Renesas AT25DF256-XMHNGU-B
- Part No.:
- AT25DF256-XMHNGU-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF256-XMHNGU-B.pdf
- Description:
- IC FLASH 256KBIT SPI 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AT25DF256-XMHNGU-B from Renesas Electronics is a 256-Kbit serial SPI Flash memory IC designed for code shadowing and data storage in embedded systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock frequency, achieves 6 ns clock-to-output delay, and features uniform 4-kByte and 32-kByte block erase with 256-byte page erase - used in IoT edge nodes, industrial HMIs, and portable medical devices.
For engineers reviewing the AT25DF256-XMHNGU-B datasheet, AT25DF256-XMHNGU-B pinout, AT25DF256-XMHNGU-B application, or AT25DF256-XMHNGU-B equivalent, key selection criteria include dual-read throughput, ultra-deep power-down current (200 nA), OTP security register programmability, hardware write protection via WP pin, and compatibility with 8-lead SOIC, TSSOP, and 2×3 mm UDFN packages.
Technical Context
The AT25DF256-XMHNGU-B implements a dedicated SPI interface with dual-bit output capability using SI and SO pins simultaneously during Dual-Output Read (3Bh opcode), enabling 2× data throughput versus standard read. Its memory architecture supports hierarchical erasure - 256-byte pages, 4-kByte blocks, 32-kByte blocks, and full-chip - optimized for mixed code/data firmware layouts.
Internal logic includes status register byte 1 and byte 2 for configuration of block protection, deep power-down mode, and write enable state; OTP security register contains 64 bytes factory-programmed unique ID and 64 bytes user-programmable space; hardware locking is controlled by WP pin assertion and status register bits BPL and SEC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Kbit (32 KByte) - sufficient for boot code, firmware patches, and configuration data in resource-constrained microcontrollers. |
| Supply Voltage | 1.65 V to 3.6 V - enables direct interfacing with 1.8 V and 3.3 V host MCUs without level-shifting. |
| Max Clock Frequency | 104 MHz - supports high-speed read operations critical for real-time firmware loading and OTA update verification. |
| Read Latency | 6 ns clock-to-output (tV) - minimizes wait states during instruction fetch or data streaming in time-sensitive applications. |
| Erase Granularity | 256-byte page / 4-kByte block / 32-kByte block - allows precise firmware module updates without disturbing adjacent code or calibration data. |
| Power-Down Current | 200 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes and wearable devices. |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - meets industrial-grade reliability requirements for field-deployed equipment. |
Pinout & Package
AT25DF256-XMHNGU-B is packaged in an 8-lead SOIC (150-mil) per JEDEC MS-012, with lead finish Pb/Halide-free and RoHS compliance. Pin functions are electrically identical across SOIC, TSSOP, and UDFN variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select input | Active-low enable signal; must transition low-to-high between commands to terminate operations and enter standby. |
| SCK | Serial clock input | Controls data timing; rising edge latches SI, falling edge clocks SO; supports up to 104 MHz operation. |
| SI (I/O0) | Serial input / Dual-output bit 0 | Receives opcodes, addresses, and data; becomes output during Dual-Output Read (3Bh) to deliver LSB-aligned data stream. |
| SO (I/O1) | Serial output / Dual-output bit 1 | Delivers read data on falling SCK edge; remains output during Dual-Output Read to deliver MSB-aligned data stream. |
| WP | Hardware write protect input | Low-active pin that locks protected sectors when BPL=1; internally pulled high; requires external tie to VCC if unused. |
| HOLD | Communication pause input | Halts ongoing SPI transfer without deselecting device; requires CS asserted and SCK low to activate; internally pulled high. |
| VCC | Power supply | Single 1.65–3.6 V supply powers all internal logic, memory array, and I/O buffers - no auxiliary voltage required. |
| GND | Ground reference | System ground connection; forms return path for VCC current and establishes logic reference for all I/O signals. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output Read support | Enables 2-bit-per-clock data transfer using SI and SO pins, doubling effective read bandwidth over standard SPI read (0Bh/03h). |
| Flexible erase architecture | Supports 256-byte page, 4-kByte block, 32-kByte block, and full-chip erase - reduces wasted memory in mixed-code-and-data firmware partitions. |
| OTP Security Register | 128-byte register with 64-byte factory-unique ID and 64-byte user-programmable space for ESN, secure keys, or calibration constants. |
| Ultra-low power modes | 200 nA ultra-deep power-down and 5 µA deep power-down allow aggressive energy management in battery-powered endpoints. |
| Hardware + software protection | Combines WP pin control with status register BPL/SEC bits to lock sectors at hardware level while permitting fine-grained software configuration. |
Applications
| IoT Edge Node Firmware Storage | Industrial HMI Configuration Memory |
|---|---|
Use Scenario: Stores boot loader, application firmware, and OTA update images in battery-powered wireless sensors with limited PCB area. IC Role / Device Role / Timing Role: Non-volatile code storage IC providing fast read access and selective page/block erase for incremental firmware updates. Use Value: 6 ns tV latency and 104 MHz clock support reduce boot time; 256-byte page erase enables patch-level updates without full reflash. | Use Scenario: Holds display layout definitions, language strings, and user calibration settings in panel-mounted HMIs operating in harsh factory environments. IC Role / Device Role / Timing Role: Data storage Flash IC with hardware write protection to prevent accidental corruption during power cycling or ESD events. Use Value: WP pin + BPL bit ensures critical configuration remains locked; 100K endurance supports daily parameter adjustments over 10+ years. |
| Portable Medical Device Log Memory | Automotive Body Control Module Boot Code |
Use Scenario: Records patient session logs, sensor calibration history, and diagnostic timestamps in handheld ultrasound or glucose monitors. IC Role / Device Role / Timing Role: Low-power data logging Flash IC with ultra-deep power-down mode activated between measurement cycles. Use Value: 200 nA IDDQ enables multi-year battery life; 32-kByte block erase efficiently clears old log segments without affecting firmware partition. | Use Scenario: Stores primary boot code and safety-critical initialization routines in automotive BCMs requiring AEC-Q100 compliance (via Renesas qualification). IC Role / Device Role / Timing Role: Automotive-grade SPI Flash IC delivering deterministic read timing and robust erase/write verification. Use Value: Automatic program/erase failure reporting ensures integrity; 20-year data retention meets automotive lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q256JWEIQ | 3 V only (2.7–3.6 V), 256 Mbit density, Quad SPI support, no Dual-Output Read, 8-pin SOIC package | Higher density and quad interface suit larger firmware; lacks 1.65 V compatibility and dual-read optimization for low-latency streaming | Select when system uses 3.3 V exclusively and requires >256 Kbit capacity or QSPI bus utilization. |
| Macronix MX25L25635FMI-12G | 3 V only (2.7–3.6 V), 256 Mbit, standard SPI, 104 MHz max, 8-pin SOIC, no OTP register or ultra-deep power-down | Offers same speed and package but omits security register and ultra-low-power modes - simpler, lower-cost option where those features are unused | Select when design prioritizes cost and does not require unique ID serialization or sub-µA sleep current. |
Compared with W25Q256JWEIQ and MX25L25635FMI-12G, AT25DF256-XMHNGU-B uniquely combines 1.65 V operation, dual-output read, OTP security, and 200 nA ultra-deep power-down - making it optimal for compact, battery-powered, security-aware embedded systems where voltage flexibility and low-latency reads are essential.
