NXP Semiconductors B4860NSE7QUMD
- Part No.:
- B4860NSE7QUMD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1020-BBGA, FCBGA
- Datasheet:
-
B4860NSE7QUMD.pdf
- Description:
- IC MPU QORIQ 1.8GHZ 1020FCPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,904
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
B4860NSE7QUMD from NXP (formerly Freescale) is a 28 nm multi-standard wireless baseband SoC for macro base stations, integrating four dual-threaded e6500 Power Architecture cores (up to 1.8 GHz), six SC3900FP StarCore DSP cores (up to 1.2 GHz), MAPLE-B3 baseband accelerators, dual 64-bit DDR3/3L controllers, and CPRI v4.2 interfaces - enabling concurrent processing of three 20 MHz LTE sectors in FDD/TDD and LTE-Advanced Rel.10/11 deployments.
For engineers reviewing the B4860NSE7QUMD datasheet, B4860NSE7QUMD pinout, B4860NSE7QUMD application, or B4860NSE7QUMD equivalent, key selection considerations include its 1020-pin FC-PBGA package, hardware-accelerated FEC/FFT/MIMO equalization, DPAA-based packet processing, IEEE 1588v2 timing support, and industrial-temperature operation for LTE/WCDMA macrocell infrastructure.
Technical Context
The B4860NSE7QUMD implements layered wireless protocol processing via heterogeneous compute: Layer 1 offloaded to MAPLE-B3 (Turbo/Viterbi, FFT/iFFT, MIMO MMSE equalizer with IRC/SIC/PIC) and SC3900FP cores (32 MAC/cycle, SIMD8); Layer 2/3 handled by e6500 cores with DPAA (frame/queue/buffer managers), AltiVec SIMD, and SMT threading.
Hardware coherency is maintained through CoreNet switching fabric; memory subsystem includes two 64-bit DDR3/3L controllers (1.867 GHz, 512 KB L3 cache each), ECC protection, and 12.3 MB total on-die memory; high-speed I/O comprises eight CPRI v4.2 (9.8 Gbps), two x4 PCIe Gen II, two Serial RapidIO Gen II (5 Gbps), and six Ethernet ports with IEEE 1588v2 timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Process Technology | 28 nm - Enables high core density and power efficiency for macro base station thermal budgets. |
| CPU Cores | 4× e6500 dual-threaded 64-bit Power Architecture cores at up to 1.8 GHz - Delivers layer 2/3 packet processing with SMT and AltiVec acceleration. |
| DSP Cores | 6× SC3900FP StarCore FVP cores at up to 1.2 GHz - Provides programmable layer 1 PHY execution with 32 MAC/cycle and SIMD8 vector throughput. |
| MAPLE Accelerators | MAPLE-B3 baseband engine - Hardware-accelerates Turbo/Viterbi coding, FFT/iFFT, MIMO MMSE equalization (IRC/SIC/PIC), PDSCH/PUSCH flows, and WCDMA chip-rate processing. |
| Memory Interface | Dual 64-bit DDR3/3L controllers at 1.867 GHz, each with 512 KB L3 cache - Supports high-bandwidth, low-latency access for real-time baseband buffers and control tables. |
| High-Speed I/O | 8× CPRI v4.2 (9.8 Gbps), 2× x4 PCIe Gen II, 2× Serial RapidIO Gen II (5 Gbps), 6× Ethernet with IEEE 1588v2 - Enables fronthaul/backhaul connectivity and precise time synchronization. |
| Package | 1020-pin FC-PBGA, 1 mm pitch - Industrial-temperature rated, RoHS-compliant, with defined thermal and signal integrity characteristics for telecom PCBs. |
Pinout & Package
1020-pin Fine-Pitch Ball Grid Array (FC-PBGA) with 1 mm ball pitch, designed for industrial-temperature operation (–40°C to +105°C) and compliant with JEDEC MO-271. Package supports controlled impedance routing, thermal vias, and power delivery networks optimized for multi-GHz SerDes and DDR3/3L signaling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | Supplies regulated voltage to e6500 and SC3900FP cores; requires tight regulation and low-noise filtering per VID specification. |
| VDD_IO | I/O power supply | Configurable nominal voltages (1.0 V, 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V) supporting mixed-voltage interface standards. |
| DDR3_CLK/ADDR/DQS | DDR3/3L memory interface | Dual 64-bit channels with differential clocks, address/command buses, and DQS strobes - requires matched trace lengths and termination per JEDEC DDR3 spec. |
| CPRI_TX/RX[0:7] | CPRI v4.2 serial lanes | Eight bidirectional 9.8 Gbps SerDes lanes for fronthaul transport between BBU and RRH; supports deterministic latency and jitter tolerance. |
| PCIe_RX/TX[0:3] | PCIe Gen II x4 interface | Four-lane PCIe root complex port for host communication, debug, or expansion - requires AC-coupled differential pairs and reference clock routing. |
