Infineon Technologies AT8992M-A2-T-1

Overview

AT8992M-A2-T-1 from Infineon Technologies is a 10/100 Mbps Ethernet physical layer transceiver (PHY) in 100-pin MQFP package, supporting IEEE 802.3u Fast Ethernet, MII/RMII interface, and integrated 1.25 V regulator. It operates from a single 3.3 V supply and features auto-negotiation, energy-detect mode, and 100BASE-TX compliance for embedded network edge applications.

For engineers reviewing the AT8992M-A2-T-1 datasheet, AT8992M-A2-T-1 pinout, AT8992M-A2-T-1 application, or AT8992M-A2-T-1 equivalent, key selection criteria include MII timing budget, RMII clock tolerance (±50 ppm), integrated voltage regulation capability, and 100BASE-TX PHY compliance status per IEEE 802.3u Clause 25.

Technical Context

The AT8992M-A2-T-1 implements a full-duplex 100BASE-TX PHY with integrated line driver/receiver, adaptive equalization, and baseline wander correction. It supports both MII (25 MHz reference clock) and RMII (50 MHz reference clock) host interfaces with configurable I/O voltage (3.3 V or 2.5 V).

Its internal 1.25 V regulator powers the core logic and analog front-end, eliminating need for external LDOs. Auto-MDIX and energy-detect power-down reduce system-level power consumption during link inactivity.

Key Specifications

Pinout & Package

AT8992M-A2-T-1 is housed in a 100-pin plastic metric quad flat pack (MQFP) with 0.5 mm lead pitch, 14 mm × 20 mm body size, and exposed thermal pad for enhanced thermal dissipation in high-density industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 100BASE-TX PHY applications.

Compared with LAN8720AI-CP and RTL8201CP-GR, AT8992M-A2-T-1 uniquely combines RMII support, integrated 1.25 V regulation, and energy-detect mode-enabling lower component count, smaller footprint, and sub-150 µA idle power in battery-backed or thermally constrained edge nodes.

Availability

AT8992M-A2-T-1 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, smart building controllers, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for AT8992M-A2-T-1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial connectivity solutions, with global R&D and manufacturing infrastructure.

The AT8992M-A2-T-1 belongs to Infineon's Industrial Connectivity PHY product line, designed specifically for resource-constrained embedded systems needing robust, low-power, single-supply 100BASE-TX Ethernet physical layer interfacing.

FAQ

Does AT8992M-A2-T-1 support 1000BASE-T (Gigabit Ethernet)?

No. AT8992M-A2-T-1 is strictly a 10/100 Mbps PHY compliant with IEEE 802.3u (Fast Ethernet). It lacks the four-pair transceivers, DSP-based echo cancellation, and 125 MHz symbol rate required for 1000BASE-T. Its physical layer architecture is optimized for 100BASE-TX signaling only.

Can AT8992M-A2-T-1 operate with a 2.5 V I/O supply?

Yes. The I/O voltage is configurable via the VDDIO pin: tying it to 2.5 V enables 2.5 V-tolerant MII/RMII signaling, while 3.3 V enables standard 3.3 V I/O. Core logic remains powered by the internal 1.25 V regulator regardless of VDDIO setting.

Is an external crystal required for AT8992M-A2-T-1 operation?

No. AT8992M-A2-T-1 does not require an external crystal. It uses the host-provided REF_CLK (25 MHz for MII, 50 MHz for RMII) as its timing reference. No on-chip oscillator or crystal pins are present.

What is the thermal pad soldering requirement for the MQFP package?

The exposed thermal pad must be soldered to a dedicated PCB copper pour connected to ground plane via ≥4 thermal vias (0.3 mm diameter, spaced ≤2 mm apart). Insufficient thermal pad connection risks junction temperature exceeding 125°C under sustained 100 Mbps operation.