Renesas AT25DN256-XMHF-B
- Part No.:
- AT25DN256-XMHF-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DN256-XMHF-B.pdf
- Description:
- IC FLASH 256KBIT SPI 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AT25DN256-XMHF-B from Adesto Technologies is a 256-Kbit serial SPI Flash memory IC optimized for code shadowing and mixed code/data storage in embedded systems. It operates from 2.3V–3.6V, supports SPI Modes 0/3, delivers 104MHz max clock frequency, achieves 6ns clock-to-output delay, and features dual-output read for enhanced throughput.
For engineers reviewing the AT25DN256-XMHF-B datasheet, AT25DN256-XMHF-B pinout, AT25DN256-XMHF-B application, or AT25DN256-XMHF-B equivalent, key selection considerations include its flexible erase architecture (256-byte page / 4-KB / 32-KB blocks), 128-byte OTP security register with factory-unique ID, ultra-low deep power-down current (350nA typical), and industrial temperature range support.
Technical Context
The AT25DN256-XMHF-B implements a dedicated SPI interface with hardware-controlled write protection via the WP pin and suspend/resume capability via HOLD. Its memory array uses uniform block sizing-256-byte pages, 4-KB and 32-KB erase blocks, and full-chip erase-to minimize wasted space in mixed-code-and-data applications.
Dual-output read mode (opcode 3Bh) enables two bits per SCK falling edge using SI (I/O0) and SO (I/O1) as concurrent outputs, doubling effective data rate versus standard single-output reads. Internal status register polling (RDY/BUSY bit) supports efficient command completion detection without fixed timing waits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Kbit (32 KB) organized as 128 pages × 256 bytes; enables compact firmware storage with fine-grained update capability. |
| Supply Voltage | 2.3V–3.6V single supply; eliminates need for charge pumps or auxiliary voltages during program/erase operations. |
| Max Clock Frequency | 104 MHz for standard read and program/erase commands; supports high-speed boot loading and firmware updates. |
| Read Latency | 6 ns clock-to-output (tV); ensures minimal wait states when interfacing with high-performance microcontrollers. |
| Erase Granularity | 256-byte page, 4-KB block, 32-KB block, and full-chip erase; allows precise partitioning of code modules and data segments. |
| OTP Security Register | 128-byte one-time programmable register: 64 bytes factory-programmed unique ID + 64 bytes user-programmable; supports device authentication and secure key binding. |
| Power Consumption | 350 nA ultra-deep power-down current (typical); extends battery life in always-on IoT edge nodes and portable devices. |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention; suitable for field-upgradable firmware and long-lifecycle industrial deployments. |
Pinout & Package
AT25DN256-XMHF-B is packaged in an 8-lead SOIC (150-mil) footprint, compatible with standard surface-mount assembly processes and legacy PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select input | Active-low enable signal; initiates all SPI transactions and places SO in high-impedance when deasserted. |
| SCK | Serial clock input | Controls data timing: rising edge latches SI input; falling edge clocks SO output; supports up to 104 MHz. |
| SI (I/O0) | Serial input / dual-output data line | Primary command/address/data input; becomes I/O0 output during Dual-Output Read to deliver LSB-aligned data bits. |
| SO (I/O1) | Serial output / dual-output data line | Standard read data output; becomes I/O1 output during Dual-Output Read to deliver MSB-aligned data bits. |
| WP | Hardware write protect input | Low-active pin enabling sector-level hardware locking; internally pulled high; optional external VCC tie for default protection. |
| HOLD | Communication suspend input | Pauses ongoing SPI transfers without deselecting device; requires CS asserted and SCK low to activate; internally pulled high. |
| VCC | Power supply | 2.3V–3.6V main supply; powers all internal logic, memory array, and I/O buffers; no separate programming voltage required. |
| GND | Ground reference | System ground return path; must be low-impedance connection to ensure stable operation and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-output read mode | Enables 2-bit-per-clock-cycle data transfer using SI and SO simultaneously, doubling effective read bandwidth over standard SPI. |
| Flexible erase architecture | Supports 256-byte page, 4-KB, 32-KB, and full-chip erase - reduces memory fragmentation and improves utilization in mixed code/data systems. |
| OTP security register | 128-byte one-time programmable area with factory-assigned 64-byte unique ID; provides tamper-resistant device serialization and ESN storage. |
| Ultra-low power modes | 350 nA ultra-deep power-down and 7.5 µA deep power-down currents enable multi-year battery operation in energy-constrained edge devices. |
| Industrial temperature range | Specified for –40°C to +85°C operation; ensures reliable performance in automotive infotainment, industrial HMIs, and outdoor sensor gateways. |
| JEDEC-standard identification | Supports 9Fh Manufacturer and Device ID read command; simplifies automated BOM verification and supply chain traceability. |
Applications
| IoT Edge Node Firmware Storage | Industrial HMI Code Shadowing |
|---|---|
Use Scenario: Storing and updating firmware images in battery-powered wireless sensor nodes with constrained PCB space and strict power budgets. IC Role / Device Role / Timing Role: Non-volatile code storage IC providing fast, low-power boot image access and field-upgradable application binaries. Use Value: 256-byte page erase enables atomic firmware patching without erasing entire application; 350nA deep power-down extends multi-year battery life. |
Use Scenario: Loading GUI assets and control logic into RAM at startup for human-machine interface panels in factory automation equipment. IC Role / Device Role / Timing Role: SPI Flash memory serving as primary boot source for ARM Cortex-M microcontrollers executing real-time UI rendering. Use Value: 104MHz max clock and 6ns tV reduce boot time; dual-output read accelerates asset loading; 4-KB block erase isolates UI updates from control firmware. |
| Medical Wearable Data Logging | Automotive Telematics Boot Memory |
