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Renesas AT25DN011-XMHF-B

Part No.:
AT25DN011-XMHF-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixAT25DN011-XMHF-B.pdf
Description:
IC FLASH 1MBIT SPI 104MHZ 8TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,589

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Product details

Overview

AT25DN011-XMHF-B from Renesas Electronics is a 1-Mbit SPI serial flash memory IC designed for code shadowing and embedded data storage in resource-constrained systems. It operates from 2.3 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock frequency, and achieves 6 ns clock-to-output timing - enabling fast boot and firmware update in industrial controllers and IoT edge nodes.

For engineers reviewing the AT25DN011-XMHF-B datasheet, AT25DN011-XMHF-B pinout, AT25DN011-XMHF-B application, or AT25DN011-XMHF-B equivalent, key selection criteria include dual-output read throughput, ultra-deep power-down current (350 nA), flexible erase granularity (256-byte page / 4-kB & 32-kB blocks), OTP security register, and industrial temperature support (–40°C to +85°C).

Technical Context

The AT25DN011-XMHF-B implements a dedicated SPI interface with hardware-controlled write protection via the WP pin and suspend/resume capability via HOLD. Its command set includes standardized opcodes (e.g., 03h, 0Bh, 3Bh, 20h, 52h) for read, dual-output read, page/sector/chip erase, and OTP programming - all compliant with JEDEC ID read methodology.

Internally, it features a segmented memory architecture with uniform 4-kB and 32-kB erase blocks plus 256-byte programmable pages, enabling efficient co-location of code modules and runtime data without cross-erase interference. The status register (Byte 1 and Byte 2) provides real-time visibility into write-in-progress, write-protection, and deep power-down states.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 1 Mbit (131,072 bytes) - sufficient for bootloader + configuration + firmware patch storage in compact MCU-based designs.
Supply Voltage 2.3 V to 3.6 V - compatible with single-supply 3.3 V systems and tolerant of brown-out conditions down to 2.3 V.
Max Clock Frequency 104 MHz - enables high-speed read access (up to 13 MB/s with Dual-Output Read) for time-critical boot sequences.
Read Latency 6 ns clock-to-output (tV) - minimizes wait states during instruction fetch from external flash.
Erase Granularity 256-byte page / 4-kB block / 32-kB block - allows precise firmware field updates without erasing unrelated code or calibration data.
Power-Down Current 350 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes and energy-harvesting devices.
Endurance & Retention 100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial and automotive ECUs.

Pinout & Package

AT25DN011-XMHF-B is packaged in an 8-lead SOIC (150-mil) with standard JEDEC footprint. Pin functions are fully SPI-compatible and support hardware write protection and communication hold.

Pin/Terminal Circuit Role Design Meaning
CS Chip Select Active-low enable signal; must transition low-to-high to complete any self-timed operation (e.g., erase) before entering standby.
SCK Serial Clock Input clock controlling data latching (rising edge) and output timing (falling edge); supports up to 104 MHz.
SI (I/O0) Serial Input / Dual-Output Data 0 Primary input for commands/addresses; becomes output (I/O0) during Dual-Output Read to double data rate.
SO (I/O1) Serial Output / Dual-Output Data 1 Primary output for read data; remains active (I/O1) during Dual-Output Read for concurrent 2-bit transfer.
WP Write Protect Hardware lock control (active-low); enables sector-level protection independent of software commands.
HOLD Communication Hold Pauses ongoing SPI transfers without deselecting device or resetting internal state; requires CS asserted and SCK low.
VCC Power Supply 2.3–3.6 V supply; powers all logic and memory array; no auxiliary voltage required for programming/erasing.
GND Ground Reference System ground return path; critical for noise immunity and stable SPI signaling at 104 MHz.

