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Microchip Technology ATSAMB11G18A-MU-Y
- Part No.:
- ATSAMB11G18A-MU-Y
- Manufacturer:
- Microchip Technology
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ATSAMB11G18A-MU-Y.pdf
- Description:
- IC RF TXRX+MCU BLE 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,847
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Product details
Overview
ATSAMB11G18A-MU-Y from Microchip Technology (formerly Atmel) is an ultra-low-power Bluetooth 4.1 System-on-Chip integrating ARM Cortex-M0 processor, 256kB stacked Flash, 128kB RAM, BLE radio with -95dBm RX sensitivity, and integrated DC/DC converter. It serves as a standalone wireless MCU for battery-powered sensor nodes requiring secure, certified BLE connectivity in compact wearable and IoT edge devices.
For engineers reviewing the ATSAMB11G18A-MU-Y datasheet, ATSAMB11G18A-MU-Y pinout, ATSAMB11G18A-MU-Y application, or ATSAMB11G18A-MU-Y equivalent, this page delivers verified technical context, validated pin functions, real-world power-state current values, confirmed peripheral mappings, and manufacturer-validated alternative options for BLE SoC selection.
Technical Context
The ATSAMB11G18A-MU-Y implements a dual-domain power architecture with switchable and always-on digital I/O domains, enabling sub-1.25µA ultra-low-power standby with RTC and 8KB RAM retention. Its BLE subsystem uses a fully integrated transceiver with single-wire antenna interface, programmable TX output from -20 to +3.5dBm, and hardware-accelerated AES-128/SHA-256 for secure over-the-air updates.
It integrates a 26MHz crystal oscillator for BLE timing, a 32.768kHz RTC crystal interface, and two internal RC oscillators (2MHz sleep, 26MHz startup), all managed by a dedicated PMU with buck converter requiring only two external inductors and one capacitor. The ROM-hosted Bluetooth Smart stack includes GAP, GATT, ATT, Security Manager, and pre-certified profiles including Heart Rate and Proximity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Processor | ARM Cortex-M0, 32-bit, supports SWD debug and 4-channel DMA for low-latency peripheral handling |
| Memory | 256kB stacked Flash (non-volatile program storage), 128kB RAM (96kB user-accessible), 128kB ROM (BLE stack + boot firmware) |
| BLE Radio | 2.4GHz transceiver with -95dBm receiver sensitivity at 1Mbps, -20 to +3.5dBm programmable TX power, integrated T/R switch |
| Power Consumption | 1.25µA in Ultra_Low_Power state with RTC running and 8KB RAM retention; 3.0mA peak TX current at 0dBm output |
| Supply Range | 2.3V–4.3V battery input; integrated buck DC/DC converter outputs 1.2V core voltage with 85% efficiency at 10mA load |
| Clock Sources | 26MHz crystal oscillator (BLE timing), 32.768kHz RTC crystal interface, 2MHz internal RC oscillator (sleep mode) |
| GPIO & Peripherals | 23 digital + 4 mixed-signal GPIOs with 96kΩ programmable pull-up/down; 2×SPI, 2×I²C, 2×UART, 4×PWM, 4-channel 11-bit ADC |
Pinout & Package
The ATSAMB11G18A-MU-Y is housed in a 6×6mm, 0.4mm pitch, 48-pin QFN package with exposed thermal pad requiring PCB ground connection. Package thickness is 0.85mm (+0.15/−0.05mm), RoHS/green compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RFIO | RF Transceiver I/O | Single-wire antenna interface supporting both RX input and TX output; requires impedance-matched 50Ω trace |
| CHIP_EN | PMU Master Enable | Active-high enable controlling entire chip power domain; must rise after VDDIO per tIOCE timing constraint |
| VDDIO | I/O Supply Rail | Supplies all digital I/Os; voltage ≤ VBATT_BUCK; powers pull-up/down resistors and input buffers |
| RTC_CLK_P / RTC_CLK_N | RTC Crystal Interface | Differential 32.768kHz crystal connection; supports CL=7pF external crystal without added capacitance |
| LP_GPIO_0 / LP_GPIO_1 | SWD Debug Interface | Single-wire debug clock and I/O pins; enable programming and runtime debugging without JTAG overhead |
| VBATT_BUCK | Battery Input & Buck Input | Main battery connection feeding DC/DC converter; accepts 2.3–4.3V; decoupled via external 4.7µF capacitor |
Key Features
| Feature | Design Value |
|---|---|
| Bluetooth SIG Certification | Certified under QD ID D028678 (Controller) and D028679 (Host); eliminates need for end-product re-certification of BLE stack |
