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Renesas AT25DF256-XMHN-B

Part No.:
AT25DF256-XMHN-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixAT25DF256-XMHN-B.pdf
Description:
IC FLASH 256KBIT SPI 8TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,674

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Product details

Overview

AT25DF256-XMHN-B from Renesas Electronics is a 256-Kbit serial SPI Flash memory IC designed for code shadowing and embedded data storage in resource-constrained systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read at up to 50 MHz, delivers 6 ns clock-to-output timing, and features flexible erase granularity (256-byte page, 4-kByte/32-kByte blocks) for mixed code+data applications.

For engineers reviewing the AT25DF256-XMHN-B datasheet, AT25DF256-XMHN-B pinout, AT25DF256-XMHN-B application, or AT25DF256-XMHN-B equivalent, key selection considerations include its ultra-low deep power-down current (5 µA), 100,000 program/erase endurance, OTP security register with factory-unique ID, and compatibility with industrial temperature range (-40 °C to +85 °C) under 1.7–3.6 V supply.

Technical Context

The AT25DF256-XMHN-B implements a standard SPI master-slave interface with dedicated CS, SCK, SI (I/O0), SO (I/O1), WP, and HOLD pins. Its dual-output read mode repurposes the SI pin as a second data output alongside SO, enabling two bits per clock cycle and doubling effective throughput versus standard single-output reads.

Internally, it uses a segmented memory architecture with uniform 4-kByte and 32-kByte erase blocks plus 256-byte page erase capability-optimized to minimize wasted space when isolating code modules or data segments. The device integrates hardware write protection via the WP pin and software-controlled status register locking for sector-level security.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256 Kbit (32 KByte) - sufficient for boot code, firmware patches, or configuration data in compact embedded systems.
Supply Voltage Range1.65 V to 3.6 V - enables direct interfacing with 1.8 V or 3.3 V microcontrollers without level-shifting.
Max Clock Frequency104 MHz (standard read); 50 MHz (Dual-Output Read) - balances speed and signal integrity in high-density PCB layouts.
Access Time (tV)6 ns - ensures tight timing margins for real-time code execution from flash in microcontroller-based designs.
Erase Granularity256-byte page / 4-kByte block / 32-kByte block / full chip - allows precise updates without disturbing adjacent firmware or calibration data.
Endurance & Retention100,000 program/erase cycles; 20-year data retention - validated for long-life industrial and automotive control applications.
Power-Down Current5 µA (Deep Power-Down); 200 nA (Ultra-Deep Power-Down) - extends battery life in always-on IoT edge nodes.

Pinout & Package

AT25DF256-XMHN-B is packaged in an 8-lead TSSOP (4.4 mm body width), pin-compatible with JEDEC-standard SOIC and UDFN variants. Pin functions are electrically identical across packages.

Pin/Terminal Circuit Role Design Meaning
CSChip Select inputActive-low enable; must transition low-to-high to complete any command, including self-timed erase/program operations.
SCKSerial clock inputDrives all data transfers; rising edge latches input (SI), falling edge clocks output (SO/I/O0); supports up to 104 MHz.
SI (I/O0)Serial input / Dual-output data lineStandard command/address/data input; becomes output during Dual-Output Read to deliver LSB of each byte with SO.
SO (I/O1)Serial output / Dual-output data lineStandard data output; remains active output during Dual-Output Read to deliver MSB of each byte with SI.
WPHardware write protect inputLow-active pin that locks protected sectors; internally pulled high; requires external tie to VCC if unused.
HOLDCommunication pause inputLow-active pin suspends ongoing SPI transfer without deselecting device or resetting internal state.
VCCPower supplySingle 1.65–3.6 V rail powers logic and memory array; no auxiliary voltage required for programming/erasing.
GNDGround referenceSystem ground return path; must be low-impedance to maintain signal integrity during fast read/write cycles.

Key Features

Feature Design Value
Dual-Output Read supportEnables 2-bit-per-cycle data transfer using SI+SO, doubling effective bandwidth over standard SPI read without increasing clock frequency.
Flexible erase architectureSupports 256-byte page, 4-kByte, 32-kByte, and full-chip erase - minimizes invalidation of unrelated code/data during field updates.
128-byte OTP Security RegisterContains 64 bytes factory-programmed unique ID + 64 bytes user-programmable space for ESN, keys, or calibration constants.
Ultra-low power modes5 µA Deep Power-Down and 200 nA Ultra-Deep Power-Down allow aggressive energy management in battery-powered devices.
Hardware + software protectionWP pin enables physical lock of protected sectors; status register bits allow fine-grained software-based write/erase blocking.

Applications

Industrial Control Firmware Storage IoT Edge Node Configuration

Use Scenario: Storing PLC firmware images and runtime configuration parameters in programmable logic controllers with limited board space.

IC Role / Device Role / Timing Role: Non-volatile code and data storage IC providing SPI-accessible boot image and persistent settings with fast random access.

Use Value: Page-erase capability enables over-the-air firmware patching without full reflash; 6 ns tV ensures deterministic boot timing.

Use Scenario: Holding sensor calibration coefficients, network credentials, and device-specific identifiers in battery-operated environmental monitors.

IC Role / Device Role / Timing Role: Secure, low-power configuration memory supporting encrypted credential storage in the OTP register and frequent parameter updates.

Use Value: 200 nA Ultra-Deep Power-Down extends multi-year battery life; factory-unique ID enables secure device onboarding.