Key Features

Feature Design Value
Dual-Output Read (3Bh) Transfers two bits per SCK falling edge - doubles effective read bandwidth vs. standard SPI Read (03h/0Bh), accelerating firmware load times.
Flexible Erase Architecture Supports 256-byte page, 4-kB block, 32-kB block, and full-chip erase - eliminates wasted space when updating partial code/data segments.
128-byte OTP Security Register One-time programmable area for ESN, cryptographic keys, or calibration constants - prevents tampering after initial programming.
Ultra-Deep Power-Down Mode 350 nA typical current draw - enables multi-year battery operation in maintenance-free remote sensors and wearables.
JEDEC Standard ID Read 9Fh command returns manufacturer (0x1F) and device ID (0x47) - simplifies automated BOM verification and firmware compatibility checks.

Applications

Firmware Boot Storage Industrial Sensor Data Logging

Use Scenario: Storing bootloader and application firmware for ARM Cortex-M microcontrollers in factory automation PLCs.

IC Role / Device Role / Timing Role: External non-volatile code storage accessed via SPI during cold start; supports fast shadowing to RAM using Dual-Output Read.

Use Value: 6 ns tV and 104 MHz clock enable sub-100 ms boot time; 4-kB erase blocks allow safe over-the-air patching without disrupting running control loops.

Use Scenario: Capturing timestamped sensor readings (temperature, humidity, vibration) in battery-powered predictive maintenance nodes.

IC Role / Device Role / Timing Role: Persistent data buffer with wear-leveling enabled by 100K-cycle endurance and fine-grained 256-byte page writes.

Use Value: Ultra-deep power-down (350 nA) extends 2000 mAh coin cell life beyond 5 years; OTP register stores unique node ID for secure cloud onboarding.

IoT Edge Device Configuration Medical Diagnostic Instrument Calibration

Use Scenario: Holding user-configurable parameters (Wi-Fi credentials, sampling rates, alarm thresholds) in portable health monitors.

IC Role / Device Role / Timing Role: Secure, field-updatable parameter store protected by WP pin hardware lock and status-register software lock.

Use Value: Hardware write protection prevents accidental overwrite during firmware updates; 20-year data retention ensures calibration validity across product lifetime.

Use Scenario: Storing factory-calibrated coefficients and diagnostic test patterns in ultrasound imaging modules.

IC Role / Device Role / Timing Role: Tamper-resistant non-volatile memory for safety-critical calibration data, programmed once during production using OTP register.

Use Value: 128-byte OTP register guarantees immutability of calibration constants; industrial temp range (–40°C to +85°C) ensures reliability in clinical environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Winbond W25Q10EW 1-Mbit density, same SOIC-8 package, but only supports standard SPI Read (no Dual-Output Read); 30 MHz max clock; 1 µA deep power-down (vs. 350 nA). Lacks dual-output throughput boost and ultra-low-power mode - less suitable for battery-critical or high-speed boot applications. Choose when cost sensitivity outweighs performance/power advantages and Dual-Output Read is unused.
Macronix MX25U1035F 1-Mbit, SOIC-8, supports Quad I/O (not Dual-Output), 104 MHz clock, 25 µA deep power-down, no OTP register. Higher pin-count interface complexity (requires 4 I/O lines); lacks hardware-protected OTP for secure serialization. Prefer when system already uses Quad SPI peripherals and OTP is not required; verify layout supports 4-line routing.

Compared with W25Q10EW and MX25U1035F, the AT25DN011-XMHF-B uniquely combines Dual-Output Read, 350 nA ultra-deep power-down, and 128-byte OTP in a standard 8-pin SOIC - delivering balanced performance, security, and energy efficiency without interface or layout overhead.

Availability

AT25DN011-XMHF-B is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and battery-powered IoT edge devices requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for AT25DN011-XMHF-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.

The AT25DN011-XMHF-B belongs to Renesas' AT25DN family of SPI flash memories engineered for low-voltage, low-power, and secure embedded code and data storage - targeting applications where reliability, security, and energy efficiency are design-critical.

FAQ

What is the maximum operating frequency and corresponding read command for highest throughput on the AT25DN011-XMHF-B?

