Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology AT49LD3200B-13TI

Part No.:
AT49LD3200B-13TI
Manufacturer:
Microchip Technology
Category:
Memory
Package:
86-TFSOP (0.400", 10.16mm Width)
Datasheet:
AetrixAT49LD3200B-13TI.pdf
Description:
IC FLASH 32MBIT PAR 86TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,322

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

AT49LD3200B-13TI from Microchip (formerly Atmel) is a 32-Mbit synchronous Flash memory organized as 2,097,152 × 16 bits (word mode) or 1,048,576 × 32 bits (double word mode), operating at 3.0–3.6 V with programmable RAS/CAS latencies and burst lengths. It features an independent 8K × 16-bit asynchronous boot block, sector erase architecture (eight 4-Mbit sectors), and supports 100 MHz burst read (tSAC = 7 ns) in double-word mode for embedded boot code storage.

For engineers reviewing the AT49LD3200B-13TI datasheet, AT49LD3200B-13TI pinout, AT49LD3200B-13TI application, or AT49LD3200B-13TI equivalent, this device serves as a high-bandwidth, drop-in-capable replacement for SDRAM-bus-compatible Flash in boot-critical industrial controllers, FPGA configuration storage, and real-time firmware update systems requiring deterministic timing and hardware lockout protection.

Technical Context

The AT49LD3200B-13TI implements a synchronous DRAM-style interface with rising-edge clock sampling, supporting programmable RAS latency (1 or 2), CAS latency (2–8), burst length (4 or 8), and burst type (sequential or interleaved). Its dual-mode organization (x16/x32) is selected via the WORD pin at power-up, and all commands-including Mode Register Set, sector erase, and program-are synchronized to CLK with CKE-controlled power-down entry/exit.

It integrates an autonomous asynchronous boot block (8K × 16 bits, A0–A12 addressable) that activates automatically on power-up, enabling immediate code fetch without clock initialization. Sector erase (2.5 s @ 3 V) and fast program (100 µs/word @ 3 V) are executed via six-cycle and four-cycle command sequences respectively, with DATA polling (DQ7 complement) for cycle completion detection.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density32 Mbit (2,097,152 × 16 or 1,048,576 × 32)
Supply Voltage3.0 V to 3.6 V - ensures compatibility with 3.3 V logic buses and eliminates need for level shifters
Burst Read Speed≤100 MHz (RAS=2, CAS=6, tSAC=7 ns) - enables gapless streaming from active row without wait states
Sector Erase Time2.5 seconds at 3 V - allows predictable field firmware updates with minimal system downtime
Boot Block Size8K × 16 bits with hardware lockout - provides tamper-resistant storage for bootloader code and security keys
Package86-pin TSOP Type II (OCPL) - industry-standard footprint with improved mechanical reliability for reflow assembly
Input/Output InterfaceLVTTL-compatible (VIH=2.0 V, VOL=0.4 V @ 2 mA) - interoperable with standard SDRAM controllers and FPGA I/O banks

Pinout & Package

86-pin TSOP Type II package with off-center parting line (OCPL) for enhanced solder joint integrity and thermal cycling reliability. Pinout conforms to JEDEC MO-142 standard for synchronous Flash devices.

Pin/Terminal Circuit Role Design Meaning
CLKSystem Clock InputRising-edge-sampled master timing reference for all synchronous operations
CS, RAS, CAS, MR, WECommand Control InputsDecode row/column access, mode register programming, and write enable per JEDEC SDRAM protocol
WORDOrganization SelectConfigures x16 (low) or x32 (high) data bus width at power-up; must be stable before first command
DQ0–DQ31Bi-directional Data Bus32-bit parallel I/O path supporting burst reads, program writes, and continuity test mode diagnostics
VCC / VSSCore Power / GroundSupplies internal logic and input buffers (3.0–3.6 V); decoupling required per high-speed Flash layout rules
VCCQ / VSSQI/O Power / GroundSeparate supply for output drivers to maintain signal integrity and reduce switching noise coupling
VPPProgram/Erase SupplyAccepts 12 V for accelerated 30 µs/word programming or remains unconnected for 3 V-only operation

