Diodes Incorporated AZ23C8V2-7-F

Overview

AZ23C8V2-7-F from Diodes Incorporated is a dual common-anode surface-mount Zener diode with nominal 8.2 V zener voltage (7.7–8.7 V range), 300 mW power dissipation, and ±5% matching between the two zeners in one SOT23 package. It delivers precision voltage reference and overvoltage protection in compact power management circuits for industrial sensor signal conditioning.

For engineers reviewing the AZ23C8V2-7-F datasheet, AZ23C8V2-7-F pinout, AZ23C8V2-7-F application, or AZ23C8V2-7-F equivalent, key selection criteria include matched zener voltage tolerance, low zener impedance (7.0 Ω @ 5 mA), temperature coefficient (+0.055 %/°C), and JEDEC-qualified reliability for stable operation across -65°C to +150°C.

Technical Context

This dual Zener operates in reverse breakdown mode with both elements sharing a common anode terminal, enabling bidirectional clamping or dual-reference generation from a single footprint. Its matched voltage tracking (≤5% ΔV_Z) supports differential sensing and rail-to-rail voltage monitoring without external trimming.

The device uses silicon planar epitaxial construction with matte tin-plated alloy 42 leads, rated for 8 kV HBM ESD per AEC-Q101, and exhibits low thermal resistance (417 °C/W) on FR-4 PCBs-critical for thermal stability in high-density DC-DC feedback loops.

Key Specifications

Pinout & Package

Package: SOT23 - 3-terminal plastic surface-mount package with 0.915 mm lead pitch, 2.40 mm body length, and 0.40 mm thickness; RoHS-compliant, halogen-free, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Zener reference applications.

Compared with BZX84-C8V2LT1G and DZ23C8V2-7-F, AZ23C8V2-7-F uniquely supports matched dual-voltage referencing from a common anode, enabling tighter tolerance tracking in differential circuits without layout or bill-of-material changes.

Availability

AZ23C8V2-7-F is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, DC-DC converter feedback reference, and automotive body control module (BCM) IO protection requiring stable component supply and long-term lifecycle support.

Supply support for AZ23C8V2-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and distribution operations across Asia, Europe, and North America.

The AZ23 series belongs to Diodes' precision Zener portfolio designed specifically for space-constrained, high-reliability voltage reference and protection applications in industrial automation, automotive subsystems, and power management.

FAQ

What is the maximum reverse current (I_R) specification for AZ23C8V2-7-F at 6.0 V?

The datasheet specifies a maximum reverse leakage current of 0.1 µA at V_R = 6.0 V and T_A = 25°C. This ultra-low leakage ensures minimal loading on high-impedance sensor outputs and preserves accuracy in battery-powered monitoring nodes where quiescent current must remain sub-microamp.

Is AZ23C8V2-7-F qualified for automotive applications?

AZ23C8V2-7-F is commercially qualified and meets AEC-Q101 stress-test requirements including 8 kV HBM ESD, but it is not automotive-grade (Q-suffix). For production automotive use, Diodes offers the Q-qualified variant AZ23C8V2Q-7-F, which adds PPAP documentation, IATF 16949 manufacturing, and full AEC-Q200 compliance.

How does the common-anode configuration affect circuit implementation?

In the common-anode configuration, both Zener cathodes are independent while the anode connects to ground or the most negative potential. This enables clamping of two positive-going signals to the same reference or generating two matched references referenced to a common return-ideal for rail-splitting or differential ADC biasing without floating grounds.

What is the recommended PCB pad layout for thermal performance?

Diodes specifies a SOT23 pad layout with X = 0.8 mm, Y = 0.9 mm, X1 = 1.35 mm, Y1 = 2.9 mm, and C = 2.0 mm (center-to-center). Using this layout on FR-4 achieves the rated 417 °C/W junction-to-ambient thermal resistance; reducing copper area or omitting thermal vias increases junction temperature by up to 35°C at full 300 mW dissipation.