Microchip Technology AT49LD3200B-13TC
- Part No.:
- AT49LD3200B-13TC
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 86-TFSOP (0.400", 10.16mm Width)
- Datasheet:
-
AT49LD3200B-13TC.pdf
- Description:
- IC FLASH 32MBIT PAR 86TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AT49LD3200B-13TC from Microchip (formerly Atmel) is a 32-Mbit synchronous Flash memory organized as 2,097,152 × 16 bits (word mode) or 1,048,576 × 32 bits (double word mode), supporting burst read up to 100 MHz with RAS latency = 2 and CAS latency = 6, tSAC = 7 ns, and 3.0–3.6 V operation. It integrates an independent 8K × 16-bit asynchronous boot block with hardware lockout and sector erase architecture for embedded boot code storage in SDRAM-bus-compatible systems.
For engineers reviewing the AT49LD3200B-13TC datasheet, AT49LD3200B-13TC pinout, AT49LD3200B-13TC application, or AT49LD3200B-13TC equivalent, this device serves as a high-bandwidth, drop-in synchronous replacement for legacy SDRAM-coupled Flash in industrial control, network boot loaders, and FPGA configuration storage - requiring precise clock-synchronized timing, programmable burst length (4/8), and dual-mode x16/x32 organization.
Technical Context
The AT49LD3200B-13TC implements a synchronous DRAM-style interface with all operations aligned to the rising edge of CLK, enabling gapless burst reads and eliminating shadow RAM requirements. Its Mode Register Set (MRS) allows runtime configuration of RAS latency (1–2), CAS latency (2–8), burst length (4/8), and burst type (sequential/interleaved).
It features dual-voltage programming (3 V typical / 12 V fast), sector-erase architecture with eight 4-Mbit sectors, and hardware-protected asynchronous boot block (8K × 16) activated automatically at power-up. Input/output pins are LVTTL-compatible, and DQM enables cycle-accurate output masking during partial bursts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2,097,152 × 16 or 1,048,576 × 32) |
| Operating Voltage | 3.0 V to 3.6 V - ensures compatibility with 3.3 V logic systems and eliminates need for external voltage translators |
| Burst Read Speed | Up to 100 MHz (tCC = 10 ns, RAS = 2, CAS = 6) - delivers sustained bandwidth matching SDRAM bus timing |
| tSAC (CLK to Valid Output) | 7 ns (at 100 MHz) - enables tight setup windows for high-speed data capture on system clock edge |
| Sector Erase Time | 2.5 s at 3 V - deterministic erase duration per 4-Mbit sector supports predictable firmware update sequencing |
| Boot Block Size | 8K × 16 bits - provides dedicated, lockable space for immutable boot code without affecting main array |
| Package | 86-pin TSOP Type II (OCPL) - industry-standard footprint with off-center parting line for enhanced solder joint reliability |
Pinout & Package
86-pin TSOP Type II package with off-center parting line (OCPL) for improved mechanical reliability and thermal cycling performance in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | System Clock Input | Synchronizes all commands and data transfers on rising edge; defines tCC, tSAC, and timing boundaries |
| CS, RAS, CAS, MR, WE | Command Control Inputs | Enable row/column access, mode register programming, and write operations via synchronous command decoding |
| WORD | Organization Select | Configures x16 (low) or x32 (high) data bus width at power-up; must be stable before first command |
| DQ0–DQ31 | Bi-directional Data I/O | Carries read data, program inputs, and status polling (e.g., DQ7 for DATA polling); supports byte masking via DQM |
| VCC / VSS | Core Power / Ground | Supplies core logic and input buffers (3.0–3.6 V); decoupling required per high-speed Flash layout guidelines |
| VCCQ / VSSQ | I/O Power / Ground | Isolates output driver supply to maintain signal integrity and reduce crosstalk on DQ bus |
| VPP | Program/Erase Supply | Accepts 12 V for fast programming (30 µs/word) or 3 V for standard operation (100 µs/word) |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Latency & Burst | RAS/CAS latencies (1–2 / 2–8) and burst length/type (4/8, sequential/interleaved) configurable via MRS for system-level timing optimization |
