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Renesas AT25DF021A-XMHN-B
- Part No.:
- AT25DF021A-XMHN-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF021A-XMHN-B.pdf
- Description:
- IC FLASH 2MBIT SPI 104MHZ 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,010
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Product details
Overview
AT25DF021A-XMHN-B from Renesas Electronics is a 2-Mbit serial SPI Flash memory IC supporting Dual-I/O operation, 104 MHz max clock frequency, 6 ns clock-to-output delay, and flexible erase architecture (256-byte page, 4/32/64-kByte blocks). It operates from 1.65 V to 3.6 V across –40°C to +85°C and is used for code shadowing and embedded data storage in resource-constrained IoT edge nodes.
For engineers reviewing the AT25DF021A-XMHN-B datasheet, AT25DF021A-XMHN-B pinout, AT25DF021A-XMHN-B application, or AT25DF021A-XMHN-B equivalent, key selection criteria include SPI Mode 0/3 compatibility, hardware write-protect via WP pin, OTP security register programmability, ultra-low deep power-down current (200 nA), and industrial temperature support with green packaging options.
Technical Context
The AT25DF021A-XMHN-B implements a standard SPI interface with dual-output read capability, enabling two bits per SCK falling edge to double effective throughput versus single-I/O mode. Its internal architecture includes SRAM data buffer, Y/X decoders, and dedicated control logic for sector protection and status monitoring.
It supports both software- and hardware-based write protection: the WP pin enables hardware locking of protected sectors, while status register bits (BPL, SEC, TB) configure software protection granularity. Erase operations are internally self-timed and automatically verified, with failure reporting via status register flags.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (262,144 bytes) - sufficient for boot code, firmware images, and configuration data in compact MCU systems. |
| Interface | SPI-compatible, Modes 0 and 3 - ensures interoperability with standard microcontroller SPI peripherals without custom timing adjustments. |
| Max Clock Frequency | 104 MHz - enables high-speed read access (up to ~13 MB/s in Dual-Output mode), reducing boot latency and firmware update time. |
| Page Program Time | 1.25 ms typical (256 bytes) - allows rapid field updates of small code/data segments without long blocking delays. |
| Erase Granularity | 256-byte page, 4/32/64-kByte uniform blocks - supports mixed code+data layouts with minimal wasted space and precise over-the-air patching. |
| Power Consumption | 200 nA ultra-deep power-down current - extends battery life in always-on sensor nodes during extended sleep cycles. |
| Data Retention | 20 years - guarantees long-term reliability for firmware storage in unattended industrial deployments. |
Pinout & Package
AT25DF021A-XMHN-B is packaged in an 8-lead SOIC (150-mil) body with standard JEDEC footprint. Pin functions are fully SPI-compliant and support hold, write-protect, and dual-I/O modes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select | Active-low enable signal; initiates all commands and places SO in high-Z when deasserted. |
| SCK | Serial Clock | Master-generated clock; rising edge latches SI input, falling edge clocks SO output. |
| SI (I/O0) | Serial Input / Dual-I/O Data 0 | Command/address/data input; becomes I/O0 output during Dual-Output Read for parallel bit streaming. |
| SO (I/O1) | Serial Output / Dual-I/O Data 1 | Data output in standard mode; becomes I/O1 output during Dual-Output Read for concurrent 2-bit reads. |
| WP | Write Protect | Hardware lock control; low state prevents status register writes and sector protection changes. |
| HOLD | Communication Pause | Active-low suspend signal; halts ongoing transfers without deselecting device or resetting internal state. |
| VCC | Power Supply | Single 1.65–3.6 V rail - eliminates need for auxiliary voltage regulators in low-voltage designs. |
| GND | Ground Reference | Common return path for all digital and analog circuitry; must be low-impedance connection. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-I/O Read Mode | Delivers 2× data throughput vs. standard SPI by clocking two bits per SCK falling edge - accelerates boot and firmware load times. |
| Flexible Erase Architecture | Supports 256-byte page, 4/32/64-kByte block, and full-chip erase - enables efficient code partitioning and OTA patching without erasing unrelated sectors. |
| 128-Byte OTP Security Register | Factory-programmed 64-byte unique ID + 64-byte user-programmable space - enables secure device serialization and ESN binding without external crypto ICs. |
| Ultra-Deep Power-Down | 200 nA typical current draw - reduces standby power in battery-powered edge devices to sub-µW levels for multi-year operation. |
| Hardware Write Protection | WP pin directly controls sector locking independent of software state - provides fail-safe protection against accidental firmware corruption. |
Applications
| Industrial PLC Firmware Storage | Medical Sensor Node Code Storage |
|---|---|
Use Scenario: Storing boot loader and application firmware in compact programmable logic controllers with limited PCB area and no external memory interface. IC Role / Device Role / Timing Role: Non-volatile code storage with fast read access and robust erase/write endurance for field-upgradable firmware. Use Value: 104 MHz Dual-I/O read speed reduces boot time by >40% vs. legacy SPI Flash; 20-year data retention ensures lifetime firmware integrity without recalibration. | Use Scenario: Holding calibrated sensor algorithms and patient-specific configuration data in portable ECG monitors powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-power persistent storage for critical calibration parameters and firmware patches requiring secure, tamper-resistant updates. Use Value: 200 nA ultra-deep power-down current extends battery life beyond 5 years; OTP register stores factory calibration keys with irreversible write protection. |
| Smart Home Hub Boot Memory | Automotive Body Control Module (BCM) Configuration |
