Microchip Technology ATSAMA5D27C-D1G-CUR

Overview

ATSAMA5D27C-D1G-CUR from Microchip Technology is a System-in-Package (SiP) MPU integrating an Arm® Cortex®-A5 core (up to 500 MHz), TrustZone® security, NEON™ media engine, and 1 Gbit DDR2-SDRAM in a single TFBGA289 package. It delivers high-bandwidth memory access via a 16-bit DDR controller, supports Linux® OS deployment, and targets industrial HMI, edge gateway, and secure embedded applications requiring compact footprint and EMI-robust design.

For engineers reviewing the ATSAMA5D27C-D1G-CUR datasheet, ATSAMA5D27C-D1G-CUR pinout, ATSAMA5D27C-D1G-CUR application, or ATSAMA5D27C-D1G-CUR equivalent, key selection criteria include DDR2-SDRAM integration level (1 Gbit), TFBGA289 ballout compatibility, 128 I/O count with peripheral multiplexing, ultra-low-power modes with SRAM retention, and hardware crypto acceleration (AES/SHA/TRNG) for secure boot and runtime encryption.

Technical Context

The ATSAMA5D27C-D1G-CUR implements a dual-bus memory architecture: a 16-bit DDR2-SDRAM controller supporting Winbond W971GG6SB25I (1 Gbit, SSTL_18, CL=3, BL=8) and a separate 32-bit LPDDR2 controller (not populated in this variant). Its system clock domain runs up to 166 MHz, with dedicated PLLs for USB HS (480 MHz), audio (fractional 11.2896/12.288 MHz), and system timing (600–1200 MHz).

Security is enforced through Arm TrustZone®, on-the-fly AESB encryption/decryption of DDR2 traffic, 5 KB tamper-responsive SRAM, SHA256-based Integrity Check Monitor (ICM), and a programmable fuse box (544 bits). Peripheral subsystems include GMAC with IEEE 802.1AS/1588 support, dual CAN-FD controllers (MCAN), ISC image sensor interface, and LCD TFT controller (1024×768, 24-bit RGB).

Key Specifications

Pinout & Package

ATSAMA5D27C-D1G-CUR uses a 289-ball TFBGA package (0.8 mm pitch, 14 × 14 mm) with power/ground distribution optimized for DDR2 signal integrity. Ballout follows the SAMA5D27 DDR2-specific layout defined in DS60001484D Table 6-2, sharing pin compatibility with other TFBGA289 SAMA5D27 variants (e.g., ATSAMA5D27C-D5M).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar MPU applications.

Compared with ATSAMA5D27C-D1G-CUR, the LD1G variant trades DDR2 simplicity for LPDDR2 power efficiency and larger package, while the D28C-D1G adds certified tamper resilience at identical DDR2 performance - enabling tiered security deployment across product families without redesigning core software.

Availability

ATSAMA5D27C-D1G-CUR is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and medical point-of-care devices requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for ATSAMA5D27C-D1G-CUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, FPGAs, and security solutions, serving industrial, automotive, and communications markets with vertically integrated silicon and development tools.

The SAMA5D2 SIP product line integrates Arm Cortex-A5 MPUs with DDR/LPDDR2 memory to simplify high-performance embedded Linux designs - targeting applications demanding security, low power, and reduced PCB complexity without sacrificing peripheral richness.

FAQ

What memory type and capacity is integrated into the ATSAMA5D27C-D1G-CUR?

The ATSAMA5D27C-D1G-CUR integrates 1 Gbit DDR2-SDRAM (Winbond W971GG6SB25I) in a single SiP package. It does not include LPDDR2 or NAND flash. The DDR2 operates at 1.8 V with CAS Latency 3 and Burst Length 8, managed by a dedicated 16-bit DDR controller with on-the-fly AES encryption (AESB) enabled by default for secure data paths.

Is the ATSAMA5D27C-D1G-CUR pin-compatible with other SAMA5D2 SIP variants?

No - the ATSAMA5D27C-D1G-CUR uses the TFBGA289 package and is only pin-compatible with other SAMA5D27 DDR2 variants (e.g., ATSAMA5D27C-D5M). It is not compatible with SAMA5D27 LPDDR2 (TFBGA361) or SAMA5D225 (TFBGA196) packages. Ballout alignment follows DS60001484D Table 6-2 for 289-ball DDR2 configurations.

Does the ATSAMA5D27C-D1G-CUR support secure boot and runtime encryption?

Yes. The ATSAMA5D27C-D1G-CUR implements secure boot via ROM-based bootloader verifying signed images using SHA256 and RSA-2048. Runtime encryption is provided by AESB, which applies AES-128/192/256 on-the-fly to all DDR2 read/write transactions, protecting against bus snooping and cold-boot attacks without CPU intervention.

What industrial temperature range does the ATSAMA5D27C-D1G-CUR support?

The ATSAMA5D27C-D1G-CUR is rated for −40°C to +85°C ambient operation, meeting industrial-grade reliability requirements. This range is validated across all integrated functions including DDR2 memory controller timing, GMAC Ethernet PHY stability, and secure crypto engine performance - no derating or external thermal management is required.

Which communication interfaces are supported by the ATSAMA5D27C-D1G-CUR for industrial connectivity?

The ATSAMA5D27C-D1G-CUR supports dual CAN-FD (MCAN) controllers with SRAM mailboxes and time-triggered transmission, 10/100 Ethernet MAC (GMAC) with IEEE 1588 PTP hardware timestamping, two SDMMC hosts (eMMC 4.51/SD 3.0), and five FLEXCOMs configurable as USART/SPI/TWI - enabling simultaneous fieldbus, wireless backhaul, and local storage in edge gateway applications.