Diodes Incorporated AZ23C4V3-7-F

Overview

AZ23C4V3-7-F from Diodes Incorporated is a dual common-anode 300 mW surface-mount Zener diode with nominal zener voltage 4.3 V (4.0–4.6 V range), 95 Ω maximum zener impedance at 5 mA, and −0.035 %/°C temperature coefficient - used for precision voltage reference and overvoltage clamping in power supply feedback loops.

For engineers reviewing the AZ23C4V3-7-F datasheet, AZ23C4V3-7-F pinout, AZ23C4V3-7-F application, or AZ23C4V3-7-F equivalent, key selection criteria include dual-zener matching (≤5% ΔV_Z), SOT23 package thermal resistance (417 °C/W), JEDEC-qualified reliability, and automotive-grade availability via Q-suffix variants.

Technical Context

This dual Zener operates in common-anode configuration: both cathodes are electrically isolated, enabling independent regulation or bidirectional clamping across two nodes sharing one anode connection. It supports stable DC reference generation under 5 mA test current with tight V_Z tolerance and low dynamic impedance.

Thermal derating begins above 25 °C ambient, maintaining 300 mW dissipation only up to 70 °C on FR-4 PCB with recommended pad layout; junction-to-ambient thermal resistance is fixed at 417 °C/W, limiting usable power in compact layouts without heatsinking.

Key Specifications

Pinout & Package

Package: SOT23 - molded green plastic, UL 94V-0 rated, matte tin-plated alloy 42 leadframe, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-Zener voltage reference applications.

Compared with BZX84-C4V3-7-F and DZ23C4V3-7-F, AZ23C4V3-7-F uniquely delivers matched dual regulation from a single anode node - reducing component count in multi-rail supervisors and simplifying layout for shared-return systems.

Availability

AZ23C4V3-7-F is available at Aetrix Electronics and suitable for power supply feedback networks, overvoltage protection circuits, and redundant voltage monitoring systems requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for AZ23C4V3-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability components for industrial, computing, and automotive markets since 1964.

AZ23C4V3-7-F belongs to the AZ23 series of dual Zener diodes engineered specifically for space-constrained, high-precision voltage reference and clamping applications where matched performance and JEDEC-compliant reliability are mandatory.

FAQ

What is the maximum continuous reverse current the AZ23C4V3-7-F can sustain without degradation?

The device is rated for 300 mW total power dissipation at 25 °C ambient. At nominal 4.3 V zener voltage, this corresponds to ~70 mA average reverse current. However, sustained operation above 5 mA is not recommended without thermal derating - the datasheet specifies electrical characteristics at I_ZT = 5 mA, and thermal resistance (417 °C/W) limits practical current to ~20 mA on standard FR-4 before exceeding 150 °C junction temperature.

Can AZ23C4V3-7-F be used in automotive applications?

Yes - the base part is AEC-Q101 qualified (HBM ESD 8 kV, MM 400 V) and manufactured in IATF 16949-certified facilities. For formal automotive qualification, specify the Q-suffix variant (e.g., AZ23C4V3Q-7-F), which undergoes PPAP documentation and extended stress testing per AEC requirements while retaining identical electrical and thermal specs.

How does the common-anode configuration affect PCB layout compared to common-cathode dual Zeners?

In common-anode configuration, Pin 2 (anode) must connect to the lowest-potential node (e.g., ground or negative rail), while Pins 1 and 3 (cathodes) route to separate higher-potential nodes. This simplifies grounding in systems where multiple regulated voltages share a common return, but prevents direct connection to positive rails without level-shifting. Common-cathode alternatives require the opposite routing strategy.

Is there a recommended PCB pad layout for optimal thermal performance?

Yes - Diodes specifies a recommended SOT23 pad layout: 2.0 mm pad width (C), 0.8 mm pad length (X), 1.35 mm spacing between pads (X1), 0.9 mm solder mask opening (Y), and 2.9 mm overall land pattern length (Y1). Using this layout achieves the published 417 °C/W R_θJA; reducing copper area or omitting thermal vias increases thermal resistance by up to 35%, risking premature thermal shutdown.