Consumer Audio Device Boot Memory Automotive Body Control Module Data Log

Use Scenario: Hosting bootloader and DSP firmware in portable Bluetooth speakers requiring rapid startup and minimal BOM cost.

IC Role / Device Role / Timing Role: SPI Flash memory delivering verified boot code and audio processing binaries with dual-output read acceleration.

Use Value: 50 MHz Dual-Output Read reduces boot latency by ~40% vs. standard 03h read; 1.65 V min supply supports single-cell Li-ion operation.

Use Scenario: Recording fault codes, door/window status history, and lighting configuration in vehicle body control units.

IC Role / Device Role / Timing Role: Endurance-qualified data logger memory supporting frequent small writes and infrequent bulk erases in automotive environments.

Use Value: 100,000 program/erase cycles and -40 °C to +85 °C operation ensure reliability across vehicle lifetime and temperature extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Winbond W25Q256JVSIM3 V only (2.7–3.6 V), Quad SPI support, 256 Mbit density, no OTP registerBetter suited for high-bandwidth graphics or large firmware storage; lacks factory-unique ID and ultra-low power modesSelect when higher density and QSPI interface are required; avoid if 1.65 V operation or OTP security is mandatory.
Macronix MX25L25635FMI-08G3 V only (2.7–3.6 V), standard SPI only, 256 Mbit, no Dual-Output Read, 8 ms typical page programLower cost alternative for non-performance-critical firmware storage; lacks dual-read acceleration and ultra-deep power-downChoose for cost-sensitive applications where 6 ns tV and 200 nA power-down are not required.

Compared with W25Q256JVSIM and MX25L25635FMI-08G, the AT25DF256-XMHN-B uniquely combines 1.65 V operation, Dual-Output Read, OTP security, and nanoamp-level power-down-making it optimal for compact, battery-aware, and security-sensitive embedded systems.

Availability

AT25DF256-XMHN-B is available at Aetrix Electronics and suitable for industrial control firmware storage, IoT edge node configuration, consumer audio device boot memory, and automotive body control module data logging requiring stable component supply and long-term lifecycle support.

Supply support for AT25DF256-XMHN-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and IoT markets.

The AT25DF256-XMHN-B belongs to Renesas' serial Flash memory product line, engineered for efficient code+data co-storage in space- and power-constrained embedded systems with emphasis on flexibility, security, and low-voltage operation.

FAQ

What is the operating voltage range for the AT25DF256-XMHN-B?

The AT25DF256-XMHN-B operates from 1.65 V to 3.6 V across its full temperature range. At 1.65–1.7 V, operation is specified from –10 °C to +85 °C; at 1.7–3.6 V, it supports the extended industrial range of –40 °C to +85 °C. This wide supply range eliminates need for external voltage regulation in many battery-powered or mixed-voltage designs.

Does the AT25DF256-XMHN-B support Quad SPI mode?

No, the AT25DF256-XMHN-B does not support Quad SPI. It supports standard SPI (single I/O) and Dual-Output Read mode, which uses SI and SO pins simultaneously to output two bits per clock cycle. Quad SPI functionality is not implemented in this device's command set or pin mapping.

How is the OTP Security Register structured in the AT25DF256-XMHN-B?

The AT25DF256-XMHN-B includes a 128-byte OTP Security Register: 64 bytes are factory-programmed with a unique device identifier, and 64 bytes are user-programmable for ESN, cryptographic keys, or calibration data. Once programmed, OTP locations cannot be erased or rewritten, ensuring permanent, tamper-resistant storage.

What are the erase time specifications for the AT25DF256-XMHN-B?

The AT25DF256-XMHN-B specifies typical erase times of 1.5 ms for 256-byte page erase, 50 ms for 4-kByte block erase, and 350 ms for 32-kByte block erase. These values are measured under standard conditions (VCC = 3.0 V, TA = 25 °C) and include automatic erase verification and failure reporting.

Can the AT25DF256-XMHN-B be used in automotive applications?

The AT25DF256-XMHN-B is qualified for industrial temperature range (–40 °C to +85 °C) and meets RoHS compliance, but it is not AEC-Q100 qualified. It may be used in non-safety-critical automotive body electronics (e.g., lighting control, comfort systems) where full automotive qualification is not mandated, subject to system-level validation.

AT25DF256-XMHN-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
256Kbit
Memory Organization:
32K x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
8µs, 2.5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

AT25DF256-XMHN-B FAQ

1.How can I place an order for AT25DF256-XMHN-B through Aetrix?

Please submit a Request for Quotation (RFQ) for AT25DF256-XMHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT25DF256-XMHN-B reliable?

The price and inventory of AT25DF256-XMHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF256-XMHN-B is usually 5 days.

3.What payment methods are accepted for AT25DF256-XMHN-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF256-XMHN-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT25DF256-XMHN-B?

AT25DF256-XMHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT25DF256-XMHN-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT25DF256-XMHN-B?

For technical support, including AT25DF256-XMHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF256-XMHN-B requirements.

6.How does Aetrix verify that AT25DF256-XMHN-B is sourced from the original manufacturer or authorized distributors?

All AT25DF256-XMHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF256-XMHN-B meets industry standards.

7.What is the process for return or replacement of AT25DF256-XMHN-B?

All AT25DF256-XMHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF256-XMHN-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT25DF256-XMHN-B part is unused and in its original packaging.

Return procedure for AT25DF256-XMHN-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

AT25DF256-XMHN-B Tags

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