Diodes Incorporated AZ23C22-7-F

Overview

AZ23C22-7-F from Diodes Incorporated is a dual Zener diode in common-anode SOT23 package, rated for 300 mW total power dissipation, with nominal zener voltage 22 V (20.8–23.3 V range at 5 mA), ±5% matching between dual elements, and temperature coefficient +0.090 %/°C. It serves as precision voltage reference and overvoltage clamp in low-power analog monitoring circuits.

For engineers reviewing the AZ23C22-7-F datasheet, AZ23C22-7-F pinout, AZ23C22-7-F application, or AZ23C22-7-F equivalent, key selection criteria include dual-element matching tolerance, thermal resistance (417 °C/W), JEDEC-qualified reliability, automotive-grade availability (Q-suffix), and SOT23 footprint compatibility with automated assembly.

Technical Context

This dual Zener operates in reverse breakdown mode with two anodes tied internally and separate cathodes, enabling independent clamping or reference functions from one package. Its 300 mW rating applies to the combined dissipation of both diodes under derated ambient conditions.

The device exhibits a positive temperature coefficient (+0.090 %/°C) above 5 V, ensuring stable regulation across -65 °C to +150 °C operating range. Zener impedance is 55 Ω at 5 mA test current and 220 Ω at 1 mA knee current, supporting low-noise voltage stabilization in sensor biasing and ADC reference circuits.

Key Specifications

Pinout & Package

Package: SOT23 - surface-mount plastic package with matte tin-plated alloy 42 leadframe, moisture sensitivity level 1, UL 94V-0 rated molding compound, 0.008 g weight.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-Zener voltage reference applications.

Compared with BZX84-C22LT1G and DZ23C22-7-F, AZ23C22-7-F uniquely delivers matched dual 22 V references in a single common-anode configuration-reducing component count and improving trace-length symmetry critical for precision analog subsystems.

Availability

AZ23C22-7-F is available at Aetrix Electronics and suitable for industrial sensor conditioning, automotive cabin control modules, and smart energy meter power supplies requiring stable component supply, JEDEC-qualified reliability, and RoHS-compliant sourcing.

Supply support for AZ23C22-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

AZ23C22-7-F belongs to the AZ23 series of dual Zener diodes engineered for high-reliability voltage reference and transient suppression in space-constrained, thermally demanding applications such as automotive ECUs and industrial IoT edge nodes.

FAQ

What is the maximum continuous current each Zener element can handle at 22 V?

At 22 V nominal zener voltage and 300 mW total package power rating, each element supports up to ~6.8 mA continuous current assuming equal power sharing. Derating is required above 25 °C ambient per the 417 °C/W thermal resistance curve; at 85 °C ambient, max combined current drops to ~4.3 mA.

Can AZ23C22-7-F be used in automotive applications?

Yes - the AZ23C22-7-F is qualified to AEC-Q101 standards and manufactured in IATF 16949-certified facilities. For PPAP-capable automotive programs, specify the Q-suffix variant (e.g., AZ23C22Q-7-F), which undergoes additional change control and lot traceability protocols per automotive requirements.

How does the common-anode configuration affect PCB layout versus common-cathode alternatives?

The common-anode configuration places both anodes on Pin 1, requiring that node be routed to the lowest-potential point (e.g., ground or negative rail). This simplifies grounding for dual-rail clamping but demands careful separation of cathode traces to avoid crosstalk - unlike common-cathode parts where cathodes tie to the highest potential node.

Is thermal performance affected by PCB pad design?

Yes - the 417 °C/W junction-to-ambient rating assumes use of Diodes' recommended SOT23 pad layout (2.0 mm × 0.9 mm thermal pad with 2.9 mm length). Reducing copper area increases thermal resistance proportionally; adding internal ground-plane vias beneath the thermal pad can improve dissipation by up to 30% in multilayer boards.