Diodes Incorporated AZ1086S-3.3TRE1

Overview

AZ1086S-3.3TRE1 from BCD Semiconductor Manufacturing Limited is a fixed-output 3.3V, 1.5A low dropout linear regulator in TO-263-3 package, featuring 1.3V typical dropout at full load, on-chip thermal shutdown, and ±1% output voltage accuracy over temperature and load. It delivers stable post-regulation for switching supplies and powers microprocessor core logic in embedded telecom and set-top box modules.

For engineers reviewing the AZ1086S-3.3TRE1 datasheet, AZ1086S-3.3TRE1 pinout, AZ1086S-3.3TRE1 application, or AZ1086S-3.3TRE1 equivalent, this device is selected for high-current LDO requirements where thermal protection, tight load regulation (±7 mV), and compatibility with 10μF–22μF ceramic/tantalum output capacitors are critical design constraints.

Technical Context

The AZ1086S-3.3TRE1 integrates a bandgap reference, current-limit circuit (2.3A), and thermal shutdown (165°C trip, 30°C hysteresis) into a single monolithic IC. Its internal architecture uses a PNP pass transistor to achieve low dropout while maintaining stability with minimal external components.

It operates across 0–125°C junction temperature range with input voltage up to 15V, supports fixed 3.3V output without external resistors, and maintains 0.1% typical load regulation and 0.5 mV typical line regulation under specified conditions.

Key Specifications

Pinout & Package

TO-263-3 (D²PAK) thermally enhanced surface-mount package with exposed tab for PCB heat sinking. Pin 1 = INPUT, Pin 2 = OUTPUT, Pin 3 = GND (fixed-output configuration).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO applications.

Compared with MIC29302WU-3.3 and LD1086DT-3.3, AZ1086S-3.3TRE1 offers superior thermal robustness (30°C hysteresis), lower quiescent current (5–10 mA), and tighter load regulation (±7 mV), making it optimal for thermally constrained, always-on embedded applications without enable control.

Availability

AZ1086S-3.3TRE1 is available at Aetrix Electronics and suitable for telecom equipment, set-top box modules, and microprocessor core supply applications requiring stable component supply, RoHS-compliant lead-free packaging, and tape-and-reel delivery for automated assembly.

Supply support for AZ1086S-3.3TRE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

BCD Semiconductor Manufacturing Limited is a Shanghai-based analog IC foundry and fabless designer specializing in high-voltage, high-current power management solutions for industrial, telecom, and consumer markets.

AZ1086S-3.3TRE1 belongs to the AZ1086 series of low-dropout linear regulators engineered for cost-sensitive, high-reliability post-regulation in space-constrained power systems where thermal resilience and fixed-output simplicity are essential.

FAQ

What is the minimum input voltage required for AZ1086S-3.3TRE1 to maintain regulation?

The minimum input voltage is 4.75V, derived from the 3.3V nominal output plus the 1.3V typical dropout voltage at 1.5A load. Operation below 4.75V risks dropout and output collapse, especially at elevated temperatures or full load. Absolute maximum input is 15V per datasheet specifications.

Can AZ1086S-3.3TRE1 be used with ceramic output capacitors?

Yes, it is stable with 10–22μF X5R/X7R ceramic capacitors, provided ESR is ≥10 mΩ. The datasheet confirms stability with low-ESR ceramics when combined with appropriate input capacitance (≥10μF). Avoid ultra-low-ESR (<5 mΩ) types unless validated with transient testing.

How does thermal shutdown behave during sustained overload?

At 165°C junction temperature, the device shuts down completely and remains off until junction cools by 30°C (to ~135°C), then resumes regulation. This hysteresis prevents rapid cycling during marginal thermal conditions and ensures safe cooldown before restart.

Is there a recommended PCB layout for optimal thermal performance?

Yes: maximize copper area connected to Pin 3 (GND) and the exposed thermal pad (Tab); use ≥4 thermal vias (0.3mm diameter) to inner ground planes; keep input/output capacitors within 5 mm of respective pins; avoid routing high-current traces over sensitive analog sections.