| Hardware Security Acceleration | Dedicated AES-128 and SHA-256 engines offload encryption from CPU, enabling secure OTA firmware updates with minimal latency impact |
| Ultra-Low-Power State Management | Three distinct low-power modes: Power_Down (<50nA), Ultra_Low_Power (1.25µA w/ RTC), MCU_Only (0.85mA idle) - each with defined wake sources and retention scope |
| Mixed-Signal GPIO Flexibility | Four GPIO_MS pins configurable exclusively for ADC input (11-bit resolution), with internal 96kΩ pull-up support and retention capability during sleep |
| Integrated Power Architecture | On-chip buck converter replaces external regulators; requires only two inductors (4.7µH, 9.1nH) and one capacitor (4.7µF) - reduces BOM count and PCB area |
Applications
| Smart Wearable Sensor Hub | Industrial Wireless Node |
|---|---|
Use Scenario: Compact wrist-worn device monitoring heart rate, skin temperature, and motion using BLE to stream data to smartphone. IC Role / Device Role / Timing Role: ATSAMB11G18A-MU-Y acts as primary application processor and BLE 4.1 radio controller, executing sensor fusion algorithms and managing advertising/connection intervals with 32.768kHz RTC precision. Use Value: 1.25µA ultra-low-power standby extends coin-cell battery life beyond 12 months while maintaining BLE discoverability and RTC wake events. | Use Scenario: Battery-powered vibration/temperature sensor deployed on rotating machinery in factory settings, transmitting alerts via BLE mesh gateway. IC Role / Device Role / Timing Role: ATSAMB11G18A-MU-Y serves as autonomous edge node with integrated ADC and quadrature decoder, sampling analog sensors and detecting motion events before initiating BLE transmission. Use Value: Integrated DC/DC converter enables operation directly from 3V lithium-thionyl chloride cells; -95dBm RX sensitivity ensures reliable link budget in electrically noisy industrial environments. |
| Medical Patch Monitor | Asset Tracking Beacon |
Use Scenario: Disposable ECG patch worn for 7-day cardiac monitoring, transmitting encrypted waveform snippets to nearby receivers. IC Role / Device Role / Timing Role: ATSAMB11G18A-MU-Y functions as secure BLE endpoint with hardware-accelerated AES-128, managing encrypted packet generation and low-duty-cycle advertising bursts. Use Value: ROM-stored BLE stack with certified GAP/GATT profiles reduces firmware validation effort; 256kB Flash accommodates medical-grade signal processing libraries and secure bootloader. | Use Scenario: Small form-factor logistics tag attached to pallets or containers, broadcasting unique ID and temperature at configurable intervals. IC Role / Device Role / Timing Role: ATSAMB11G18A-MU-Y operates as autonomous beacon with programmable advertising interval, leveraging internal 32kHz RC oscillator for timing when external crystal is disabled to save power. Use Value: 900nA Ultra_Low_Power Standby (no RTC) enables multi-year battery life; 3.5dBm TX boost improves range in warehouse multipath environments without external PA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NRF52832-QFAA-R | ARM Cortex-M4F core, 64kB RAM, 512kB Flash, +4dBm TX, no integrated DC/DC (requires external LDO) | Higher compute throughput for complex BLE mesh or concurrent protocol stacks; lacks integrated buck converter | Select when application demands >100MHz CPU performance or BLE mesh routing, and board space allows external regulator |
| CC2640R2FIPN | ARM Cortex-M3 core, 275kB ROM (BLE stack), 128kB Flash, -97dBm RX, integrated DC/DC, TI SimpleLink SDK | Superior RX sensitivity and mature TI ecosystem; ROM-based stack reduces Flash usage but limits customization | Select for long-range sensor networks where -97dBm sensitivity is critical, and TI's BLE SDK integration is preferred over Atmel START |
Compared with ATSAMB11G18A-MU-Y, the NRF52832 offers higher CPU performance but increases BOM complexity with external power regulation, while the CC2640R2F provides better RF sensitivity and SDK maturity at the cost of reduced Flash flexibility due to ROM-resident stack.
Availability
ATSAMB11G18A-MU-Y is available at Aetrix Electronics and suitable for smart wearables, medical patches, industrial wireless sensors, and asset tracking beacons requiring stable component supply across high-mix, low-volume production runs.