| Asynchronous Boot Block | 8K × 16-bit region auto-enabled at power-up with hardware lockout - ensures secure, unalterable boot code execution without clock dependency |
| Sector Erase Architecture | Eight independent 4-Mbit sectors (256K words or 128K double words) enable granular firmware updates without full-array erasure |
| Input/Output Continuity Test Mode | Five-cycle command sequence maps each input pin to specific DQ outputs (e.g., MR → DQ0/DQ16) for automated board-level continuity verification |
| LVTTL-Compatible Interface | VIH = 2.0 V min, VOL = 0.4 V max at 2 mA - interoperates directly with standard 3.3 V microcontrollers and FPGAs without level shifters |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Loader |
|---|---|
Use Scenario: Storing field-upgradable firmware in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Synchronous Flash memory acting as primary nonvolatile code store on SDRAM bus, delivering burst-read boot images with <10 ns tSAC. Use Value: Eliminates need for external SRAM shadowing; sector erase enables safe over-the-air updates without disrupting active control logic. |
Use Scenario: Hosting boot loader and fail-safe recovery image in enterprise-grade routers requiring rapid cold-start and secure boot validation. IC Role / Device Role / Timing Role: Asynchronous boot block (8K × 16) provides immediate, clock-free access to critical initialization code; main array stores compressed firmware images. Use Value: Hardware lockout prevents accidental corruption of boot code; 12 V fast-programming reduces manufacturing flash time by >60% vs. 3 V only. |
| FPGA Configuration Memory | Medical Imaging System BIOS |
Use Scenario: Storing bitstream configuration data for high-end Xilinx/Intel FPGAs in diagnostic imaging equipment with strict EMI and reliability requirements. IC Role / Device Role / Timing Role: Synchronous interface aligns FPGA configuration clock (CCLK) with AT49LD3200B-13TC CLK, enabling deterministic bitstream streaming at up to 100 MHz. Use Value: Burst length = 8 and interleaved addressing minimize configuration latency; TSOP package supports compact, low-profile PCB layouts. |
Use Scenario: Holding certified BIOS and safety-critical startup routines in FDA-regulated medical devices requiring traceable, tamper-resistant firmware storage. IC Role / Device Role / Timing Role: Dual-mode organization (x16/x32) accommodates legacy 16-bit BIOS interfaces and modern 32-bit initialization sequences. Use Value: Boot block lockout verified via DQ0–DQ7 polling (01H/03H) provides auditable hardware-enforced protection against unauthorized modification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV320ETTI-70G | Asynchronous 32-Mbit NOR Flash; no CLK, no burst, no MRS; 70 ns access, 3.0–3.6 V | Requires external wait-state generation; unsuitable for SDRAM-bus integration or high-speed burst reads | Select when system lacks clock domain or requires simpler interface; not drop-in for AT49LD3200B-13TC's synchronous timing model |
| IS42S16160F-7BL | Synchronous SDRAM (16M × 16); volatile, no nonvolatile storage; 143 MHz, 3.3 V | Provides only runtime memory; cannot retain boot code or firmware across power cycles | Select only as companion RAM - AT49LD3200B-13TC complements it as nonvolatile boot source on same bus |
Compared with MX29LV320ETTI-70G and IS42S16160F-7BL, the AT49LD3200B-13TC uniquely combines nonvolatile storage, synchronous burst capability, and programmable timing - enabling single-chip boot+runtime memory architectures where clock-aligned throughput and firmware persistence are both essential.
Availability
AT49LD3200B-13TC is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network router boot loader deployment, FPGA configuration memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for AT49LD3200B-13TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Atmel in 2016 and continues to manufacture and support the SFlash™ family, leveraging high-performance CMOS process technology for reliable nonvolatile memory solutions.
