT25DF011-XMHN-T datasheet, AT25DF011-XMHN-T pinout, AT25DF011-XMHN-T application, or AT25DF011-XMHN-T equivalent, key selection criteria include its 256-byte page erase granularity, OTP security register with factory-unique ID, ultra-deep power-down current (200 nA), and support for -40 °C to +125 °C operation at ≥1.7 V.
Technical Context
The AT25DF011-XMHN-T implements a flexible hierarchical erase architecture with three granularities: 256-byte pages, uniform 4-kByte blocks, and uniform 32-kByte blocks - optimized to minimize wasted space in mixed code+data layouts. Its Dual-Output Read mode uses both SI and SO pins as outputs, doubling read throughput versus standard SPI Read Array (03h) at up to 50 MHz.
Command execution is controlled via an 8-bit opcode followed by address/data bytes (MSB-first), with hardware write protection enabled via the active-low WP pin and optional software locking via Status Register bits. The device integrates a 128-byte OTP security register (64 bytes factory-programmed unique ID + 64 bytes user-programmable) and supports JEDEC-standard Manufacturer/Device ID reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Mbit (128 KBytes) - sufficient for bootloader, firmware image, and configuration data in compact MCU-based designs. |
| Supply Voltage | 1.65 V to 3.6 V - enables direct interface with 1.8 V and 3.3 V logic without level shifters. |
| Max Clock Frequency | 104 MHz - supports high-speed read and command execution for time-critical boot sequences. |
| Read Latency | 6 ns clock-to-output (tV) - minimizes wait states during instruction fetch from external Flash. |
| Erase Granularity | 256-byte page / 4-kByte block / 32-kByte block - allows precise over-the-air firmware patching without erasing full application sections. |
| Power-Down Current | 200 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes and wearables. |
| Data Retention | 20 years - ensures long-term reliability of stored calibration data and device identity across product lifetime. |
| Endurance | 100,000 program/erase cycles (–40 °C to +85 °C) - supports frequent field firmware updates in industrial controllers. |
Pinout & Package
AT25DF011-XMHN-T is packaged in an 8-lead TSSOP (Thin Shrink Small Outline Package), measuring 4.4 mm × 3.0 mm × 1.2 mm, with gull-wing leads and standard 0.65 mm pitch - compatible with automated SMT assembly and offering improved thermal performance over SOIC in space-constrained PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select | Active-low enable signal; must transition low-to-high to complete any command, including self-timed erase/program operations. |
| SCK | Serial Clock | Input clock controlling data latching (rising edge) and output timing (falling edge); supports up to 104 MHz for high-throughput reads. |
| SI (I/O0) | Serial Input / Dual-Read Output | Primary command/address/data input; becomes bidirectional I/O0 during Dual-Output Read (3Bh) to deliver LSB data alongside SO (I/O1). |
| SO (I/O1) | Serial Output / Dual-Read Output | Standard read data output; remains active I/O1 during Dual-Output Read to deliver MSB data synchronized with I/O0. |
| WP | Write Protect | Hardware lock control; active-low signal that disables status register writes and sector protection changes when asserted. |
| HOLD | Communication Pause | Active-low pin that suspends ongoing SPI transfers without deselecting CS or resetting internal state - useful during interrupt servicing. |
| VCC | Power Supply | Single supply input (1.65–3.6 V); powers all internal logic and memory array - no auxiliary voltage required for programming/erasing. |
| GND | Ground Reference | System ground return path; must be low-impedance and co-located with VCC decoupling capacitor for stable read/write margins. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output Read Mode | Enables 2-bit-per-clock read throughput using SI and SO simultaneously - cuts read time by ~50% vs. standard SPI Read Array at same clock rate. |
| Flexible Erase Architecture | Supports 256-byte page, 4-kByte block, and 32-kByte block erases - eliminates need for external EEPROM in mixed-code-and-data applications. |
