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Renesas AT25XE011-SSHN-B

Part No.:
AT25XE011-SSHN-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixAT25XE011-SSHN-B.pdf
Description:
IC FLASH 1MBIT SPI 104MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,339

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Product details

Overview

AT25XE011-SSHN-B from Renesas Electronics is a 1-Mbit SPI serial flash memory IC optimized for ultra-low-power, code+data storage in IoT and industrial edge devices. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock frequency with 6 ns clock-to-output delay, and features granular erase (256-byte page, 4-kByte/32-kByte blocks) for efficient firmware updates.

For engineers reviewing the AT25XE011-SSHN-B datasheet, AT25XE011-SSHN-B pinout, AT25XE011-SSHN-B application, or AT25XE011-SSHN-B equivalent, key selection considerations include its 200 nA ultra-deep power-down current, 128-byte OTP security register with factory-programmed unique ID, hardware write protection via WP pin, and JEDEC-standard manufacturer/device ID read capability.

Technical Context

The AT25XE011-SSHN-B implements a dual-I/O read architecture where both SI (I/O0) and SO (I/O1) pins output data simultaneously on each SCK falling edge, doubling read throughput versus standard SPI. Its control logic integrates hardware-based sector locking via the WP pin and software-configurable status register bits (BPL, BP0–BP2) for flexible memory protection.

Internally, the device uses a hierarchical erase architecture: 256-byte pages enable fine-grained data logging; uniform 4-kByte and 32-kByte blocks support modular firmware partitioning; full-chip erase provides recovery capability. All program/erase operations are self-timed and automatically verified, with failure reporting via status register flags.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Mbit (131,072 bytes), organized as 512 pages × 256 bytes for precise data allocation.
Supply Voltage1.65 V – 3.6 V - enables direct interface with 1.8 V and 3.3 V MCUs without level-shifting.
Max Clock Frequency104 MHz - supports high-speed boot code loading and OTA update streaming.
Read Latency6 ns tV (clock-to-output) - ensures minimal wait states during instruction fetch from MCU.
Erase Granularity256-byte page / 4-kByte block / 32-kByte block - reduces wasted space in mixed code/data layouts.
Power Consumption200 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes.
Data Retention20 years - guarantees long-term reliability for firmware and calibration data storage.

Pinout & Package

AT25XE011-SSHN-B is packaged in an 8-lead SOIC (150-mil) with industry-standard pinout and RoHS-compliant lead finish.

Pin/TerminalCircuit RoleDesign Meaning
CSChip SelectActive-low enable signal; rising edge ends operations, high-impedance SO when deasserted.
SCKSerial ClockMaster-generated clock; data latched on rising edge, output shifted on falling edge.
SI (I/O0)Serial Input / Dual-Read OutputInput for commands/addresses; becomes I/O0 output during Dual-Output Read for parallel bit transfer.
SO (I/O1)Serial Output / Dual-Read OutputPrimary data output; remains I/O1 during Dual-Output Read to deliver second bit per cycle.
WPWrite ProtectHardware lock control; low state enables status register write and sector protection configuration.
HOLDCommunication PauseActive-low suspend signal; pauses ongoing reads/writes without deselecting device or resetting state.
VCCPower SupplySingle 1.65–3.6 V supply - eliminates need for charge pumps or auxiliary voltages.
GNDGround ReferenceCommon return path for all digital and analog circuitry; must be low-impedance connection.

Key Features

FeatureDesign Value
Dual-Output Read ModeSimultaneous 2-bit output on SI/SO per SCK cycle doubles effective read bandwidth over standard SPI.
OTP Security Register128-byte one-time programmable area: 64 bytes factory-unique ID + 64 bytes user-configurable for ESN or keys.
Flexible Erase ArchitecturePage (256 B), 4-kB, 32-kB, and full-chip erase options minimize wasted space in firmware+data partitions.
Ultra-Low Power States200 nA ultra-deep power-down and 4.5 µA deep power-down enable multi-year battery operation.
Hardware Write ProtectionWP pin directly controls locking of protected sectors - no software overhead or timing-critical sequences.

Applications

Smart Meter Firmware StorageIndustrial PLC Configuration Memory

Use Scenario: Storing metering firmware and tariff tables in battery-powered smart electricity meters with 10+ year field life.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast read access for secure boot and encrypted OTA updates.

Use Value: 200 nA ultra-deep power-down current extends battery life; 256-byte page erase enables incremental parameter updates without disturbing firmware.

Use Scenario: Retaining calibrated sensor offsets, I/O mapping, and safety logic in DIN-rail mounted PLCs operating at -40 °C to +85 °C.

IC Role / Device Role / Timing Role: Reliable configuration storage with hardware write protection against runtime corruption.

Use Value: WP pin enables permanent sector locking; 4-kByte block erase isolates calibration data from application logic updates.

Wireless Sensor Node Data LoggingMedical Wearable Bootloader Storage

Use Scenario: Capturing timestamped sensor readings in BLE-enabled environmental monitors deployed in remote locations.

IC Role / Device Role / Timing Role: High-efficiency data buffer with wear-leveling enabled by fine-grained 256-byte erases.