Supply support for ATSAMB11G18A-MU-Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Atmel in 2016 and maintains full support for the SAM family of microcontrollers and wireless SoCs, delivering robust toolchains, qualified firmware stacks, and long-term product roadmaps.
The SAMB11 product line was designed specifically for ultra-low-power, self-contained Bluetooth Smart endpoints in space-constrained, battery-operated applications - prioritizing RF integration, security acceleration, and minimal external component count.
FAQ
What is the certified Bluetooth version supported by the ATSAMB11G18A-MU-Y?
The ATSAMB11G18A-MU-Y implements Bluetooth 4.1 and is certified under Bluetooth SIG QD IDs D028678 (Controller) and D028679 (Host). Its ROM-hosted stack includes GAP, GATT, ATT, Security Manager, and pre-qualified profiles such as Heart Rate and Proximity - eliminating need for end-product re-certification of core BLE functionality.
Does the ATSAMB11G18A-MU-Y require external passive components for its DC/DC converter?
Yes, the ATSAMB11G18A-MU-Y DC/DC converter requires three external components: two inductors (4.7µH and 9.1nH) and one 4.7µF output capacitor. These are specified in the datasheet for guaranteed 85% efficiency at 10mA load and stable 1.2V core output; omitting or substituting them degrades RF performance and power efficiency.
How much RAM is available for application use in the ATSAMB11G18A-MU-Y?
The ATSAMB11G18A-MU-Y includes 128kB of embedded RAM, of which 96kB is available for application code and data storage. The remaining 32kB is reserved for BLE stack operations, retention buffers, and system control structures - confirmed in Section 8.2.1 of the official datasheet.
Can the ATSAMB11G18A-MU-Y operate without an external 32.768kHz crystal?
Yes, the ATSAMB11G18A-MU-Y supports RTC operation using its internal 32kHz RC oscillator in Ultra_Low_Power Standby mode (900nA), though accuracy is ±500ppm. For precise timing (e.g., scheduled BLE advertising or time-synced sensor sampling), the external 32.768kHz crystal on RTC_CLK_P/N is required - achieving ±20ppm with CL=7pF loading.
What debug interface does the ATSAMB11G18A-MU-Y support?
The ATSAMB11G18A-MU-Y supports Single Wire Debug (SWD) via LP_GPIO_0 (SWDCLK) and LP_GPIO_1 (SWDIO), enabling full programming, breakpointing, and memory inspection without JTAG header footprint. This interface is active in all non-Power_Down states and requires no additional voltage translation for 1.8–3.6V host debuggers.
ATSAMB11G18A-MU-Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v4.1
- Modulation:
- -
- Frequency:
- 2.4GHz
- Data Rate (Max):
- -
- Power - Output:
- 3.5dBm
- Sensitivity:
- -96dBm
- Memory Size:
- 256kB Flash, 128kB ROM, 128kB RAM
- Serial Interfaces:
- I2C, SPI, UART
- GPIO:
- 30
- Voltage - Supply:
- 2.3V ~ 4.3V
- Current - Receiving:
- 4.2mA
- Current - Transmitting:
- 3mA ~ 4mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-QFN (6x6)
ATSAMB11G18A-MU-Y FAQ
1.How can I place an order for ATSAMB11G18A-MU-Y through Aetrix?
Please submit a Request for Quotation (RFQ) for ATSAMB11G18A-MU-Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ATSAMB11G18A-MU-Y reliable?
The price and inventory of ATSAMB11G18A-MU-Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ATSAMB11G18A-MU-Y is usually 5 days.
3.What payment methods are accepted for ATSAMB11G18A-MU-Y?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ATSAMB11G18A-MU-Y transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ATSAMB11G18A-MU-Y?
ATSAMB11G18A-MU-Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ATSAMB11G18A-MU-Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ATSAMB11G18A-MU-Y?
For technical support, including ATSAMB11G18A-MU-Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ATSAMB11G18A-MU-Y requirements.
6.How does Aetrix verify that ATSAMB11G18A-MU-Y is sourced from the original manufacturer or authorized distributors?
All ATSAMB11G18A-MU-Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ATSAMB11G18A-MU-Y meets industry standards.
7.What is the process for return or replacement of ATSAMB11G18A-MU-Y?
All ATSAMB11G18A-MU-Y units undergo pre-shipment inspection (PSI). If there is an issue with ATSAMB11G18A-MU-Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ATSAMB11G18A-MU-Y part is unused and in its original packaging.
Return procedure for ATSAMB11G18A-MU-Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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