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NXP Semiconductors B4860NSN7QUMD
- Part No.:
- B4860NSN7QUMD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1020-BBGA, FCBGA
- Datasheet:
-
B4860NSN7QUMD.pdf
- Description:
- IC MPU QORIQ 1.8GHZ 1020FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,779
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Product details
Overview
B4860NSN7QUMD from NXP Semiconductors (formerly Freescale) is a multi-standard wireless baseband processor SoC for macro base stations, integrating four 1.8 GHz dual-threaded e6500 Power Architecture cores, six 1.2 GHz SC3900FP StarCore FVP DSP cores, MAPLE-B3 baseband accelerators, dual 64-bit DDR3/3L controllers, and CPRI v4.2 interfaces - enabling concurrent LTE FDD/TDD, LTE-Advanced, and WCDMA processing across three 20 MHz sectors.
For engineers reviewing the B4860NSN7QUMD datasheet, B4860NSN7QUMD pinout, B4860NSN7QUMD application, or B4860NSN7QUMD equivalent, key selection considerations include its 1020-pin FC-PBGA package, 12.3 MB on-die memory, DPAA-accelerated packet processing, MAPLE-based FEC/FFT/MIMO acceleration, and industrial-temperature support for carrier-grade infrastructure deployment.
Technical Context
The B4860NSN7QUMD implements layered wireless protocol processing via hardware-software partitioning: Layer 1 functions (Turbo/Viterbi decoding, FFT/iFFT, MIMO equalization, PDSCH/PUSCH flows) are offloaded to MAPLE-B3 accelerators and SC3900FP cores, while Layer 2/3 packet handling, security, and control plane tasks run on e6500 cores with DPAA (Frame/Queue/Buffer Managers) and SEC 5.3 accelerators.
Its CoreNet coherency fabric interconnects all CPU, DSP, and accelerator clusters with full L1/L2 cache coherency; dual DDR3/3L controllers (1.867 GHz, 512 KB L3 each) provide high-bandwidth memory access, and 16-lane 10 GHz SerDes supports eight CPRI v4.2 (9.8 Gbps), two 10G Ethernet, and two Serial RapidIO Gen II links.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Process Technology | 28 nm - enables high core density and power efficiency for macro base station thermal constraints. |
| CPU Cores | Four e6500 dual-threaded 64-bit Power Architecture cores at up to 1.8 GHz - delivers high-throughput Layer 2/3 packet processing with SMT and AltiVec SIMD. |
| DSP Cores | Six SC3900FP StarCore FVP cores at up to 1.2 GHz - provides programmable Layer 1 signal processing with 32 MAC/cycle and SIMD8 vector execution. |
| MAPLE Accelerators | MAPLE-B3 baseband engine - hardware-accelerates LTE/WCDMA FEC (Turbo/Viterbi), FFT/iFFT, MIMO MMSE equalization, and PDSCH/PUSCH data paths. |
| Memory Interface | Dual 64-bit DDR3/3L controllers at 1.867 GHz, each with 512 KB L3 cache - sustains >25 GB/s aggregate bandwidth for real-time baseband buffering. |
| High-Speed I/O | 16-lane 10 GHz SerDes supporting eight CPRI v4.2 (9.8 Gbps), two 10G Ethernet, two Serial RapidIO Gen II, and PCIe Gen II - enables fronthaul/backhaul convergence. |
| Package | 1020-pin FC-PBGA, 1 mm pitch - standard industrial package for high-pin-count wireless SoCs with thermal and signal integrity optimization. |
Pinout & Package
1020-pin Flip-Chip Plastic Ball Grid Array (FC-PBGA) with 1 mm ball pitch, designed for industrial-temperature operation (–40°C to +105°C) and compliant with RoHS/lead-free requirements. Thermal and power delivery optimized for macro base station PCB layouts with multiple voltage domains (core, I/O: 1.0–2.5 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | Supplies regulated voltage to e6500 and SC3900FP cores; requires low-noise, high-current VRM with VID tracking. |
| VDD_IO | I/O power supply | Configurable 1.0–2.5 V domain supporting DDR3, CPRI, RapidIO, and PCIe I/O standards simultaneously. |
| DDR3_CLK/ADDR/DQS | DDR3/3L memory interface | Dual 64-bit channels with on-die termination and ECC support - enables error-resilient, high-bandwidth baseband buffer access. |
| CPRI_TX[7:0]/RX[7:0] | CPRI v4.2 fronthaul interface | Eight independent 9.8 Gbps lanes for IQ data transport between BBU and remote radio units (RRUs). |
| SRIO_PORT[1:0] | Serial RapidIO Gen II interface | Two 5 Gbaud x4 ports for inter-SoC or BBU-to-BBU synchronization and control messaging. |
| JTAG_TCK/TMS/TDI/TDO | IEEE 1149.1/1149.6 boundary scan | Enables production test, debug trace, and Nexus 5001-compliant real-time instruction tracing. |
Key Features
| Feature | Design Value |
|---|---|
| DPAA Data Path Acceleration | Offloads packet parsing, classification, distribution, and queue management from CPU - reduces IP forwarding latency by >50% and frees >30% CPU cycles for value-added services. |
| MAPLE-B3 Baseband Engine | Hardwired acceleration of standardized PHY algorithms (Turbo decode/encode, FFT, MIMO equalization) - achieves 3× throughput vs. pure DSP implementation with <40% power consumption. |
| CoreNet Coherency Fabric | Cache-coherent interconnect linking e6500, SC3900FP, MAPLE, and accelerators - eliminates software-managed cache maintenance overhead in multi-core real-time scheduling. |
| SEC 5.3 Security Accelerator | Hardware acceleration of SNOW-3G, Kasumi, ZUC, AES, SHA-2, HMAC, and IPSec - enables line-rate encryption/decryption for user-plane and control-plane traffic without CPU penalty. |
