Texas Instruments AVC16T245DGGR-D

Overview

AVC16T245DGGR-D from Texas Instruments is a 16-bit dual-supply bus transceiver enabling bidirectional voltage-level translation between 1.2V–3.6V domains. It features independent A- and B-port supplies (VCCA/VCCB), direction-controlled data flow (DIR), tri-state outputs (OE), and I_off-enabled partial-power-down operation. Used in mixed-voltage system interconnects such as 1.8V processor ↔ 3.3V peripheral interfaces.

For engineers reviewing the AVC16T245DGGR-D datasheet, AVC16T245DGGR-D pinout, AVC16T245DGGR-D application, or AVC16T245DGGR-D equivalent, key selection criteria include VCCA/VCCB supply range compatibility, DIR/OE control logic referencing, maximum data rate per voltage pair (e.g., 380 Mbps at 1.8V→3.3V), I_off leakage specification, and TSSOP-48 thermal resistance (R_θJA = 69.9°C/W).

Technical Context

The AVC16T245DGGR-D implements a fully configurable dual-rail architecture: A-port I/Os and control inputs (1DIR, 2DIR, 1OE, 2OE) are referenced to VCCA; B-port I/Os are referenced to VCCB. Both rails operate independently across 1.2V–3.6V, enabling translation among 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V nodes without external level-shifting components.

VCC isolation ensures both ports enter high-impedance state if either VCCA or VCCB is driven to GND. I_off circuitry disables output drivers during power-down, preventing damaging backflow current. Control inputs VIH/VIL thresholds scale with VCCA, not VCCB, ensuring robust direction/enable signaling under asymmetric rail conditions.

Key Specifications

Pinout & Package

TSSOP-48 package (12.50 mm × 6.10 mm body size), lead pitch 0.5 mm, exposed pad not present. Pinout validated per TI SCES551F Rev. March 2024 Figure 5-2 and Pin Functions table.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Compared with SN74AVCH16T245DGGR and SN74LVC16T245DGGR, the AVC16T245DGGR-D provides unique dual-rail flexibility, VCC isolation for robust power sequencing, and I_off compliance - making it the sole option for mixed-voltage hot-swap and partial-power-down architectures.

Availability

AVC16T245DGGR-D is available at Aetrix Electronics and suitable for industrial automation controllers, enterprise storage backplanes, and telecom infrastructure requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for AVC16T245DGGR-D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-reliability interface solutions.

The AVC16T245DGGR-D belongs to TI's AVC (Advanced Very-Low-Voltage CMOS) family, engineered specifically for low-voltage bidirectional level translation in power-constrained, mixed-rail digital systems including portable computing and network edge devices.

FAQ

What voltage ranges are supported on VCCA and VCCB for the AVC16T245DGGR-D?

The AVC16T245DGGR-D supports independent supply voltages from 1.2 V to 3.6 V on both VCCA and VCCB. This enables translation between any combination of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V logic domains. Operation below 1.2 V is not specified, and exceeding 3.6 V violates absolute maximum ratings. The device remains functional down to 1.2 V per rail, with timing and drive strength degrading predictably per TI SCES551F Section 6.3.

How does the VCC isolation feature function in the AVC16T245DGGR-D?

The VCC isolation feature in the AVC16T245DGGR-D forces both A and B ports into high-impedance state whenever either VCCA or VCCB is driven to GND. This prevents false logic levels or bus contention during power-up, power-down, or fault conditions where one supply rail collapses before the other. The behavior is hardware-enforced and requires no external circuitry - it is intrinsic to the internal power-sense logic of the AVC16T245DGGR-D.

Can the AVC16T245DGGR-D be used for unidirectional level translation?

Yes, the AVC16T245DGGR-D supports unidirectional operation by holding DIR constant (high for A→B, low for B→A) and using OE to enable/disable the path. Its dual-rail design, 4.6V I/O tolerance, and sub-3ns propagation delay make it suitable for high-speed unidirectional links such as 1.8V sensor data to 3.3V ADC interface. Direction control remains fully functional even when used unidirectionally.

What is the maximum data rate achievable with the AVC16T245DGGR-D?

The maximum data rate for the AVC16T245DGGR-D is 380 Mbps, achieved when translating from 1.8V to 3.3V (VCCA = 1.8V, VCCB = 3.3V). Rates decrease with other voltage combinations: 200 Mbps for <1.8V→3.3V or 1.8V→2.5V, 150 Mbps for 1.8V→1.5V, and 100 Mbps for 1.8V→1.2V. These values are measured under specified load and transition conditions per TI SCES551F Section 1.

Does the AVC16T245DGGR-D require external pull-up or pull-down resistors on DIR or OE inputs?

No, external pull-up or pull-down resistors are not required on DIR or OE inputs of the AVC16T245DGGR-D because its control inputs have defined VIH/VIL thresholds referenced to VCCA and do not float. However, TI recommends tying OE to VCCA through a pull-up resistor during power-up to guarantee high-impedance state until firmware initializes DIR/OE - this prevents bus glitches. The resistor value depends on driver sink strength but is typically 10 kΩ.