Key Features

Feature Design Value
Asynchronous Boot Block8K × 16-bit region auto-enabled at power-up, allowing immediate code execution without clock initialization
Hardware Lockout ProtectionOne-time programmable boot block lock via 12 V MR override, preventing accidental firmware corruption
Programmable Timing ParametersRAS/CAS latencies, burst length/type configured via Mode Register Set-enables single BOM across multiple clock domains
Continuity Test ModeFive-cycle command sequence maps each input pin to dedicated DQ outputs for automated PCB trace verification
DATA Polling (DQ7)Real-time status feedback during program/erase-eliminates need for fixed timeout delays in host firmware

Applications

Industrial PLC Firmware Storage FPGA Configuration Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile memory mapped to processor's synchronous memory bus, delivering boot code and runtime firmware with deterministic <7 ns tSAC access.

Use Value: Hardware lockout prevents unauthorized modification of safety-critical boot code; sector erase enables field-upgradable modules without full reflash.

Use Scenario: Holding bitstream configuration data for Xilinx Spartan or Intel Cyclone FPGAs in edge computing gateways.

IC Role / Device Role / Timing Role: Synchronous configuration memory interfaced directly to FPGA's dedicated configuration bus, supporting burst reads at up to 100 MHz.

Use Value: Dual x16/x32 organization allows flexible pinout mapping to FPGA I/O banks; continuity test mode validates PCB interconnects pre-deployment.

Medical Device Bootloader Automotive ECU Update Storage

Use Scenario: Secure storage of certified bootloader code in Class II medical imaging equipment requiring FDA-compliant firmware integrity.

IC Role / Device Role / Timing Role: Asynchronous boot block provides immediate, clock-free execution of verified startup routines upon power-on reset.

Use Value: 8K × 16-bit protected region meets IEC 62304 requirements for immutable boot code; DATA polling ensures reliable flash programming verification.

Use Scenario: Storing over-the-air (OTA) firmware patches for engine control units in ISO 26262 ASIL-B compliant vehicles.

IC Role / Device Role / Timing Role: High-reliability Flash memory on CAN-FD gateway microcontroller bus, supporting concurrent read/program operations via sector architecture.

Use Value: Eight independent 4-Mbit sectors allow atomic firmware updates without disrupting active vehicle functions; TSOP package qualified for automotive temperature range (-40°C to +85°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF3201C-70-4C-EKE32-Mbit x16 only; no x32 mode; 70 ns async access; no boot block lockoutLacks synchronous burst interface and hardware-protected boot region-requires external controller arbitrationSelect when legacy async interface suffices and boot security is managed externally
MX29LV320ETXGI-90G32-Mbit x16; 90 ns async access; top/bottom boot blocks; no CLK/CKE interfaceAsynchronous design limits bandwidth; lacks programmable latencies and burst modes for SDRAM-bus integrationChoose for cost-sensitive designs where synchronous timing constraints do not apply

Compared with SST39VF3201C-70-4C-EKE and MX29LV320ETXGI-90G, the AT49LD3200B-13TI delivers higher bandwidth via synchronous burst reads, deterministic boot timing through its auto-activated boot block, and hardware-enforced firmware protection-making it uniquely suited for real-time embedded systems requiring both performance and security.

Availability

AT49LD3200B-13TI is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, medical device bootloaders, and automotive ECU update storage requiring stable component supply across extended product lifecycles.

Supply support for AT49LD3200B-13TI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Atmel in 2016 and maintains full support for the legacy SFlash™ product family, including long-term manufacturing, documentation, and technical resources.

The AT49LD3200B-13TI belongs to Atmel's SFlash™ synchronous Flash memory line, designed specifically to replace slower asynchronous Flash on SDRAM buses while delivering boot-critical reliability, hardware-based security, and seamless integration with existing memory controllers.

FAQ

What is the key functional difference between AT49LD3200B-13TI and AT49LD3200-13TI?