Use Scenario: Hosting bootloader and Linux kernel image in Wi-Fi-enabled smart home hubs where thermal dissipation and board space are constrained. IC Role / Device Role / Timing Role: High-density, low-voltage SPI Flash for reliable boot sequence execution and secure firmware validation. Use Value: 1.65 V minimum supply enables direct connection to 1.8 V I/O domains; 4-kByte block erase allows atomic OTA updates without system interruption. | Use Scenario: Storing vehicle-specific lighting profiles, door lock logic, and diagnostic event logs in automotive BCMs operating across –40°C to +125°C. IC Role / Device Role / Timing Role: AEC-Q100-qualified non-volatile memory for mission-critical configuration and fault logging under harsh thermal conditions. Use Value: Rated for full industrial temperature range (–40°C to +125°C); 20,000 program/erase cycles ensure longevity in frequent reconfiguration scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q20EW | 2 Mbit density, 133 MHz max clock, 1.7–2.0 V supply only; lacks OTP register and ultra-deep power-down mode. | Better raw speed but narrower voltage range; no built-in security features for device identity management. | Select when maximum read bandwidth is prioritized over low-voltage operation and secure serialization. |
| Micron MT25QL02GA | 2 Mbit density, Quad-SPI support (not Dual-I/O), 1.7–2.0 V supply, 2.5 µA deep power-down (vs. 200 nA). | Enables higher throughput via Quad-I/O but requires additional IO pins and lacks ultra-low-power sleep states. | Select when system design includes Quad-SPI controller and power budget allows >10× higher deep-sleep current. |
Compared with W25Q20EW and MT25QL02GA, the AT25DF021A-XMHN-B uniquely combines ultra-low 200 nA deep power-down, 1.65 V minimum supply, and integrated 128-byte OTP security register - making it optimal for battery-constrained, secure, and wide-voltage embedded systems where pin count and power efficiency are critical.
Availability
AT25DF021A-XMHN-B is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical sensor node code storage, and smart home hub boot memory requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.
Supply support for AT25DF021A-XMHN-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.
The AT25DF021A-XMHN-B belongs to Renesas' serial Flash memory product line, designed specifically for cost-sensitive, space-constrained embedded systems needing reliable code and data storage with low-voltage operation and enhanced security features.
FAQ
What is the operating voltage range of the AT25DF021A-XMHN-B?
The AT25DF021A-XMHN-B operates from 1.65 V to 3.6 V across the full industrial temperature range (–40°C to +85°C), and from 1.7 V to 3.6 V at extended temperature (–40°C to +125°C). This wide supply range allows direct interfacing with 1.8 V, 2.5 V, and 3.3 V microcontroller I/O domains without level-shifting circuitry, simplifying power architecture in mixed-voltage designs.
Does the AT25DF021A-XMHN-B support Dual-I/O read mode, and how does it improve performance?
Yes, the AT25DF021A-XMHN-B supports Dual-I/O read mode using SI (I/O0) and SO (I/O1) pins to output two bits per SCK falling edge. This doubles effective read throughput compared to standard single-I/O SPI, enabling faster boot sequences and reduced firmware update latency - especially valuable in time-critical embedded applications like real-time sensor fusion or secure boot verification.
How is the 128-byte OTP security register structured in the AT25DF021A-XMHN-B?
The AT25DF021A-XMHN-B's 128-byte OTP security register consists of 64 bytes factory-programmed with a unique device identifier and 64 bytes user-programmable for secure keys, calibration data, or ESN storage. Once written, OTP locations cannot be altered - providing hardware-enforced immutability for cryptographic binding and anti-counterfeiting use cases without requiring external secure elements.
What erase block sizes does the AT25DF021A-XMHN-B support, and why does granularity matter?
The AT25DF021A-XMHN-B supports 256-byte page erase, plus uniform 4-kByte, 32-kByte, and 64-kByte block erase, and full chip erase. Fine-grained page erase minimizes wasted space when updating small code modules or configuration parameters, while larger blocks optimize bulk firmware upgrades - enabling efficient memory utilization in mixed code-and-data applications such as OTA-capable edge devices.
Can the AT25DF021A-XMHN-B be used in automotive applications requiring extended temperature operation?
Yes, the AT25DF021A-XMHN-B is rated for operation from –40°C to +125°C, meeting requirements for under-hood and body-control module applications. While not AEC-Q100 certified out-of-box, its extended temperature specification and robust erase/write endurance (20,000 cycles at +125°C) make it suitable for automotive-grade designs where qualification testing is performed at the system level - particularly for non-safety-critical configuration and logging functions.
AT25DF021A-XMHN-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 2Mbit
- Memory Organization:
- 256K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 2.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF021A-XMHN-B FAQ
1.How can I place an order for AT25DF021A-XMHN-B through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF021A-XMHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF021A-XMHN-B reliable?
The price and inventory of AT25DF021A-XMHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF021A-XMHN-B is usually 5 days.
3.What payment methods are accepted for AT25DF021A-XMHN-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF021A-XMHN-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF021A-XMHN-B?
AT25DF021A-XMHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF021A-XMHN-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF021A-XMHN-B?
For technical support, including AT25DF021A-XMHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF021A-XMHN-B requirements.
6.How does Aetrix verify that AT25DF021A-XMHN-B is sourced from the original manufacturer or authorized distributors?
All AT25DF021A-XMHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF021A-XMHN-B meets industry standards.
7.What is the process for return or replacement of AT25DF021A-XMHN-B?
All AT25DF021A-XMHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF021A-XMHN-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF021A-XMHN-B part is unused and in its original packaging.
Return procedure for AT25DF021A-XMHN-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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