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Renesas AT25DF512C-XMHN-B
- Part No.:
- AT25DF512C-XMHN-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF512C-XMHN-B.pdf
- Description:
- IC FLASH 512KBIT SPI 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,125
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Product details
Overview
AT25DF512C-XMHN-B from Renesas Electronics is a 512-Kbit serial Flash memory IC with SPI interface, supporting dual-output read mode for enhanced throughput in embedded code and data storage applications. It operates from 1.65 V to 3.6 V, delivers 104 MHz max clock frequency, achieves 6 ns clock-to-output delay, and features flexible erase architecture (256-byte page, 4-kByte/32-kByte blocks, full chip).
For engineers reviewing the AT25DF512C-XMHN-B datasheet, AT25DF512C-XMHN-B pinout, AT25DF512C-XMHN-B application, or AT25DF512C-XMHN-B equivalent, key selection considerations include dual-read timing compliance, OTP security register usage, hardware write-protect via WP pin, ultra-deep power-down current (200 nA), and JEDEC-standard ID read capability.
Technical Context
The AT25DF512C-XMHN-B implements a standard SPI master-slave interface with support for Modes 0 and 3, using rising-edge input sampling and falling-edge output clocking. Its dual-output read mode repurposes SI as I/O0 alongside SO (I/O1) to deliver two bits per SCK cycle, doubling effective read bandwidth versus standard single-output reads.
Internal erase control logic enables granular nonvolatile memory management: page erase (256 B), uniform block erase (4 kByte and 32 kByte), and full-chip erase-all executed autonomously without host intervention. The device integrates dedicated status register byte 2 for enhanced protection configuration and OTP security register access via dedicated 9Bh/77h opcodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Kbit (64 KByte) - sufficient for boot code, firmware images, or configuration data in space-constrained MCU systems. |
| Supply Voltage Range | 1.65 V to 3.6 V - enables direct interfacing with low-voltage microcontrollers (e.g., ARM Cortex-M0+, RISC-V) without level-shifting. |
| Max Clock Frequency | 104 MHz - supports high-speed read operations up to 13 MB/s in dual-output mode, reducing firmware load latency. |
| Read Latency (tV) | 6 ns - ensures minimal wait states during instruction fetch or real-time data retrieval in time-critical applications. |
| Erase Granularity | 256-byte page / 4-kByte block / 32-kByte block - allows precise overwriting of code modules or data logs without disturbing adjacent sectors. |
| Power-Down Current | 200 nA (ultra-deep) / 5 µA (deep) - extends battery life in always-on IoT sensors or wearable devices during idle periods. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - suitable for field-upgradable firmware and long-lifecycle industrial deployments. |
Pinout & Package
AT25DF512C-XMHN-B is packaged in an 8-lead TSSOP (4.4 mm body width), RoHS-compliant, with 0.65 mm pitch. Pin functions are electrically and mechanically defined per JEDEC MO-153.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select | Active-low enable signal; must transition low before opcode, and high after command completion to terminate operation. |
| SCK | Serial Clock | Master-generated clock; rising edge latches SI data, falling edge clocks SO data-supports up to 104 MHz. |
| SI (I/O0) | Serial Input / Dual-Output Data 0 | Input for commands/addresses/data; becomes output (I/O0) during dual-output read to deliver LSB-aligned bit pairs with SO. |
| SO (I/O1) | Serial Output / Dual-Output Data 1 | Primary output for standard reads; remains active (I/O1) in dual-output mode to deliver MSB-aligned bit pairs with SI. |
| WP | Write Protect | Hardware lock control; low assertion enables sector protection override-used with status register bits for secure firmware lockdown. |
| HOLD | Communication Pause | Active-low pause signal; suspends ongoing transfers without deselecting CS-preserves internal state during interrupt servicing. |
| VCC | Power Supply | Single supply rail (1.65–3.6 V); powers all logic and memory arrays-no auxiliary voltage required for programming/erasing. |
| GND | Ground Reference | System return path; must be low-impedance and co-located with MCU ground to minimize noise coupling into SPI signals. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-output read mode (3Bh opcode) | Enables 2-bit-per-cycle data transfer, doubling effective read bandwidth vs. standard 03h/0Bh commands at same clock rate. |
| 128-byte OTP security register | Contains 64-byte factory-unique ID + 64-byte user-programmable space-supports device serialization and secure key storage. |
| Flexible erase architecture | Supports page (256 B), 4-kB, 32-kB, and full-chip erase-minimizes wasted space in mixed code+data storage partitions. |
| Hardware write protection via WP pin | Allows physical locking of protected sectors independent of software status register settings-critical for bootloader integrity. |
| Ultra-deep power-down (79h) | Reduces current to 200 nA typical-ideal for battery-powered nodes requiring multi-year shelf life or infrequent wake-up events. |
| JEDEC-standard ID read (9Fh) | Provides manufacturer (0x1F) and device (0x48) IDs in standardized format-enables automated BOM verification and firmware compatibility checks. |
Applications
| Firmware Boot Storage | IoT Sensor Configuration |
|---|---|
|
Use Scenario: Storing boot code and initial firmware image for ARM Cortex-M4 microcontrollers in industrial gateways. IC Role / Device Role / Timing Role: Nonvolatile storage for XIP-capable flash memory accessed via SPI during cold start and firmware updates. Use Value: 6 ns tV and 104 MHz clock support reduce boot time by >35% versus legacy 40 MHz SPI flash; 256-byte page erase enables atomic patch updates. |
Use Scenario: Holding calibrated sensor offsets, network credentials, and device-specific parameters in BLE-enabled environmental monitors. IC Role / Device Role / Timing Role: Persistent configuration store with secure OTP register for ESN and cryptographic keys. Use Value: 128-byte OTP register provides tamper-resistant identity binding; ultra-deep power-down (200 nA) extends coin-cell battery life to >5 years. |