Availability
AT25DF256-XMHNGU-B is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial HMI configuration memory, and portable medical device log memory requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for AT25DF256-XMHNGU-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT markets.
The AT25DF256 product line targets cost-sensitive, space-constrained embedded systems needing reliable, low-voltage serial Flash with flexible erase and enhanced security - especially where mixed code/data storage and ultra-low power consumption are critical.
FAQ
What is the maximum operating frequency supported by the AT25DF256-XMHNGU-B?
The AT25DF256-XMHNGU-B supports a maximum clock frequency of 104 MHz for most commands including Read Array (0Bh), Page Erase (81h), and Block Erase (20h/52h). This enables high-throughput data access and rapid firmware updates. The device maintains timing integrity across its full 1.65–3.6 V supply range and -40 °C to +85 °C temperature range, as verified in AC characteristics Table 13.4 of the official datasheet DS-AT25DF256-035 Rev.G.
Does the AT25DF256-XMHNGU-B support Dual-Output Read, and what is its benefit?
Yes, the AT25DF256-XMHNGU-B supports Dual-Output Read using opcode 3Bh, where both SI and SO pins act as outputs to deliver two bits per clock cycle. This doubles effective read bandwidth compared to standard single-output read (0Bh/03h), reducing firmware load time and improving real-time data streaming performance. The feature is fully compatible with SPI Modes 0 and 3 and requires no additional hardware beyond standard SPI wiring.
What is the purpose and structure of the OTP Security Register in the AT25DF256-XMHNGU-B?
The AT25DF256-XMHNGU-B includes a 128-byte One-Time Programmable (OTP) Security Register: 64 bytes are factory-programmed with a unique identifier for device serialization, and 64 bytes are user-programmable for storing secure keys, calibration data, or electronic serial numbers. Once programmed, OTP bytes cannot be erased or rewritten - ensuring permanent, tamper-resistant storage critical for authentication and traceability in regulated applications.
How does hardware write protection work on the AT25DF256-XMHNGU-B?
Hardware write protection on the AT25DF256-XMHNGU-B is controlled by the WP pin and status register bits BPL (Block Protect Lockdown) and SEC (Security Register Protection). When WP is driven low and BPL=1, sectors defined by status register bits BP2–BP0 become permanently locked against program/erase. The WP pin is internally pulled high, so it must be externally tied to GND to activate protection - preventing accidental writes during power transients or software faults.
What power-saving modes does the AT25DF256-XMHNGU-B offer, and how low is the current draw?
The AT25DF256-XMHNGU-B offers Deep Power-Down (5 µA typical) and Ultra-Deep Power-Down (200 nA typical) modes, entered via B9h and 79h opcodes respectively. These modes disable internal circuitry while retaining memory contents, enabling multi-year battery life in always-on endpoints. Exit is achieved with ABh (resume) or chip-select toggle (ultra-deep), with no reset required - preserving system state and minimizing wake-up latency for the AT25DF256-XMHNGU-B.
AT25DF256-XMHNGU-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 2.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF256-XMHNGU-B FAQ
1.How can I place an order for AT25DF256-XMHNGU-B through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF256-XMHNGU-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF256-XMHNGU-B reliable?
The price and inventory of AT25DF256-XMHNGU-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF256-XMHNGU-B is usually 5 days.
3.What payment methods are accepted for AT25DF256-XMHNGU-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF256-XMHNGU-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF256-XMHNGU-B?
AT25DF256-XMHNGU-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF256-XMHNGU-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF256-XMHNGU-B?
For technical support, including AT25DF256-XMHNGU-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF256-XMHNGU-B requirements.
6.How does Aetrix verify that AT25DF256-XMHNGU-B is sourced from the original manufacturer or authorized distributors?
All AT25DF256-XMHNGU-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF256-XMHNGU-B meets industry standards.
7.What is the process for return or replacement of AT25DF256-XMHNGU-B?
All AT25DF256-XMHNGU-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF256-XMHNGU-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF256-XMHNGU-B part is unused and in its original packaging.
Return procedure for AT25DF256-XMHNGU-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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