The AT49LD3200B-13TI automatically activates its 8K × 16-bit asynchronous boot block on power-up, whereas the AT49LD3200-13TI requires explicit Mode Register Set (MRS) command to enable the same boot block. This makes AT49LD3200B-13TI ideal for systems needing guaranteed immediate boot code access without software intervention. Both share identical density, timing specs, and pinout.

Does AT49LD3200B-13TI support true synchronous burst reads at 100 MHz in x32 mode?

Yes, AT49LD3200B-13TI supports burst reads up to 100 MHz in double-word (x32) mode with RAS latency = 2 and CAS latency = 6, achieving a 10 ns cycle time and 7 ns tSAC. This is validated in the official datasheet (Rev. 1940B) under AC Read Characteristics and requires proper VCCQ decoupling and matched trace routing to sustain.

How is hardware lockout enabled on the boot block of AT49LD3200B-13TI?

Hardware lockout on the AT49LD3200B-13TI boot block is enabled by issuing the five-cycle Boot Block Lockout command (0xAA, 0x55, 0xAA, 0x55, 0x40) while VPP = 12 V and MR = 12 V. Once locked, the boot block cannot be programmed or erased using ≤3.6 V signals. Verification is performed via Boot Block Lockout Verify command reading DQ0–DQ7.

Can AT49LD3200B-13TI operate without connecting VPP?

Yes, AT49LD3200B-13TI operates fully at 3.0–3.6 V without VPP connection. VPP is optional and used only to enable 12 V fast programming (30 µs/word) or 12 V boot block lockout. In standard 3 V operation, program time is 100 µs/word and sector erase takes 2.5 seconds-both fully functional with VPP left unconnected or tied to VCC.

What does the "-13" suffix in AT49LD3200B-13TI signify?

The "-13" in AT49LD3200B-13TI denotes the maximum supported clock frequency grade: 13 ns minimum CLK cycle time, corresponding to ≤75 MHz operation (RAS=2, CAS=5). This is confirmed in the DC and AC Operating Range table (page 5), where AT49LD3200(B)-13 is specified for 0°C–70°C commercial and -40°C–85°C industrial temperature ranges at 3.0–3.6 V.

AT49LD3200B-13TI Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
86-TFSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
32Mbit
Memory Organization:
1M x 32, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
75 MHz
Write Cycle Time - Word, Page:
-
Access Time:
170 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
86-TSOP II

AT49LD3200B-13TI FAQ

1.How can I place an order for AT49LD3200B-13TI through Aetrix?

Please submit a Request for Quotation (RFQ) for AT49LD3200B-13TI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AT49LD3200B-13TI reliable?

The price and inventory of AT49LD3200B-13TI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT49LD3200B-13TI is usually 5 days.

3.What payment methods are accepted for AT49LD3200B-13TI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT49LD3200B-13TI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AT49LD3200B-13TI?

AT49LD3200B-13TI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AT49LD3200B-13TI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AT49LD3200B-13TI?

For technical support, including AT49LD3200B-13TI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT49LD3200B-13TI requirements.

6.How does Aetrix verify that AT49LD3200B-13TI is sourced from the original manufacturer or authorized distributors?

All AT49LD3200B-13TI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT49LD3200B-13TI meets industry standards.

7.What is the process for return or replacement of AT49LD3200B-13TI?

All AT49LD3200B-13TI units undergo pre-shipment inspection (PSI). If there is an issue with AT49LD3200B-13TI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AT49LD3200B-13TI part is unused and in its original packaging.

Return procedure for AT49LD3200B-13TI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

AT49LD3200B-13TI Tags

  • AT49LD3200B-13TI
  • AT49LD3200B-13TI PDF
  • AT49LD3200B-13TI Datasheet
  • AT49LD3200B-13TI Specifications
  • AT49LD3200B-13TI Images
  • Microchip Technology
  • Microchip Technology AT49LD3200B-13TI
  • Buy AT49LD3200B-13TI
  • AT49LD3200B-13TI Price
  • AT49LD3200B-13TI Distributor
  • AT49LD3200B-13TI Supplier
  • AT49LD3200B-13TI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER