Renesas AT25DF512C-XMHN-T
- Part No.:
- AT25DF512C-XMHN-T
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF512C-XMHN-T.pdf
- Description:
- IC FLASH 512KBIT SPI 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AT25DF512C-XMHN-T from Renesas Electronics is a 512-Kbit serial Flash memory IC designed for code shadowing and data storage in embedded systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3, delivers 104 MHz max clock frequency, achieves 6 ns clock-to-output delay, and features dual-output read for enhanced throughput.
For engineers reviewing the AT25DF512C-XMHN-T datasheet, AT25DF512C-XMHN-T pinout, AT25DF512C-XMHN-T application, or AT25DF512C-XMHN-T equivalent, key selection criteria include its flexible erase architecture (256-byte page / 4-kB & 32-kB blocks), OTP security register (128 bytes), ultra-deep power-down current (200 nA typical), and JEDEC-standard ID read capability.
Technical Context
The AT25DF512C-XMHN-T implements a SPI-compatible serial interface with hardware-controlled write protection via the WP pin and suspend/resume capability via the HOLD pin. Its command set includes dedicated opcodes for dual-output read (3Bh), page program (02h), and multiple block erase sizes (20h, 52h, D8h).
Internally, it uses a segmented memory array with uniform 4-kB and 32-kB erase blocks plus 256-byte page erase granularity-enabling efficient co-location of code modules and data segments without wasted space. The device integrates a two-byte status register with WIP, WEL, BP, and SRWD bits for real-time operation monitoring and protection control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Kbit (64 KB) organized as 256-byte pages across 256 pages |
| Supply Voltage | 1.65 V – 3.6 V - single supply enables direct interfacing with 1.8 V and 3.3 V logic domains |
| Max Clock Frequency | 104 MHz - supports high-speed read access with minimal latency in boot and firmware update paths |
| Read Latency | 6 ns clock-to-output (tV) - ensures tight timing margins for real-time code execution from flash |
| Erase Granularity | 256-byte page / 4-kB block / 32-kB block / full chip - enables fine-grained firmware patching and data logging |
| Power-Down Current | 200 nA ultra-deep power-down (typical) - critical for battery-powered IoT endpoints requiring multi-year standby |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - suitable for field-upgradable industrial controllers |
Pinout & Package
AT25DF512C-XMHN-T is packaged in an 8-lead SOIC (150-mil) with standard JEDEC footprint and pinout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select | Active-low enable signal; initiates all commands and places SO in high-Z when deasserted |
| SCK | Serial Clock | Master-generated clock; rising edge latches SI data, falling edge clocks SO data |
| SI (I/O0) | Serial Input / Dual-Output Data Line 0 | Command/address/data input; becomes output during dual-output read (3Bh) for parallel bit streaming |
| SO (I/O1) | Serial Output / Dual-Output Data Line 1 | Data output in standard read; remains active output during dual-output read to deliver second bit per cycle |
| WP | Write Protect | Hardware lock control; low assertion enables sector protection independent of software commands |
| HOLD | Hold Request | Pauses ongoing SPI transfer without deselecting CS; maintains internal state during host arbitration delays |
| VCC | Power Supply | Single 1.65–3.6 V rail powers core logic, memory array, and I/O buffers - no charge pump required |
| GND | Ground Reference | Common return path for VCC and all signal currents; must be low-impedance for stable timing and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output Read Mode | Enables 2-bit-per-clock-cycle data transfer using SI+SO pins, doubling effective read bandwidth vs. standard SPI read (03h/0Bh) |
| Flexible Erase Architecture | Supports 256-byte page erase for dynamic data updates and 4-kB/32-kB block erase for firmware partition management |
| OTP Security Register | 128-byte one-time programmable area: 64 bytes factory-unique ID + 64 bytes user-programmable for ESN or keys |
| Hardware Write Protection | WP pin provides physical lock override for protected sectors - immune to software corruption or reset glitches |
| Ultra-Low Power States | 200 nA ultra-deep power-down and 5 µA deep power-down enable energy harvesting and coin-cell applications |
Applications
| Industrial PLC Firmware Storage | Medical Sensor Data Logger |
|---|---|
|
Use Scenario: Storing boot firmware and field-upgradable control algorithms in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile code storage with fast read access (104 MHz) and deterministic 6 ns tV for deterministic boot timing. Use Value: Uniform 4-kB block erase allows safe in-field firmware patches without disrupting adjacent control routines. |
Use Scenario: Capturing time-stamped physiological measurements in portable diagnostic devices powered by primary batteries. IC Role / Device Role / Timing Role: Low-power data buffer with 200 nA ultra-deep power-down between sampling intervals. Use Value: 256-byte page erase enables efficient overwrite of oldest sensor records without erasing entire log partitions. |
| Automotive Infotainment Boot Memory | Smart Home Gateway Configuration Store |
|
Use Scenario: Holding bootloader and secure boot manifest in automotive head units operating across -40 °C to +85 °C. IC Role / Device Role / Timing Role: SPI-connected trusted storage with JEDEC-standard manufacturer/device ID verification at power-on. Use Value: OTP security register stores immutable device identity for secure boot chain validation. |
Use Scenario: Persisting Wi-Fi credentials, OTA update metadata, and user preferences in battery-backed smart home hubs. IC Role / Device Role / Timing Role: Reliable configuration store with hardware WP pin preventing accidental overwrite during firmware updates. Use Value: Dual-output read accelerates loading of encrypted configuration blobs during rapid boot sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q40EW | 4-Mbit density (8× larger), 133 MHz max clock, no dual-output read mode, 100 µA deep power-down | Better suited for larger firmware images; lacks dual-output bandwidth boost and ultra-low 200 nA sleep current | Select when higher density and faster clock are prioritized over ultra-low power and dual-read optimization |
| Micron MT25QL01G | 1-Gbit density, 133 MHz, quad I/O support, 2.5 µA deep power-down, no 256-byte page erase | Designed for high-throughput quad-SPI systems; requires different command set and layout changes | Choose for scalable designs needing quad interface and future-proof density, not drop-in replacement |
Compared with W25Q40EW and MT25QL01G, the AT25DF512C-XMHN-T offers unique value in ultra-low-power embedded nodes requiring precise 512-Kbit capacity, dual-output read acceleration, and 256-byte page-level data management - without demanding quad-SPI complexity or excessive density overhead.