| SRIO_PORT[0:1] | Serial RapidIO Gen II | Two 5 Gbps full-duplex links for chip-to-chip interconnect in distributed baseband systems - supports message passing and coherent memory access. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Combines e6500 CPU cores (layer 2/3), SC3900FP DSP cores (layer 1 control), and MAPLE-B3 accelerators (PHY algorithm offload) - enables scalable, standards-adaptable baseband processing without firmware rewrites. |
| DPAA Data Path Acceleration | Integrated frame manager, queue manager, and buffer manager reduce CPU overhead for packet classification, distribution, and forwarding - freeing >40% of e6500 cycles for value-added services. |
| MAPLE-B3 Baseband Acceleration | Hardwired FEC (Turbo/Viterbi), FFT/iFFT, MIMO MMSE equalizer (with IRC/SIC/PIC), and embedded PDSCH/PUSCH data flows - delivers deterministic sub-100 ns latency for critical PHY functions. |
| Multi-Standard Protocol Support | Native hardware and software support for LTE FDD/TDD, LTE-Advanced Rel.10/11, WCDMA/HSPA+, and simultaneous multi-mode operation - eliminates need for separate ASICs per air interface. |
| Industrial Thermal & Reliability | 1020-pin FC-PBGA package qualified for –40°C to +105°C operation with RoHS compliance and JEDEC MO-271 mechanical reliability - suitable for uncooled outdoor macro base station enclosures. |
Applications
| Macrocell LTE FDD Base Station | Macrocell LTE-Advanced TDD Base Station |
|---|---|
Use Scenario: High-capacity urban macro site serving three 20 MHz FDD sectors with carrier aggregation and MIMO-4x4. IC Role / Device Role / Timing Role: Primary baseband SoC handling full stack L1–L3 processing, CPRI fronthaul, and backhaul Ethernet with IEEE 1588v2 time sync. Use Value: Enables 3×20 MHz sector processing within single B4860NSE7QUMD die, reducing BOM count and power vs. multi-chip solutions while maintaining <10 µs PHY latency. | Use Scenario: Dense deployment in TDD-LTE spectrum with dynamic UL/DL slot allocation and CoMP coordination across cells. IC Role / Device Role / Timing Role: Real-time PHY scheduler and beamforming engine using MAPLE-B3 MIMO equalizers and SC3900FP vector processing. Use Value: Hardware-accelerated IRC/SIC/PIC equalization and PUSCH/PDSCH embedded flows deliver 25% higher spectral efficiency vs. software-only implementations. |
| WCDMA/HSPA+ Macro Base Station | Converged LTE/WCDMA Dual-Mode Base Station |
Use Scenario: Legacy network upgrade path supporting HSPA+ DC-HSDPA and 64-QAM modulation in 5 MHz carriers. IC Role / Device Role / Timing Role: Baseband processor executing WCDMA chip-rate processing, path search, and turbo decoding via MAPLE-B3 accelerators. Use Value: Single B4860NSE7QUMD replaces discrete DSP+FPGA solutions, cutting board area by 35% and power consumption by 42% at 2×2 MIMO. | Use Scenario: Greenfield deployment requiring seamless handover between LTE and WCDMA layers in same physical site. IC Role / Device Role / Timing Role: Unified SoC running concurrent LTE and WCDMA stacks with shared memory, cache coherency, and common CPRI fronthaul interface. Use Value: Eliminates inter-ASIC latency and synchronization drift; enables sub-1 ms inter-RAT handover using shared L2/L3 context and unified timing domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar baseband processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx Zynq UltraScale+ RFSoC ZU28DR | Integrates RF DAC/ADC, ARM Cortex-A53/A53 cores, and FPGA fabric - no dedicated MAPLE-like baseband accelerators; relies on HLS-synthesized IP for FEC/FFT. | Targeted at flexible, software-defined radio and small-cell applications; lacks native CPRI v4.2 and industrial temperature rating. | Preferred when RF sampling integration or field-upgradable PHY algorithms are required; not drop-in for macro base station B4860NSE7QUMD deployments. |
| Intel Agilex F-Series FPGA + Intel Xeon D | Discrete CPU+FPGA architecture - no unified cache coherency or integrated DPAA; requires external interconnect and custom driver stack. | Suitable for lab prototyping and specialized test equipment; not optimized for volume macro base station production or telecom qualification. | Chosen for maximum flexibility in non-standard waveforms or proprietary PHY extensions; adds system-level complexity and validation burden vs. B4860NSE7QUMD's pre-verified pipeline. |
Compared with Xilinx ZU28DR and Intel Agilex+FPGA solutions, the B4860NSE7QUMD delivers lower total power, deterministic PHY latency, telecom-grade qualification, and pre-integrated CPRI/1588v2 - making it the only option qualified for production LTE/WCDMA macro base stations requiring three-sector 20 MHz throughput.
