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Renesas AT25XE081D-SHN-B

Part No.:
AT25XE081D-SHN-B
Manufacturer:
Renesas
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixAT25XE081D-SHN-B.pdf
Description:
IC FLASH 8MBIT SPI/QUAD 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,028

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Product details

Overview

AT25XE081D from Renesas Electronics is an 8-Mbit SPI serial flash memory IC supporting quad I/O, XiP (eXecute in Place), and flexible erase architecture. It operates from 1.65 V to 3.6 V, delivers up to 133 MHz clock frequency, and features 256-byte page erase, 100,000 program/erase cycles, and -40 °C to +85 °C industrial temperature range - used for firmware storage, boot code execution, and data logging in battery-powered edge devices.

For engineers reviewing the AT25XE081D datasheet, AT25XE081D pinout, AT25XE081D application, or AT25XE081D equivalent, key selection considerations include multi-I/O mode support (1-1-4 / 1-4-4 / 0-4-4), ultra-low-power Deep Power-Down (8.5 µA) and Ultra Deep Power Down (5–7 nA), Read-Modify-Write command for SRAM-like writes, and hardware reset capability via HOLD/RESET pin.

Technical Context

The AT25XE081D implements a dual-bus interface architecture with dedicated 256-byte SRAM buffer and configurable I/O drive strength. Its command set supports nested erase/program suspend-resume operations and includes dedicated commands for XiP mode entry (EBh/E7h), burst wrap configuration (77h), and active status interrupt generation (25h).

Memory protection is implemented via individual block lock (36h), global lock (7Eh), and user-definable protected areas at memory array start/end. Status registers (SR1–SR6) are non-volatile/volatile hybrid, with SR1–SR3 directly writable and SR4–SR6 accessible only via indirect addressing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density8 Mbit (1 MByte) - sufficient for full MCU boot images and firmware updates in compact embedded systems.
Supply Voltage Range1.65 V – 3.6 V - enables direct integration with 1.8 V, 2.5 V, and 3.3 V logic domains without level-shifting.
Max Clock Frequency133 MHz - supports high-throughput firmware reads and XiP execution with minimal latency.
Erase Granularity256-byte page erase - allows efficient overwriting of small configuration or log entries without disturbing adjacent data.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for long-life industrial deployments.
Ultra-Low Power Modes5–7 nA Ultra Deep Power Down current - extends battery life in always-on sensor nodes and wearables.
Interface ModesSPI modes 0/3, dual output (1-1-2), quad output (1-1-4), quad I/O (1-4-4), and XiP (0-4-4) - enables bandwidth scaling from 133 MB/s (quad I/O) to >200 MB/s (XiP continuous read).

Pinout & Package

AT25XE081D-SHN-B uses an 8-pin SOIC (150-mil) package with industry-standard pinout and JEDEC-compliant footprint. All pins support 1.65–3.6 V I/O voltage levels and configurable drive strength.

Pin/TerminalCircuit RoleDesign Meaning
CSChip SelectActive-low enable for SPI command/data transfer; supports daisy-chaining in multi-device systems.
SCKSerial ClockInput clock synchronized to host controller; supports up to 133 MHz for quad I/O and XiP modes.
SI (I/O0)Serial Input / Quad I/O Lane 0Primary data input during standard SPI and first lane in multi-I/O modes; bidirectional in quad I/O/XiP.
SO (I/O1)Serial Output / Quad I/O Lane 1Primary data output during standard SPI and second lane in multi-I/O modes; bidirectional in quad I/O/XiP.
WP (I/O2)Write Protect / Quad I/O Lane 2Hardware write protection when held low; third I/O lane in quad modes; supports OTP register programming.
HOLD/RESET (I/O3)Hold Function / Hardware Reset InputPauses ongoing transfers when asserted; double-function pin enabling hardware reset per JEDEC standard (99h + 66h sequence not required).
VCCPower Supply1.65–3.6 V core and I/O supply; decoupling capacitor required per datasheet layout guidelines.
GNDGround ReferenceCommon return path for power and signal integrity; must be connected to system ground plane with low-inductance path.

Key Features

FeatureDesign Value
Read-Modify-Write (RMW) Command (0Ah)Emulates single-cycle SRAM write to flash - eliminates need for external RAM buffering during small-data updates.
Active Status Interrupt (25h)Generates hardware interrupt on RDY/BSY flag clear - enables host CPU to enter low-power state during erase/program instead of polling.
Quad I/O and XiP SupportEnables 0-4-4 continuous read mode - removes opcode overhead for sequential instruction fetch, reducing effective latency by ~30% vs. standard quad read.
Flexible Memory ProtectionIndividual block lock (36h), global lock (7Eh), and start/end user-defined protected zones - allows secure partitioning of bootloader, app, and user data regions.
OTP Security RegistersThree 128-byte One-Time Programmable registers - store cryptographic keys, device IDs, or calibration data with irreversible write guarantee.

Applications

Firmware StorageEdge Device Boot Code

Use Scenario: Storing MCU firmware images in industrial gateways with field-upgrade capability.

IC Role / Device Role / Timing Role: Non-volatile program memory accessed during cold boot and OTA update verification.

Use Value: Page-erase granularity enables partial firmware patching; 133 MHz quad I/O ensures <50 ms boot time for 512 KB images.

Use Scenario: Executing boot code directly from flash in battery-powered IoT sensors.

IC Role / Device Role / Timing Role: eXecute-in-Place (XiP) memory source for ARM Cortex-M0+ core during startup.

Use Value: 0-4-4 XiP mode eliminates copy-to-RAM delay; ultra-low 5–7 nA UDPD current extends 10-year battery life.

