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Renesas AT25XE021A-XMHN-B

Part No.:
AT25XE021A-XMHN-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixAT25XE021A-XMHN-B.pdf
Description:
IC FLASH 2MBIT SPI 70MHZ 8TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,823

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Product details

Overview

AT25XE021A-XMHN-B from Renesas Electronics is a 2-Mbit SPI serial Flash memory IC designed for code shadowing and embedded data storage in consumer electronics. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-I/O read, delivers 70 MHz max clock frequency, achieves 6 ns clock-to-output delay, and features flexible erase architecture (256-byte page, 4/32/64-kByte blocks, full chip).

For engineers reviewing the AT25XE021A-XMHN-B datasheet, AT25XE021A-XMHN-B pinout, AT25XE021A-XMHN-B application, or AT25XE021A-XMHN-B equivalent, key selection criteria include dual-I/O read throughput, ultra-low deep power-down current (200 nA), OTP security register (128 bytes), industrial temperature support, and hardware write protection via WP pin.

Technical Context

The AT25XE021A-XMHN-B implements a SPI-compatible serial interface with dual-input/dual-output capability for accelerated data transfer. Its memory array uses optimized sectoring-256-byte pages and uniform 4/32/64-kByte blocks-to minimize wasted space during partial updates of firmware or configuration data.

It integrates hardware-controlled write protection via the WP pin and software-managed sector locking, plus a dedicated 128-byte OTP security register (64 bytes factory-unique ID, 64 bytes user-programmable) for device serialization and secure key storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2 Mbit (256 kByte) - sufficient for boot code, firmware images, and persistent configuration in space-constrained designs.
Supply Voltage1.65 V – 3.6 V - enables direct interfacing with 1.8 V and 3.3 V microcontrollers without level shifting.
Max Clock Frequency70 MHz - supports high-speed read operations, reducing boot time and data access latency.
Read Latency6 ns clock-to-output (tV) - ensures minimal timing margin requirements in high-frequency SPI bus designs.
Erase Granularity256-byte page / 4-kByte block / 32-kByte block / 64-kByte block / full chip - allows precise, low-overhead updates of small code modules or data segments.
Power-Down Current200 nA ultra-deep power-down (typical) - extends battery life in always-on or energy-harvesting IoT endpoints.
Endurance & Retention100,000 program/erase cycles; 20-year data retention - suitable for field-upgradable firmware and long-life industrial deployments.

Pinout & Package

AT25XE021A-XMHN-B is packaged in an 8-lead SOIC (150-mil) with standard JEDEC footprint. Pin functions are fully SPI-compliant and support hold, write protect, and dual-I/O modes.

Pin/TerminalCircuit RoleDesign Meaning
CSChip SelectActive-low enable signal; must transition high-to-low to initiate commands and low-to-high to terminate operations.
SCKSerial ClockInput clock controlling data latching (rising edge) and output timing (falling edge); supports up to 70 MHz.
SI (I/O0)Serial Input / Dual-I/O Data 0Primary command/address/data input; becomes bidirectional I/O0 during Dual-I/O read for parallel bit streaming.
SO (I/O1)Serial Output / Dual-I/O Data 1Primary data output; remains active I/O1 during Dual-I/O read to deliver second data bit per SCK cycle.
WPWrite ProtectHardware lock control; low assertion disables write/erase commands to protected sectors, independent of software state.
HOLDCommunication PauseActive-low signal that suspends SPI communication without deselecting device or interrupting ongoing program/erase cycles.
VCCPower SupplySingle 1.65–3.6 V supply powers all operations - no auxiliary voltage required for programming or erasing.
GNDGround ReferenceSystem ground connection; required for stable operation and noise immunity across full industrial temperature range.

Key Features

FeatureDesign Value
Dual-I/O Read SupportEnables 2-bit-per-clock read transfers, doubling effective throughput over standard SPI without increasing clock frequency.
Flexible Erase ArchitectureMultiple erase granularities eliminate need for external RAM buffering during partial firmware updates or log rotation.
128-byte OTP Security RegisterProvides tamper-resistant storage for unique device IDs, cryptographic keys, or calibration data - factory-programmed and user-programmable sections.
Ultra-Deep Power-Down ModeReduces quiescent current to 200 nA, enabling multi-year battery operation in maintenance-free sensor nodes.
Hardware + Software ProtectionCombines WP pin-based locking with programmable sector protection registers for layered security against accidental or malicious writes.

Applications

Smart Home Hub Firmware StorageIndustrial PLC Configuration Memory

Use Scenario: Storing and updating boot firmware and OTA update payloads in a Wi-Fi/BLE-enabled smart home hub.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast read access for boot-time shadowing and in-field reprogramming via SPI.

Use Value: Dual-I/O read reduces boot latency; 256-byte page erase enables efficient patch updates without full image rewrites.

Use Scenario: Retaining calibrated I/O parameters, runtime logs, and safety-critical configuration in programmable logic controllers.

IC Role / Device Role / Timing Role: Persistent data storage with deterministic erase/write timing and hardware write protection for functional safety compliance.

Use Value: 4-kByte block erase aligns with typical parameter group sizes; 100K endurance supports decades of field recalibration cycles.

Wearable Health Monitor Boot CodeAutomotive Infotainment System Asset Cache

Use Scenario: Holding bootloader and sensor fusion firmware in ultra-low-power wearable devices powered by coin cells.

IC Role / Device Role / Timing Role: Low-voltage (1.65 V) Flash memory enabling direct integration with energy-harvesting PMUs and sub-2 V MCUs.