Availability
B4860NSE7QUMD is available at Aetrix Electronics and suitable for macro base station design, LTE-Advanced infrastructure rollout, and WCDMA/HSPA+ network modernization requiring stable component supply, long-term lifecycle support, and industrial-temperature operation.
Supply support for B4860NSE7QUMD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the acquisition of Freescale Semiconductor in 2015, specializing in secure connectivity solutions for automotive, industrial, and communications markets.
The QorIQ Qonverge platform - including the B4860NSE7QUMD - was engineered specifically for wireless infrastructure, delivering integrated, standards-compliant baseband processing with hardware acceleration to replace multi-chip DSP+FPGA+CPU designs in macro base stations.
FAQ
What is the primary function of the B4860NSE7QUMD in wireless infrastructure?
The B4860NSE7QUMD serves as a fully integrated baseband system-on-chip for macrocell base stations, executing the complete LTE/WCDMA physical and protocol stack - from MAPLE-B3-accelerated PHY layer functions (FEC, FFT, MIMO equalization) to e6500-core-based L2/L3 packet processing and CPRI/Ethernet fronthaul/backhaul. Its architecture eliminates the need for external DSPs or FPGAs in standards-compliant deployments.
Does the B4860NSE7QUMD support IEEE 1588v2 Precision Time Protocol?
Yes, the B4860NSE7QUMD integrates IEEE 1588v2 timestamping capability directly into its six Ethernet controllers, enabling sub-100 ns time synchronization accuracy for TDD-LTE and CoMP applications. This hardware-assisted PTP support is validated for telecom-grade timing distribution without requiring external timing ICs or software compensation layers.
What memory interfaces does the B4860NSE7QUMD provide?
The B4860NSE7QUMD features two independent 64-bit DDR3/3L memory controllers operating at 1.867 GHz, each backed by 512 KB of dedicated L3 cache and supporting ECC for both on-die and off-die memory. These interfaces are optimized for low-latency access to large baseband buffers, channel estimation tables, and control-plane data structures required in multi-sector LTE processing.
Is the B4860NSE7QUMD pin-compatible with other QorIQ Qonverge devices like the B4460?
No, the B4860NSE7QUMD is not pin-compatible with the B4460 or other QorIQ Qonverge variants. It uses a unique 1020-pin FC-PBGA package with distinct power, I/O, and SerDes pin allocations reflecting its higher core count, dual DDR controllers, and expanded CPRI/PCIe/SRIO interface set - requiring dedicated PCB layout and thermal design.
What development tools are supported for the B4860NSE7QUMD?
NXP provides the B4860QDS evaluation board, Eclipse-based IDE, StarCore and Power Architecture compilers/debuggers, Nexus-compliant trace tools, and optimized reference libraries for LTE/WCDMA PHY layer functions. These tools enable full-stack software development, cycle-accurate simulation, and hardware-in-the-loop validation of B4860NSE7QUMD-based baseband systems.
B4860NSE7QUMD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1020-BBGA, FCBGA
- Series:
- QorIQ Qonverge B
- Packaging:
- Box
- Product Status:
- Active
- Core Processor:
- PowerPC e6500
- Number of Cores/Bus Width:
- 4 Core, 64-Bit
- Speed:
- 1.8GHz
- Co-Processors/DSP:
- Signal Processing; SC3900FP FVP - 6 Core
- RAM Controllers:
- DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 1/2.5Gbps (4), 1/2.5/10Gbps (2)
- SATA:
- -
- USB:
- USB 2.0 (1)
- Voltage - I/O:
- 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1020-FCPBGA (33x33)
- Additional Interfaces:
- I2C, MMC/SD, RapidIO, SPI, UART
B4860NSE7QUMD FAQ
1.How can I place an order for B4860NSE7QUMD through Aetrix?
Please submit a Request for Quotation (RFQ) for B4860NSE7QUMD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B4860NSE7QUMD reliable?
The price and inventory of B4860NSE7QUMD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B4860NSE7QUMD is usually 5 days.
3.What payment methods are accepted for B4860NSE7QUMD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B4860NSE7QUMD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B4860NSE7QUMD?
B4860NSE7QUMD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B4860NSE7QUMD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B4860NSE7QUMD?
For technical support, including B4860NSE7QUMD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B4860NSE7QUMD requirements.
6.How does Aetrix verify that B4860NSE7QUMD is sourced from the original manufacturer or authorized distributors?
All B4860NSE7QUMD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B4860NSE7QUMD meets industry standards.
7.What is the process for return or replacement of B4860NSE7QUMD?
All B4860NSE7QUMD units undergo pre-shipment inspection (PSI). If there is an issue with B4860NSE7QUMD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B4860NSE7QUMD part is unused and in its original packaging.
Return procedure for B4860NSE7QUMD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
B4860NSE7QUMD Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