| OTP Security Register | 128-byte one-time programmable area with 64-byte factory-unique ID - provides tamper-resistant device serialization and secure key storage. |
| Ultra-Deep Power-Down | 200 nA typical standby current with full register retention - ideal for battery-powered devices requiring multi-year shelf life. |
| Temperature Range | Rated for –40 °C to +125 °C at 1.7–3.6 V - qualified for under-hood automotive modules and industrial motor drives. |
| JEDEC ID Compatibility | Standard Manufacturer/Device ID read (90h command) - ensures interoperability with generic Flash programming tools and bootloader frameworks. |
Applications
| Industrial PLC Firmware Storage | Medical Wearable Bootloader |
|---|---|
Use Scenario: Storing firmware images and calibration tables in programmable logic controllers deployed in factory automation environments with wide ambient temperature swings. IC Role / Device Role / Timing Role: Non-volatile code storage and runtime parameter retention; supports fast reflash via SPI during maintenance windows. Use Value: 4-kByte block erase enables incremental firmware patching without full chip erase; 100,000-cycle endurance ensures >10 years of field updates at quarterly intervals. | Use Scenario: Hosting secure bootloader and encrypted sensor configuration in FDA-cleared wearable ECG monitors powered by coin-cell batteries. IC Role / Device Role / Timing Role: Trusted boot source with hardware-enforced write protection; OTP register stores cryptographic keys and device-specific identifiers. Use Value: 200 nA ultra-deep power-down extends 5-year battery life; 20-year data retention guarantees calibration persistence across product lifecycle. |
| Automotive Telematics Module | Smart Home Hub Configuration |
Use Scenario: Storing OTA update packages and vehicle-specific configuration profiles in LTE-connected telematics control units operating under hood conditions. IC Role / Device Role / Timing Role: High-reliability data archive with dual-read acceleration for rapid firmware validation prior to installation. Use Value: –40 °C to +125 °C rating meets AEC-Q100 Grade 2 requirements; 6 ns tV latency reduces boot verification time by 12% vs. legacy 25 MHz Flash. | Use Scenario: Maintaining user preferences, network credentials, and firmware version history in Wi-Fi-enabled smart home hubs with intermittent power. IC Role / Device Role / Timing Role: Persistent settings storage with hardware WP pin lock to prevent accidental corruption during power brownouts. Use Value: Hardware-controlled sector protection prevents overwrite of critical Wi-Fi credentials; 256-byte page erase allows atomic updates of individual preference fields. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q80DVSSIG | 8-Mbit density, 133 MHz max clock, Quad SPI support (not Dual-Output), 1.65–3.6 V supply. | Higher capacity and faster clock but lacks Dual-Output Read; requires different command set and driver adaptation. | Select when >1 Mbit storage or Quad SPI bandwidth is required; not drop-in due to command and timing differences. |
| Micron MT25QL064ABA8ESF-0SIT | 64-Mbit density, 133 MHz, Octal DTR interface, 1.7–2.0 V or 2.7–3.6 V dual supply range. | Designed for high-bandwidth applications (e.g., XIP execution); incompatible voltage range below 1.7 V and no ultra-deep power-down mode. | Choose for high-performance embedded Linux boot storage; unsuitable for 1.65 V systems or ultra-low-power use cases. |
Compared with W25Q80DVSSIG and MT25QL064ABA8ESF-0SIT, the AT25DF011-XMHN-T offers optimal balance of low-voltage operation (1.65 V), ultra-low power consumption (200 nA), and Dual-Output Read acceleration - making it uniquely suited for cost-sensitive, battery-operated, and thermally demanding embedded applications where 1 Mbit suffices.
Availability
AT25DF011-XMHN-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical wearable bootloader hosting, automotive telematics module configuration, and smart home hub persistent settings requiring stable component supply across extended production lifecycles.
Supply support for AT25DF011-XMHN-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.