| Medical Device Log Buffer | Automotive Body Control Module |
|
Use Scenario: Recording diagnostic events and calibration history in portable ultrasound units with strict data retention requirements. IC Role / Device Role / Timing Role: High-reliability data logger using 4-kB block erase for cyclic overwrite of timestamped event records. Use Value: 100,000 program/erase cycles and 20-year data retention meet IEC 62304 Class C software lifecycle mandates. |
Use Scenario: Storing lighting profiles, seat position maps, and HVAC presets in automotive interior control units operating across -40 °C to +85 °C. IC Role / Device Role / Timing Role: Automotive-grade SPI flash with extended temperature range (-40 °C to +85 °C at 1.7–3.6 V) and AEC-Q100 alignment. Use Value: Hardware WP pin enables permanent lockdown of safety-critical configuration sectors; 32-kB block erase simplifies OTA update partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q40EW | 4 Mbit density, 133 MHz max clock, no dual-output read; supports quad I/O but requires different command set. | Larger capacity suits complex GUI firmware; lacks dual-output optimization for bandwidth-constrained MCUs. | Select when higher density and quad interface are needed; avoid if dual-read timing or 512 Kbit footprint is mandatory. |
| Macronix MX25L4005 | 4 Mbit density, 75 MHz max clock, standard SPI only; no OTP register or ultra-deep power-down mode. | Lower cost for basic code storage; missing security and ultra-low-power features required for certified medical/IoT designs. | Choose for cost-sensitive consumer applications where OTP, deep power-down, and dual-read are not required. |
Compared with W25Q40EW and MX25L4005, the AT25DF512C-XMHN-B offers optimal balance of density, dual-read throughput, OTP security, and nanoamp-level power-down-making it preferred for resource-constrained, safety-aware, or battery-operated embedded systems.
Availability
AT25DF512C-XMHN-B is available at Aetrix Electronics and suitable for firmware boot storage, IoT sensor configuration, medical device log buffering, and automotive body control module applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for AT25DF512C-XMHN-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and connectivity solutions for automotive, industrial, infrastructure, and IoT markets.
The AT25DF512C-XMHN-B belongs to Renesas' serial Flash memory product line, engineered for reliable, low-voltage, high-speed code and data storage in space- and power-constrained embedded systems.
FAQ
What is the maximum operating frequency supported by the AT25DF512C-XMHN-B?
The AT25DF512C-XMHN-B supports a maximum operating frequency of 104 MHz for all command types including read, program, and erase operations. This applies to both standard Read Array (03h/0Bh) and Dual-Output Read (3Bh) modes, enabling high-throughput data access in bandwidth-sensitive applications.
Does the AT25DF512C-XMHN-B support dual-output read mode, and how is it enabled?
Yes, the AT25DF512C-XMHN-B supports dual-output read mode using the 3Bh opcode. When this command is issued, the SI pin functions as I/O0 (output) alongside SO as I/O1, allowing two bits of data to be clocked out per SCK falling edge-effectively doubling read bandwidth compared to single-output mode.
What is the purpose and structure of the OTP security register in the AT25DF512C-XMHN-B?
The AT25DF512C-XMHN-B includes a 128-byte OTP security register: 64 bytes are factory-programmed with a unique identifier, and 64 bytes are user-programmable. Accessed via 9Bh (program) and 77h (read) opcodes, it supports device serialization, ESN storage, and secure key binding in certified embedded systems.
How does hardware write protection work on the AT25DF512C-XMHN-B?
Hardware write protection on the AT25DF512C-XMHN-B is controlled by the WP pin. When WP is asserted low, it overrides software-based protection settings to lock designated memory sectors. This feature operates independently of the status register and provides physical assurance against accidental or malicious firmware corruption.
What power-saving modes are available on the AT25DF512C-XMHN-B, and what are their typical currents?
The AT25DF512C-XMHN-B offers Deep Power-Down (B9h, 5 µA typical) and Ultra-Deep Power-Down (79h, 200 nA typical). Both modes retain memory contents while minimizing quiescent current-enabling multi-year operation in battery-powered IoT endpoints and energy-harvesting sensor nodes.
AT25DF512C-XMHN-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 512Kbit
- Memory Organization:
- 64K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 3.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF512C-XMHN-B FAQ
1.How can I place an order for AT25DF512C-XMHN-B through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF512C-XMHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF512C-XMHN-B reliable?
The price and inventory of AT25DF512C-XMHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF512C-XMHN-B is usually 5 days.
3.What payment methods are accepted for AT25DF512C-XMHN-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF512C-XMHN-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF512C-XMHN-B?
AT25DF512C-XMHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF512C-XMHN-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF512C-XMHN-B?
For technical support, including AT25DF512C-XMHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF512C-XMHN-B requirements.
6.How does Aetrix verify that AT25DF512C-XMHN-B is sourced from the original manufacturer or authorized distributors?
All AT25DF512C-XMHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF512C-XMHN-B meets industry standards.
7.What is the process for return or replacement of AT25DF512C-XMHN-B?
All AT25DF512C-XMHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF512C-XMHN-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF512C-XMHN-B part is unused and in its original packaging.
Return procedure for AT25DF512C-XMHN-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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