Use Value: 200 nA ultra-deep power-down current extends battery life beyond 2 years; 20-year data retention ensures reliability over product lifetime.

Use Scenario: Caching map tiles, voice recognition models, and UI assets in automotive infotainment head units.

IC Role / Device Role / Timing Role: High-speed, high-density serial Flash supporting rapid asset loading and background firmware updates.

Use Value: 70 MHz clock and 6 ns tV enable sub-100 ms asset load times; 64-kByte block erase simplifies large asset replacement.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Winbond W25Q20EW2 Mbit density, 1.7–2.0 V supply, 104 MHz max clock, no Dual-I/O support, 1.5 µA deep power-down.Better suited for 1.8 V-only systems requiring higher clock speed but no dual-data-rate reads.Select when maximum read bandwidth at 1.8 V is critical and Dual-I/O is unnecessary.
Micron MT25QL02G2 Gbit density, 2.7–3.6 V supply, Quad-SPI only, 133 MHz clock, 2.5 µA deep power-down.Targets high-capacity applications needing quad interface and wider voltage range, not low-voltage or dual-I/O use cases.Select for systems requiring >2 Mbit capacity and QSPI compatibility, not ultra-low power or 1.65 V operation.

Compared with W25Q20EW and MT25QL02G, the AT25XE021A-XMHN-B uniquely balances ultra-low-voltage operation (1.65 V), dual-I/O throughput, and nanoamp-level power-down - making it optimal for battery-powered, space-constrained embedded systems where both energy efficiency and flexible erase granularity are mandatory.

Availability

AT25XE021A-XMHN-B is available at Aetrix Electronics and suitable for smart home hubs, industrial PLCs, and wearable health monitors requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AT25XE021A-XMHN-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering trusted microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.

The AT25XE021A belongs to Renesas' serial Flash memory product line, engineered specifically for low-voltage, high-reliability embedded code and data storage in consumer and industrial edge devices.

FAQ

What is the operating voltage range of the AT25XE021A-XMHN-B?

The AT25XE021A-XMHN-B operates from 1.65 V to 3.6 V, enabling direct compatibility with both 1.8 V and 3.3 V microcontroller I/O domains. This single-supply design eliminates the need for external level shifters or auxiliary voltage rails during programming or erasing operations, simplifying PCB layout and reducing BOM cost in battery-powered and mixed-voltage systems.

Does the AT25XE021A-XMHN-B support Dual-I/O read mode?

Yes, the AT25XE021A-XMHN-B supports Dual-I/O read mode using the 0Bh opcode, allowing two bits of data to be transferred per SCK falling edge on SI (I/O0) and SO (I/O1). This doubles effective read throughput versus standard single-I/O mode while maintaining full SPI protocol compatibility and requiring no changes to existing SPI controller firmware beyond command selection.

How does the OTP security register function in the AT25XE021A-XMHN-B?

The AT25XE021A-XMHN-B includes a 128-byte OTP security register: 64 bytes factory-programmed with a unique device identifier and 64 bytes user-programmable. Once programmed, OTP bytes cannot be erased or rewritten, providing tamper-resistant storage for cryptographic keys, calibration constants, or electronic serial numbers essential for device authentication and secure boot workflows.

What erase options are available on the AT25XE021A-XMHN-B?

The AT25XE021A-XMHN-B offers five erase options: 256-byte page erase (D8h), 4-kByte block erase (20h), 32-kByte block erase (52h), 64-kByte block erase (D8h with address mask), and full chip erase (60h/C7h). This hierarchical granularity minimizes write amplification and preserves endurance when updating small firmware patches or configuration records without disturbing adjacent memory regions.

Is the AT25XE021A-XMHN-B qualified for industrial temperature operation?

Yes, the AT25XE021A-XMHN-B is specified for the full industrial temperature range of −40 °C to +85 °C. All electrical characteristics-including read timing, program/erase times, and power consumption-are guaranteed across this range, ensuring reliable operation in harsh environments such as factory automation controllers, outdoor gateways, and automotive cabin electronics.

AT25XE021A-XMHN-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
2Mbit
Memory Organization:
256K x 8
Memory Interface:
SPI
Clock Frequency:
70 MHz
Write Cycle Time - Word, Page:
8µs, 5ms
Access Time:
-
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

AT25XE021A-XMHN-B FAQ

1.How can I place an order for AT25XE021A-XMHN-B through Aetrix?

Please submit a Request for Quotation (RFQ) for AT25XE021A-XMHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT25XE021A-XMHN-B reliable?

The price and inventory of AT25XE021A-XMHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25XE021A-XMHN-B is usually 5 days.

3.What payment methods are accepted for AT25XE021A-XMHN-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25XE021A-XMHN-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT25XE021A-XMHN-B?

AT25XE021A-XMHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT25XE021A-XMHN-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT25XE021A-XMHN-B?

For technical support, including AT25XE021A-XMHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25XE021A-XMHN-B requirements.

6.How does Aetrix verify that AT25XE021A-XMHN-B is sourced from the original manufacturer or authorized distributors?

All AT25XE021A-XMHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25XE021A-XMHN-B meets industry standards.

7.What is the process for return or replacement of AT25XE021A-XMHN-B?

All AT25XE021A-XMHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25XE021A-XMHN-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT25XE021A-XMHN-B part is unused and in its original packaging.

Return procedure for AT25XE021A-XMHN-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

AT25XE021A-XMHN-B Tags

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