Microchip Technology ATSAMA5D26C-CU

Overview

ATSAMA5D26C-CU from Microchip Technology is an ultra-low-power Arm Cortex-A5-based microprocessor unit (MPU) operating at up to 500 MHz, integrating a 128-Kbyte L2 cache, TrustZone security, AES/SHA/TRNG crypto accelerators, and dual CAN-FD controllers. It supports DDR3L/LPDDR3 memory, 10/100 Ethernet with AVB and IEEE 1588 PTP, and is qualified for industrial temperature range (−40°C to +105°C). It targets secure industrial HMI, IoT gateways, and point-of-sale terminals requiring real-time connectivity and tamper-resistant firmware execution.

For engineers reviewing the ATSAMA5D26C-CU datasheet, ATSAMA5D26C-CU pinout, ATSAMA5D26C-CU application, or ATSAMA5D26C-CU equivalent, this page delivers verified technical context, validated package mapping (289-ball LFBGA), confirmed peripheral integration (dual MCAN, GMAC, LCDC, ISC), and precise alternative part comparisons - all grounded in Microchip's DS60001476H datasheet and official configuration summary.

Technical Context

The ATSAMA5D26C-CU implements an Armv7-A architecture Cortex-A5 core with NEON SIMD engine and floating-point unit, paired with a multilayer bus matrix supporting concurrent high-bandwidth transfers across DDR3L, QSPI, NAND, and peripheral domains. Its security architecture combines Arm TrustZone, 5-Kbyte scrambled SRAM with tamper erasure, hardware AESB on-the-fly encryption for DDR/QSPI, and Integrity Check Monitor (ICM) using SHA256.

Power management includes three low-power modes: Idle (CPU halted, peripherals active), Ultra-Low-Power (ULP0/ULP1 with sub-1 kHz clocking and partial wake-up), and Backup mode with RTC and DDR self-refresh. The device features two independent CAN-FD controllers compliant with non-ISO frame format, a 12-channel 12-bit ADC with resistive touchscreen support, and a 24-bit RGB LCD controller capable of 1024×768 resolution.

Key Specifications

Pinout & Package

ATSAMA5D26C-CU is housed in a 289-ball Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package measuring 14 mm × 14 mm with 0.8 mm ball pitch and 1.4 mm thickness. This package supports industrial thermal cycling and mechanical reliability per JEDEC JESD22-A108.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar MPU applications.

Compared with ATSAMA5D26C-CU, ATSAMA5D27C-CU reduces package size and peripheral set for compact industrial controllers, while ATSAMA5D28C-CU enhances physical security and safety certification readiness - both retain identical Cortex-A5 core, TrustZone, and crypto accelerator functionality.

Availability

ATSAMA5D26C-CU is available at Aetrix Electronics and suitable for industrial HMI terminals, secure IoT gateways, and point-of-sale systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ATSAMA5D26C-CU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, FPGAs, and security solutions, serving industrial, automotive, and communications markets with vertically integrated silicon and development tools.

The SAMA5D2 product line delivers ultra-low-power, Linux-capable MPUs with hardware-enforced security for industrial edge computing, targeting applications where functional safety, cryptographic agility, and long-term supply stability are critical design requirements.

FAQ

What is the maximum supported DDR memory type and capacity for ATSAMA5D26C-CU?

The ATSAMA5D26C-CU supports DDR3L, LPDDR2, and LPDDR3 memory types via its 32-bit DDR controller, with a maximum addressable capacity of 512 Mbytes. It requires DLL-off operation for DDR3L and LPDDR2/LPDDR3, and supports on-the-fly AES encryption/decryption for all configured DDR regions. The ATSAMA5D26C-CU datasheet specifies DDR_CKE, DDR_CS, and DDR_CAL signal requirements for reliable initialization and calibration.

Does ATSAMA5D26C-CU support IEEE 1588 Precision Time Protocol (PTP) in hardware?

Yes, the ATSAMA5D26C-CU integrates full hardware support for IEEE 1588 PTP within its GMAC Ethernet controller, including timestamping of ingress/egress frames at the PHY boundary, hardware-assisted correction for asymmetry, and synchronization with external grandmaster clocks. This enables sub-microsecond time accuracy in industrial automation and synchronized sensor networks without software timestamping overhead.

How many CAN interfaces does ATSAMA5D26C-CU provide, and what is their compliance status?

The ATSAMA5D26C-CU integrates two MCAN controllers supporting non-ISO CAN FD frame format, with SRAM-based mailboxes and time-triggered transmission. As stated in Microchip's official documentation, these controllers do not pass the ISO 16845-1:2016 CAN FD conformance test due to non-ISO framing. They remain fully interoperable with standard CAN FD transceivers and are widely deployed in industrial control networks where ISO compliance is not mandated.

What security features differentiate ATSAMA5D26C-CU from general-purpose MPUs?

The ATSAMA5D26C-CU embeds multiple hardware security layers: Arm TrustZone for memory/peripheral isolation, 5-Kbyte tamper-erased SRAM (1-Kbyte nonerasable), Integrity Check Monitor (ICM) using SHA256 to validate boot ROM and external memory, on-the-fly AESB encryption for DDR/QSPI, and a fuse box with 544 programmable bits for JTAG disable and BMS lock. These features collectively meet IEC 60730 Class B and support secure boot chains required for PCI PTS and Common Criteria evaluations.

Is ATSAMA5D26C-CU qualified for extended industrial temperature operation?

Yes, the ATSAMA5D26C-CU is explicitly qualified for extended industrial temperature range operation from −40°C to +105°C ambient, as confirmed in Microchip's SAMA5D2 series datasheet (DS60001476H, page 1). This qualification covers full functionality of the Cortex-A5 core, DDR3L interface, crypto accelerators, and all integrated peripherals under thermal stress, making it suitable for deployment in harsh environments such as factory floors and outdoor infrastructure.