Availability
AT25DF512C-XMHN-T is available at Aetrix Electronics and suitable for industrial control, medical diagnostics, automotive infotainment, and smart home gateway applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for AT25DF512C-XMHN-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT markets.
The AT25DF512C-XMHN-T belongs to Renesas' serial Flash memory product line, engineered specifically for cost-sensitive, low-power embedded systems needing reliable code shadowing and flexible data storage with minimal board space and power budget.
FAQ
What is the maximum operating frequency and corresponding clock-to-output delay for the AT25DF512C-XMHN-T?
The AT25DF512C-XMHN-T supports a maximum operating frequency of 104 MHz. Its clock-to-output delay (tV) is specified at 6 ns under standard conditions. This timing enables high-speed sequential reads ideal for boot code execution and real-time firmware access. The 6 ns parameter is measured from SCK falling edge to valid data on SO (or SI/SO in dual-output mode), ensuring predictable timing in timing-critical embedded applications where the AT25DF512C-XMHN-T is deployed.
Does the AT25DF512C-XMHN-T support dual-output read, and how does it improve performance?
Yes, the AT25DF512C-XMHN-T supports dual-output read using opcode 3Bh, where both SI and SO pins act as data outputs. This mode transfers two bits per SCK cycle, effectively doubling read throughput compared to standard single-output read (03h/0Bh). For example, at 50 MHz dual-output clock rate, the device achieves equivalent 100 Mbps data rate - accelerating firmware loading and configuration retrieval in resource-constrained systems using the AT25DF512C-XMHN-T.
What erase granularities does the AT25DF512C-XMHN-T support, and why does that matter for firmware updates?
The AT25DF512C-XMHN-T supports four erase granularities: 256-byte page, 4-kB block, 32-kB block, and full-chip. This flexibility allows targeted firmware patches (e.g., updating only a driver module in a 256-byte page) without erasing unrelated code sections. In contrast, coarse-grained flash would waste space or require complex wear-leveling. For field-upgradable devices using the AT25DF512C-XMHN-T, this means faster, safer, and more storage-efficient updates.
How does the OTP security register in the AT25DF512C-XMHN-T function, and what is its capacity?
The AT25DF512C-XMHN-T includes a 128-byte One-Time Programmable (OTP) security register: 64 bytes are factory-programmed with a unique identifier, and 64 bytes are user-programmable for ESN, cryptographic keys, or calibration data. Once written, OTP bits cannot be altered - providing tamper-resistant device identity and secure credential storage. This feature is essential for authentication, licensing, and secure boot implementations relying on the AT25DF512C-XMHN-T as trusted non-volatile storage.
What power-saving modes does the AT25DF512C-XMHN-T offer, and what are their typical current draws?
The AT25DF512C-XMHN-T offers two ultra-low-power states: Deep Power-Down (5 µA typical) and Ultra-Deep Power-Down (200 nA typical). Both are entered via dedicated commands (B9h and 79h) and exited with ABh or chip-select toggle. These modes reduce quiescent current by up to 50× versus active read (4.5 mA), enabling multi-year battery life in remote sensors and wearables. Designers use these modes strategically in systems built around the AT25DF512C-XMHN-T to meet stringent energy budgets.
AT25DF512C-XMHN-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 512Kbit
- Memory Organization:
- 64K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 3.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF512C-XMHN-T FAQ
1.How can I place an order for AT25DF512C-XMHN-T through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF512C-XMHN-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF512C-XMHN-T reliable?
The price and inventory of AT25DF512C-XMHN-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF512C-XMHN-T is usually 5 days.
3.What payment methods are accepted for AT25DF512C-XMHN-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF512C-XMHN-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF512C-XMHN-T?
AT25DF512C-XMHN-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF512C-XMHN-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF512C-XMHN-T?
For technical support, including AT25DF512C-XMHN-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF512C-XMHN-T requirements.
6.How does Aetrix verify that AT25DF512C-XMHN-T is sourced from the original manufacturer or authorized distributors?
All AT25DF512C-XMHN-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF512C-XMHN-T meets industry standards.
7.What is the process for return or replacement of AT25DF512C-XMHN-T?
All AT25DF512C-XMHN-T units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF512C-XMHN-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF512C-XMHN-T part is unused and in its original packaging.
Return procedure for AT25DF512C-XMHN-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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