Use Value: 100,000 program/erase cycles and 20-year retention ensure integrity across thousands of logging sessions.

Use Scenario: Hosting secure bootloader and cryptographic keys in FDA-cleared wearable health monitors.

IC Role / Device Role / Timing Role: Trusted execution root-of-trust component with tamper-resistant OTP register.

Use Value: Factory-programmed 64-byte unique ID enables device authentication; OTP prevents key overwrite after provisioning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Winbond W25Q10EW1-Mbit density, 1.65–3.6 V, but lacks Dual-Output Read and has slower 8 ns tV.Lower read throughput limits OTA update speed; no OTP register for device serialization.Choose when cost sensitivity outweighs dual-read performance and security requirements.
Micron MT25QL01GBBB8E12-0SIT1-Gbit density, quad-SPI interface, higher voltage min (1.7 V), no ultra-deep power-down mode.Over-specified capacity increases PCB footprint; quad interface requires additional IO lines.Choose only if system demands >1-Mbit capacity and quad-SPI compatibility is mandatory.

Compared with W25Q10EW and MT25QL01GBBB8E12-0SIT, the AT25XE011-SSHN-B uniquely balances ultra-low power (200 nA), dual-output read acceleration, and integrated security (OTP + hardware WP) in a compact 8-SOIC package - making it optimal for constrained, battery-powered, and security-aware embedded designs.

Availability

AT25XE011-SSHN-B is available at Aetrix Electronics and suitable for smart metering, industrial PLCs, wireless sensor nodes, and medical wearables requiring stable component supply and long-term lifecycle support.

Supply support for AT25XE011-SSHN-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.

The AT25XE011-SSHN-B belongs to Renesas' ultra-low-power serial flash product line, engineered specifically for energy-constrained, always-on edge devices needing secure, reliable, and granular non-volatile storage.

FAQ

What is the operating voltage range of the AT25XE011-SSHN-B?

The AT25XE011-SSHN-B operates from 1.65 V to 3.6 V across its full temperature range (-40 °C to +85 °C). At 1.65–1.7 V, operation is guaranteed from -10 °C to +85 °C; above 1.7 V, full industrial temperature range is supported. This single-supply design eliminates external regulators or level shifters when interfacing with 1.8 V or 3.3 V host MCUs.

Does the AT25XE011-SSHN-B support dual-output read mode, and how does it improve performance?

Yes, the AT25XE011-SSHN-B supports Dual-Output Read using the 3Bh command, where both SI (I/O0) and SO (I/O1) pins output data simultaneously on each SCK falling edge. This delivers twice the data rate of standard SPI read operations, reducing firmware load time and OTA update latency - critical for responsive boot sequences in resource-constrained IoT endpoints.

How is memory protection implemented on the AT25XE011-SSHN-B?

The AT25XE011-SSHN-B implements dual-layer memory protection: hardware-based locking via the WP pin (active-low) for immediate sector lockdown, and software-configurable status register bits (BPL, BP0–BP2) for flexible block-level protection. The WP pin can be externally tied to GND or controlled dynamically, enabling robust defense against accidental or malicious writes during field operation.

What is the purpose and structure of the OTP security register in the AT25XE011-SSHN-B?

The AT25XE011-SSHN-B includes a 128-byte One-Time Programmable (OTP) security register: the first 64 bytes are factory-programmed with a globally unique identifier for device serialization, and the remaining 64 bytes are user-programmable for storing cryptographic keys, calibration constants, or electronic serial numbers. Once written, OTP contents cannot be altered - ensuring immutable identity and secure key binding.

What erase options does the AT25XE011-SSHN-B provide, and why is granularity important?

The AT25XE011-SSHN-B supports four erase modes: 256-byte page, 4-kByte block, 32-kByte block, and full-chip. Granular page erase minimizes wasted space when updating small data segments (e.g., sensor logs), while uniform block sizes allow clean separation of firmware, configuration, and user data - improving software maintainability and reducing MCU overhead during field updates.

AT25XE011-SSHN-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
12µs, 3ms
Access Time:
-
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

AT25XE011-SSHN-B FAQ

1.How can I place an order for AT25XE011-SSHN-B through Aetrix?

Please submit a Request for Quotation (RFQ) for AT25XE011-SSHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT25XE011-SSHN-B reliable?

The price and inventory of AT25XE011-SSHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25XE011-SSHN-B is usually 5 days.

3.What payment methods are accepted for AT25XE011-SSHN-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25XE011-SSHN-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT25XE011-SSHN-B?

AT25XE011-SSHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT25XE011-SSHN-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT25XE011-SSHN-B?

For technical support, including AT25XE011-SSHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25XE011-SSHN-B requirements.

6.How does Aetrix verify that AT25XE011-SSHN-B is sourced from the original manufacturer or authorized distributors?

All AT25XE011-SSHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25XE011-SSHN-B meets industry standards.

7.What is the process for return or replacement of AT25XE011-SSHN-B?

All AT25XE011-SSHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25XE011-SSHN-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT25XE011-SSHN-B part is unused and in its original packaging.

Return procedure for AT25XE011-SSHN-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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