The AT25DN011-XMHF-B supports up to 104 MHz clock frequency. For highest throughput, use the Dual-Output Read command (opcode 3Bh), which clocks out two bits per SCK falling edge - achieving up to 208 Mbps effective data rate. This is significantly faster than standard Read Array (03h/0Bh), which is limited to 33 MHz or 104 MHz depending on opcode and dummy byte usage. The AT25DN011-XMHF-B's 6 ns clock-to-output timing ensures minimal latency at full speed.

Does the AT25DN011-XMHF-B support hardware write protection, and how is it implemented?

Yes, the AT25DN011-XMHF-B supports hardware write protection via the active-low WP pin. When WP is driven low, it locks protected memory sectors regardless of software commands - providing fail-safe protection against accidental or malicious writes. The WP pin is internally pulled high, so it can be left floating if unused, though Renesas recommends connecting it to VCC externally. Protection granularity is configurable via status register bits and aligns with the device's 4-kB and 32-kB erase blocks. This feature is fully documented in Section 9 of the AT25DN011-XMHF-B datasheet.

What erase options does the AT25DN011-XMHF-B provide, and why is page-level erase important?

The AT25DN011-XMHF-B supports four erase modes: 256-byte page erase (81h), 4-kB block erase (20h), 32-kB block erase (52h), and full chip erase (60h/C7h). Page-level erase is critical because it enables precise, low-overhead updates of small data segments - such as configuration flags or sensor logs - without erasing adjacent code or calibration data stored in neighboring pages. This avoids the wasted space and longer erase times inherent in large-block-only flash devices, improving both memory utilization and field-upgrade reliability. The AT25DN011-XMHF-B's architecture makes it ideal for mixed code-and-data applications.

How does the OTP security register in the AT25DN011-XMHF-B enhance system security?

The AT25DN011-XMHF-B includes a 128-byte One-Time Programmable (OTP) security register accessible via opcodes 9Bh (program) and 77h (read). Once written, OTP contents cannot be altered - making it suitable for storing immutable values like electronic serial numbers (ESN), device-specific cryptographic keys, or factory calibration constants. This prevents cloning or unauthorized reprogramming of critical identifiers. Unlike standard flash memory, the OTP register is physically isolated and programmed using dedicated command sequences, ensuring robustness against software faults or malicious overwrite attempts. The AT25DN011-XMHF-B's OTP is a hardware-enforced security primitive, not emulated in firmware.

What power-saving modes does the AT25DN011-XMHF-B offer, and what are their typical current draws?

The AT25DN011-XMHF-B offers three low-power states: Standby (25 µA typical), Deep Power-Down (7.5 µA typical), and Ultra-Deep Power-Down (350 nA typical). Ultra-Deep Power-Down is entered via opcode 79h and exited via 79h toggle or chip-select pulse - ideal for multi-year battery operation in intermittently active sensors. All modes retain memory contents without external backup. These values are measured at VCC = 3.0 V and TA = 25°C per the AT25DN011-XMHF-B datasheet (Rev. K, Table 13.3). No external components or voltage scaling are required to achieve these currents.

AT25DN011-XMHF-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
8µs, 1.75ms
Access Time:
-
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

AT25DN011-XMHF-B FAQ

1.How can I place an order for AT25DN011-XMHF-B through Aetrix?

Please submit a Request for Quotation (RFQ) for AT25DN011-XMHF-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT25DN011-XMHF-B reliable?

The price and inventory of AT25DN011-XMHF-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DN011-XMHF-B is usually 5 days.

3.What payment methods are accepted for AT25DN011-XMHF-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DN011-XMHF-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT25DN011-XMHF-B?

AT25DN011-XMHF-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT25DN011-XMHF-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT25DN011-XMHF-B?

For technical support, including AT25DN011-XMHF-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DN011-XMHF-B requirements.

6.How does Aetrix verify that AT25DN011-XMHF-B is sourced from the original manufacturer or authorized distributors?

All AT25DN011-XMHF-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DN011-XMHF-B meets industry standards.

7.What is the process for return or replacement of AT25DN011-XMHF-B?

All AT25DN011-XMHF-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DN011-XMHF-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT25DN011-XMHF-B part is unused and in its original packaging.

Return procedure for AT25DN011-XMHF-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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