The AT25DF011-XMHN-T belongs to Renesas' AT25DF family of SPI Flash memories, engineered specifically for reliable, low-voltage, low-power code and data storage in space- and energy-constrained embedded systems.
FAQ
What is the maximum operating frequency supported by the AT25DF011-XMHN-T?
The AT25DF011-XMHN-T supports a maximum operating frequency of 104 MHz for most commands including Page Erase, Block Erase, and Chip Erase. For standard Read Array (03h), the limit is 33 MHz; Dual-Output Read (3Bh) operates up to 50 MHz. These values are specified across the full temperature range of –40 °C to +85 °C and –40 °C to +125 °C per the official Renesas DS-AT25DF011-032 Rev. J datasheet.
Does the AT25DF011-XMHN-T support Dual-Output Read, and how does it improve performance?
Yes, the AT25DF011-XMHN-T supports Dual-Output Read using the 3Bh opcode, which configures both SI (I/O0) and SO (I/O1) pins as outputs to deliver two bits per clock cycle. This doubles effective read throughput compared to standard SPI Read Array (03h) at the same clock rate - reducing firmware load time in boot-critical applications. The feature is fully documented in Section 5.1 and Figure 9 of the AT25DF011-XMHN-T datasheet.
What is the purpose and structure of the OTP Security Register in the AT25DF011-XMHN-T?
The AT25DF011-XMHN-T includes a 128-byte One-Time Programmable (OTP) Security Register: 64 bytes are factory-programmed with a unique device identifier, and 64 bytes are user-programmable for secure key storage or system-level ESN. Once written, OTP bytes cannot be altered - providing hardware-enforced immutability for cryptographic keys and device authentication. Programming is performed via the 4Bh command as defined in Section 10.1 of the AT25DF011-XMHN-T datasheet.
How does the AT25DF011-XMHN-T handle power-down modes, and what are their current draw specifications?
The AT25DF011-XMHN-T offers two ultra-low-power states: Deep Power-Down (5 µA typical) and Ultra-Deep Power-Down (200 nA typical). Both retain all register contents and require specific commands (B9h and 79h respectively) to enter, and dedicated wake-up sequences (ABh and 79h + CS toggle) to exit. These modes are validated across –40 °C to +125 °C and enable multi-year battery operation in always-on edge sensors - details are in Sections 12.3–12.6 of the AT25DF011-XMHN-T datasheet.
What package type is used for the AT25DF011-XMHN-T, and what are its mechanical dimensions?
The AT25DF011-XMHN-T uses an 8-lead TSSOP (Thin Shrink Small Outline Package) with gull-wing leads, measuring 4.4 mm × 3.0 mm × 1.2 mm and 0.65 mm lead pitch. This package is explicitly listed in the Ordering Information table (Section 16) and illustrated in Figure 2 of the AT25DF011-XMHN-T datasheet. It provides better thermal dissipation and smaller footprint than SOIC while maintaining compatibility with standard SMT reflow processes.
AT25DF011-XMHN-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 3.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF011-XMHN-T FAQ
1.How can I place an order for AT25DF011-XMHN-T through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF011-XMHN-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF011-XMHN-T reliable?
The price and inventory of AT25DF011-XMHN-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF011-XMHN-T is usually 5 days.
3.What payment methods are accepted for AT25DF011-XMHN-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF011-XMHN-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF011-XMHN-T?
AT25DF011-XMHN-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF011-XMHN-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF011-XMHN-T?
For technical support, including AT25DF011-XMHN-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF011-XMHN-T requirements.
6.How does Aetrix verify that AT25DF011-XMHN-T is sourced from the original manufacturer or authorized distributors?
All AT25DF011-XMHN-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF011-XMHN-T meets industry standards.
7.What is the process for return or replacement of AT25DF011-XMHN-T?
All AT25DF011-XMHN-T units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF011-XMHN-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF011-XMHN-T part is unused and in its original packaging.
Return procedure for AT25DF011-XMHN-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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