Use Scenario: Capturing and retaining diagnostic sensor readings (ECG, SpO₂) between periodic cloud syncs in Class II medical wearables. IC Role / Device Role / Timing Role: Reliable, low-power data buffer with integrated security for HIPAA-compliant patient data persistence. Use Value: 128-byte OTP register stores encrypted device keys; 20-year data retention ensures long-term audit trail integrity; industrial temp rating covers body-worn thermal profiles. |
Use Scenario: Storing bootloader, CAN protocol stack, and OTA update partitions in vehicle telematics control units operating under hood temperatures. IC Role / Device Role / Timing Role: Automotive-grade serial Flash providing secure, robust boot memory with hardware write protection against corruption. Use Value: WP pin enables permanent lock of bootloader region; 100K endurance supports frequent OTA updates; –40°C to +85°C rating meets AEC-Q100 ambient requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q256JWEIQ | 512-Mbit density, quad-SPI support, 133MHz max clock; no dual-output read or OTP register. | Better suited for high-bandwidth graphics or large firmware images; lacks hardware-secured unique ID for device authentication. | Select when higher density and QSPI interface are required; not drop-in due to different pinout and command set. |
| Macronix MX25L25635F | 256-Mbit density, standard SPI only, 104MHz clock, no OTP register; 25 µA standby current vs. 25 µA for AT25DN256-XMHF-B. | Optimized for cost-sensitive consumer electronics; lacks ultra-deep power-down (350nA) and factory-unique ID. | Choose for price-driven volume production where OTP security and nanoamp power are non-critical. |
Compared with W25Q256JWEIQ and MX25L25635F, the AT25DN256-XMHF-B uniquely combines ultra-low power consumption, on-chip OTP security with factory-unique ID, and dual-output read - making it optimal for secure, battery-constrained edge devices requiring verified identity and minimal energy use.
Availability
AT25DN256-XMHF-B is available at Aetrix Electronics and suitable for IoT edge node firmware storage, industrial HMI code shadowing, medical wearable data logging, and automotive telematics boot memory requiring stable component supply across extended product lifecycles.
Supply support for AT25DN256-XMHF-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Adesto Technologies (now part of Dialog Semiconductor, part of Renesas Electronics) specialized in low-power, non-volatile memory and analog interface solutions for resource-constrained embedded systems.
The AT25DN256 product line was designed specifically for mixed code-and-data storage in battery-powered and industrial applications where fine-grained erase control, security, and ultra-low power are critical.
FAQ
What is the maximum clock frequency supported by the AT25DN256-XMHF-B for read operations?
The AT25DN256-XMHF-B supports up to 104 MHz for standard Read Array (0Bh) and Dual-Output Read (3Bh) commands. At this frequency, the device achieves a clock-to-output delay (tV) of 6 ns, enabling high-speed data retrieval essential for fast-boot microcontrollers and real-time firmware execution. The 03h opcode supports lower-frequency reads up to 33 MHz.
Does the AT25DN256-XMHF-B include hardware write protection, and how is it implemented?
Yes, the AT25DN256-XMHF-B implements hardware write protection via the WP (Write Protect) pin, which is active-low and internally pulled high. When driven low, it locks protected memory sectors to prevent accidental or malicious program/erase operations. This feature works independently of software commands and remains effective even during power cycling, ensuring robust firmware integrity in mission-critical systems.
How does the dual-output read mode improve throughput in the AT25DN256-XMHF-B?
The AT25DN256-XMHF-B's dual-output read mode (enabled by opcode 3Bh) uses both SI (I/O0) and SO (I/O1) pins as concurrent data outputs, delivering two bits per SCK falling edge. This effectively doubles the data rate compared to standard single-output SPI reads at the same clock frequency - accelerating boot image loading, GUI asset streaming, and firmware updates without requiring interface redesign.
What erase block sizes are available on the AT25DN256-XMHF-B, and why does granularity matter?
The AT25DN256-XMHF-B supports four erase granularities: 256-byte page, 4-KB block, 32-KB block, and full-chip erase. Fine-grained 256-byte page erase minimizes wasted space when updating small firmware patches or configuration data, while larger blocks optimize bulk operations. This flexibility prevents memory fragmentation common in large-block-only Flash, improving usable density in mixed code/data applications.
Is the AT25DN256-XMHF-B suitable for industrial temperature environments?
Yes, the AT25DN256-XMHF-B is fully specified for the industrial temperature range of –40°C to +85°C. Its electrical parameters-including read timing, program/erase times, and power consumption-are guaranteed across this range, making it appropriate for deployment in factory automation HMIs, outdoor environmental sensors, and under-hood automotive modules where thermal stability is mandatory.
AT25DN256-XMHF-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 1.75ms
- Access Time:
- -
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DN256-XMHF-B FAQ
1.How can I place an order for AT25DN256-XMHF-B through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DN256-XMHF-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DN256-XMHF-B reliable?
The price and inventory of AT25DN256-XMHF-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DN256-XMHF-B is usually 5 days.
3.What payment methods are accepted for AT25DN256-XMHF-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DN256-XMHF-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DN256-XMHF-B?
AT25DN256-XMHF-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DN256-XMHF-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DN256-XMHF-B?
For technical support, including AT25DN256-XMHF-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DN256-XMHF-B requirements.
6.How does Aetrix verify that AT25DN256-XMHF-B is sourced from the original manufacturer or authorized distributors?
All AT25DN256-XMHF-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DN256-XMHF-B meets industry standards.
7.What is the process for return or replacement of AT25DN256-XMHF-B?
All AT25DN256-XMHF-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DN256-XMHF-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DN256-XMHF-B part is unused and in its original packaging.
Return procedure for AT25DN256-XMHF-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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