Data LoggingSecure Configuration Storage

Use Scenario: Recording sensor readings and fault events in automotive telematics units.

IC Role / Device Role / Timing Role: Local persistent storage with atomic 256-byte page writes and wear-leveling support.

Use Value: RMW command enables single-command EEPROM-style updates; 100K endurance supports >10 years of daily logging.

Use Scenario: Storing cryptographic keys and calibration parameters in medical diagnostic equipment.

IC Role / Device Role / Timing Role: Secure OTP register bank with hardware lock (9Bh + 39h) preventing reprogramming.

Use Value: Three independent 128-byte OTP registers allow separation of root key, device ID, and factory calibration data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Winbond W25Q80DVSSIGSame 8-Mbit density, 1.65–3.6 V, 104 MHz max clock; lacks XiP mode and 0-4-4 continuous read; no RMW command.Supports standard quad SPI but not true execute-in-place; less suitable for latency-critical boot scenarios.Select when cost sensitivity outweighs XiP performance and RMW convenience.
Micron MT25QL80ABB8E12-0SIT8-Mbit, 1.7–2.0 V or 2.7–3.6 V dual-voltage operation; supports 133 MHz quad I/O and SFDP v1.6; includes hardware reset pin (separate RST#).Requires separate reset pin; no integrated HOLD/RESET dual-function pin; different OTP structure.Select when discrete hardware reset control is preferred over shared HOLD/RESET functionality.

Compared with W25Q80DVSSIG and MT25QL80ABB8E12-0SIT, the AT25XE081D uniquely combines XiP-optimized 0-4-4 mode, single-pin hardware reset/HOLD, and SRAM-emulating RMW - making it optimal for space-constrained, ultra-low-power boot and data logging designs where command efficiency and pin count matter.

Availability

AT25XE081D is available at Aetrix Electronics and suitable for industrial gateways, battery-powered IoT sensors, automotive telematics, and medical diagnostic equipment requiring stable component supply across extended product lifecycles.

Supply support for AT25XE081D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.

The AT25XE081D belongs to Renesas' AT25XE family of high-performance serial flash memories designed specifically for ultra-low-power, multi-I/O, and XiP-capable embedded systems demanding reliability and design flexibility.

FAQ

What is the maximum operating frequency supported by the AT25XE081D in quad I/O mode?

The AT25XE081D supports up to 133 MHz in quad I/O (1-4-4) mode, enabling theoretical throughput of 66.5 MB/s. This frequency is validated under 1.65–3.6 V supply and -40 °C to +85 °C ambient conditions per DS-AT25XE081D-147 Rev. M. The AT25XE081D achieves this using optimized internal timing and configurable I/O drive strength to maintain signal integrity at high speeds.

Does the AT25XE081D support true eXecute-in-Place (XiP) operation, and how is it enabled?

Yes, the AT25XE081D supports true XiP via its 0-4-4 command format (EBh/E7h), which eliminates opcode transmission after initial setup and enables continuous burst reads. The AT25XE081D requires no external address latching and maintains alignment across 4-byte boundaries. This mode is explicitly documented in Section 4.6 of the datasheet and verified for use with ARM Cortex-M and RISC-V hosts.

How does the Read-Modify-Write (RMW) command (0Ah) function in the AT25XE081D?

The AT25XE081D implements RMW as a single atomic command that reads a target byte, modifies specified bits, and writes back - all without host-side buffering. It operates on any aligned byte address and internally handles page boundary crossing. This feature is confirmed in Section 4.16 and Table 21 of the AT25XE081D datasheet, enabling EEPROM-like behavior for configuration registers.

What power-down modes does the AT25XE081D offer, and what are their typical current draws?

The AT25XE081D offers three low-power states: standby (30 µA), Deep Power-Down (DPD, 8.5 µA), and Ultra Deep Power-Down (UDPD, 5–7 nA). DPD and UDPD are entered via B9h and 79h commands respectively, and exited with ABh. These values are measured per DS-AT25XE081D-147 Rev. M Section 4.9 and Table 7, and are critical for battery longevity in always-on edge devices using the AT25XE081D.

Can the AT25XE081D be reset using only the HOLD/RESET pin, or is a software command required?

The AT25XE081D supports hardware reset via the HOLD/RESET pin per JEDEC standard - asserting this pin low for ≥20 ns resets internal logic and releases chip select. No software command (e.g., 99h) is needed. This dual-function pin also pauses ongoing transfers when asserted, as defined in Section 4.17 and Figure 22 of the AT25XE081D datasheet.

AT25XE081D-SHN-B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
8Mbit
Memory Organization:
1M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
32µs, 6.5ms
Access Time:
8 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

AT25XE081D-SHN-B FAQ

1.How can I place an order for AT25XE081D-SHN-B through Aetrix?

Please submit a Request for Quotation (RFQ) for AT25XE081D-SHN-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT25XE081D-SHN-B reliable?

The price and inventory of AT25XE081D-SHN-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25XE081D-SHN-B is usually 5 days.

3.What payment methods are accepted for AT25XE081D-SHN-B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25XE081D-SHN-B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT25XE081D-SHN-B?

AT25XE081D-SHN-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT25XE081D-SHN-B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT25XE081D-SHN-B?

For technical support, including AT25XE081D-SHN-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25XE081D-SHN-B requirements.

6.How does Aetrix verify that AT25XE081D-SHN-B is sourced from the original manufacturer or authorized distributors?

All AT25XE081D-SHN-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25XE081D-SHN-B meets industry standards.

7.What is the process for return or replacement of AT25XE081D-SHN-B?

All AT25XE081D-SHN-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25XE081D-SHN-B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT25XE081D-SHN-B part is unused and in its original packaging.

Return procedure for AT25XE081D-SHN-B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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