Diodes Incorporated AZ1086D-3.3TRG1

Overview

AZ1086D-3.3TRG1 from BCD Semiconductor Manufacturing Limited is a fixed-output 3.3V, 1.5A low dropout linear regulator in TO-252-2 (1/3/4) package with 1.3V typical dropout at full load, on-chip thermal shutdown, and ±1% output voltage accuracy over temperature and load. It delivers stable post-regulation for switching supplies and powers microprocessor core logic in telecom and embedded systems.

For engineers reviewing the AZ1086D-3.3TRG1 datasheet, AZ1086D-3.3TRG1 pinout, AZ1086D-3.3TRG1 application, or AZ1086D-3.3TRG1 equivalent, this device is selected for high-current LDO requirements where thermal protection, tight load regulation (7 mV), and low quiescent current (5–10 mA) are critical in space-constrained PCB layouts.

Technical Context

The AZ1086D-3.3TRG1 implements a bandgap-referenced error amplifier driving a PNP pass transistor, enabling low dropout operation down to 1.3V at 1.5A. Its internal current limiting (2.3A) and thermal shutdown (165°C trip, 30°C hysteresis) operate independently of external components.

Designed for fixed 3.3V output, it eliminates external feedback resistors and supports input voltages from 4.75V to 15V. The device maintains 0.1% typical load regulation and 0.5 mV typical line regulation across its operating junction temperature range (0°C to 125°C).

Key Specifications

Pinout & Package

Package: TO-252-2 (1), TO-252-2 (3), or TO-252-2 (4) - surface-mount DPAK variant with exposed thermal pad for enhanced heat dissipation (θJA = 100°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with MIC29302WU-3.3 and TLV1117-33CDCY, AZ1086D-3.3TRG1 offers optimal balance of 1.5A capability, 1.3V dropout, and TO-252 thermal performance-making it preferred for mid-power telecom and embedded systems where input voltage margin is tight and board area is constrained.

Availability

AZ1086D-3.3TRG1 is available at Aetrix Electronics and suitable for telecom line cards, set-top box AV subsystems, and microprocessor core supplies requiring stable component supply with RoHS-compliant green packaging and tape-and-reel delivery.

Supply support for AZ1086D-3.3TRG1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

BCD Semiconductor Manufacturing Limited is a Shanghai-based analog and power IC designer specializing in high-reliability, cost-optimized linear regulators, MOSFETs, and mixed-signal solutions for industrial and communications markets.

The AZ1086 series was developed to address demand for robust, high-current LDOs in telecom infrastructure and consumer electronics-emphasizing thermal resilience, dropout efficiency, and drop-in compatibility with legacy TO-252 footprints.

FAQ

What is the minimum input voltage required for stable 3.3V output at 1.5A?

The AZ1086D-3.3TRG1 requires a minimum input voltage of 4.75V to maintain regulated 3.3V output at 1.5A load, based on its 1.3V typical dropout voltage. At 125°C junction temperature, dropout rises to 1.5V, so 4.8V minimum is recommended for full-temperature operation. Input below 4.75V causes output collapse or dropout mode entry.

Can AZ1086D-3.3TRG1 be used without an output capacitor?

No. A minimum 22μF output capacitor (tantalum or low-ESR ceramic) is mandatory for stability and transient response, per the datasheet. Omitting it causes oscillation, overshoot exceeding 10%, and potential thermal shutdown during load steps. The capacitor also reduces RMS output noise to 0.003% and improves PSRR above 1 kHz.

How does the thermal shutdown behave during continuous overload?

When junction temperature reaches 165°C, the AZ1086D-3.3TRG1 disables the pass transistor and holds output at zero until temperature falls by 30°C (to ~135°C), then resumes regulation. This hysteresis prevents rapid cycling. During sustained overload, duty cycle depends on PCB copper area: with 25 cm² 2-oz copper, shutdown occurs after ~45 seconds at 1.5A with 10V input.

Is the GND pin electrically isolated from the thermal tab?

Yes. In TO-252-2 (1), (3), and (4) packages, Pin 3 (GND) is internally bonded to the exposed thermal tab, making them electrically common. The tab must be connected to system ground via PCB copper pour. No isolation or insulation is provided between tab and Pin 3-using non-grounded heatsinks risks short circuits.