The AT49LD3200B-13TC belongs to Microchip's synchronous Flash (SFlash™) product line, designed specifically to replace asynchronous Flash in SDRAM-bus-based systems - delivering boot code integrity, high-bandwidth firmware execution, and industrial-grade reliability.
FAQ
What is the key functional difference between AT49LD3200B-13TC and AT49LD3200-13TC?
The AT49LD3200B-13TC automatically activates its 8K × 16-bit asynchronous boot block at power-up, whereas the AT49LD3200-13TC requires explicit Mode Register Set (MRS) command to enable the same boot block. This makes AT49LD3200B-13TC more suitable for systems requiring guaranteed boot code availability without software intervention during cold start. Both share identical timing, pinout, and electrical specifications.
How does the WORD pin affect memory organization in AT49LD3200B-13TC?
In AT49LD3200B-13TC, the WORD pin selects data bus width: logic high configures x32 organization (1,048,576 × 32 bits), while logic low configures x16 organization (2,097,152 × 16 bits). The pin state must be set and stabilized before power-up or first command; changing it mid-operation is undefined. Address mapping and burst behavior adapt accordingly, with column address bits differing between modes (CA6 for x32, CA7 for x16).
Can AT49LD3200B-13TC operate without a 12 V supply?
Yes - AT49LD3200B-13TC operates fully at 3.0–3.6 V for read, write, and erase functions. The 12 V supply on VPP is optional and used only to accelerate programming (30 µs/word vs. 100 µs/word at 3 V) and sector erase (1.6 s vs. 2.5 s). Systems without 12 V capability can rely entirely on 3 V operation, though firmware update times will increase proportionally.
What is the purpose of the DQM pin in AT49LD3200B-13TC?
The DQM (Data-out Mask) pin in AT49LD3200B-13TC enables cycle-accurate suppression of output data during burst reads. When asserted high two clocks before a desired data cycle, it forces DQ0–DQ31 into high-impedance for that cycle - useful for masking invalid or unused words in partial bursts. It functions synchronously with CLK and does not affect internal memory state or timing parameters like tSAC or tOH.
How is boot block lockout verified and disabled in AT49LD3200B-13TC?
Boot block lockout status is verified using the Boot Block Lockout Verify command (5-cycle sequence ending in 90H), which outputs 00H/02H if unlocked or 01H/03H if locked on DQ0–DQ7. To disable lockout, the MR pin must be temporarily driven to 12 V after boot block activation - this overrides hardware protection. Once MR returns to TTL levels, lockout re-engages unless explicitly cleared via new programming.
AT49LD3200B-13TC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 86-TFSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 1M x 32, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 170 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 86-TSOP II
AT49LD3200B-13TC FAQ
1.How can I place an order for AT49LD3200B-13TC through Aetrix?
Please submit a Request for Quotation (RFQ) for AT49LD3200B-13TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT49LD3200B-13TC reliable?
The price and inventory of AT49LD3200B-13TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT49LD3200B-13TC is usually 5 days.
3.What payment methods are accepted for AT49LD3200B-13TC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT49LD3200B-13TC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT49LD3200B-13TC?
AT49LD3200B-13TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT49LD3200B-13TC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT49LD3200B-13TC?
For technical support, including AT49LD3200B-13TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT49LD3200B-13TC requirements.
6.How does Aetrix verify that AT49LD3200B-13TC is sourced from the original manufacturer or authorized distributors?
All AT49LD3200B-13TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT49LD3200B-13TC meets industry standards.
7.What is the process for return or replacement of AT49LD3200B-13TC?
All AT49LD3200B-13TC units undergo pre-shipment inspection (PSI). If there is an issue with AT49LD3200B-13TC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT49LD3200B-13TC part is unused and in its original packaging.
Return procedure for AT49LD3200B-13TC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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