| Industrial Temperature Range | –40°C to +105°C operation - validated for uncontrolled macro base station enclosures with passive cooling and extended field life requirements. |
Applications
| Macrocell LTE FDD Base Station | Macrocell LTE-Advanced Small Cell Aggregator |
|---|---|
Use Scenario: High-capacity urban macro site serving three 20 MHz LTE FDD sectors with carrier aggregation and MIMO-4x4. IC Role / Device Role / Timing Role: Primary baseband SoC performing Layer 1 PHY (via MAPLE + SC3900FP) and Layer 2/3 protocol stack (via e6500 + DPAA) with CPRI fronthaul interfacing. Use Value: Enables 3× sector processing within single SoC, reducing BOM count and power per sector by 35% versus discrete DSP+FPGA solutions. | Use Scenario: Centralized RAN (C-RAN) aggregator node consolidating up to 12 remote radio heads (RRHs) across LTE-Advanced and legacy WCDMA bands. IC Role / Device Role / Timing Role: Baseband concentrator and scheduler executing joint processing, interference coordination, and dynamic spectrum sharing across heterogeneous air interfaces. Use Value: Leverages MAPLE's multi-standard FEC/FFT engines and e6500 virtualization to run mixed LTE-A/WCDMA workloads with deterministic sub-100 µs inter-RRH synchronization. |
| WCDMA/HSPA+ Macro NodeB | Multi-Standard Test & Calibration Platform |
Use Scenario: Carrier-deployed WCDMA/HSPA+ NodeB supporting 15 MHz bandwidth, 64-QAM, and dual-carrier HSDPA in rural coverage zones. IC Role / Device Role / Timing Role: Full-stack baseband processor implementing chip-rate processing, path search, and turbo decoding using MAPLE's WCDMA-specific accelerators and SC3900FP cores. Use Value: Achieves >99.5% link budget margin compliance at –115 dBm sensitivity with 30% lower power draw than prior-generation ASIC-based NodeBs. | Use Scenario: Lab-grade RF conformance tester validating 3GPP Rel.10/11 physical layer behavior across LTE TDD/FDD, LTE-A CA, and WCDMA configurations. IC Role / Device Role / Timing Role: Reconfigurable PHY reference platform generating and analyzing baseband IQ waveforms with precise timing alignment and channel emulation. Use Value: Uses B4860NSN7QUMD's programmable SC3900FP cores and MAPLE's embedded PDSCH/PUSCH data flows to replicate real-world channel impairments with <1 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar baseband processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx Zynq UltraScale+ RFSoC ZU28DR | Integrated RF DAC/ADC with hardened 64-bit ARM Cortex-A53 cores; no MAPLE-like baseband accelerators - relies on programmable logic for PHY offload. | Targeted at active antenna systems and mmWave small cells; lacks native CPRI v4.2 and industrial temperature rating. | Select when direct RF sampling, custom waveform generation, or sub-6 GHz/mmWave coexistence is required - not drop-in for macro BBU designs. |
| Intel Agilex F-Series FPGA + eASIC N10 | Heterogeneous architecture combining FPGA fabric, hardened transceivers, and ASIC-like eASIC blocks; no integrated Power Architecture or StarCore cores. | Used in flexible O-RAN DU/CU deployments requiring reprogrammability across 3GPP releases; higher power and board area than B4860NSN7QUMD. | Choose for future-proofing against evolving 3GPP Rel.17+ features where fixed-function SoC roadmap limits apply. |
Compared with Xilinx ZU28DR and Intel Agilex F-Series + eASIC N10, the B4860NSN7QUMD delivers higher deterministic Layer 1 throughput per watt for macro LTE/WCDMA deployments, integrates carrier-grade interfaces (CPRI v4.2, RapidIO) natively, and supports industrial-temperature operation without external thermal management - making it optimal for carrier-certified macro base station BBU designs.
Availability
B4860NSN7QUMD is available at Aetrix Electronics and suitable for macro base station BBUs, C-RAN aggregators, WCDMA NodeBs, and wireless test equipment requiring stable component supply, long lifecycle support, and industrial-temperature qualification.
Supply support for B4860NSN7QUMD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the acquisition of Freescale Semiconductor in 2015, specializing in secure connectivity solutions for automotive, industrial, and communications markets.
The QorIQ Qonverge platform - including the B4860NSN7QUMD - was engineered specifically for wireless infrastructure baseband processing, balancing programmability, hardware acceleration, and carrier-grade I/O to meet 3GPP macro base station performance, power, and certification requirements.
FAQ
What is the primary function of the B4860NSN7QUMD in wireless infrastructure?
The B4860NSN7QUMD serves as a full-stack baseband processor SoC for macro base stations, executing Layer 1 PHY processing (via MAPLE-B3 accelerators and SC3900FP DSP cores) and Layer 2/3 protocol stack handling (via e6500 Power Architecture cores and DPAA). It enables concurrent LTE FDD/TDD, LTE-Advanced, and WCDMA operation across three 20 MHz sectors - making B4860NSN7QUMD central to carrier-grade BBU design.
Does the B4860NSN7QUMD support CPRI v4.2, and how many lanes are implemented?
Yes, the B4860NSN7QUMD integrates eight dedicated CPRI v4.2 controllers operating at 9.8 Gbps per lane, mapped to its 16-lane 10 GHz SerDes. These lanes support fronthaul connectivity to remote radio units in macro and distributed base station architectures - a core capability confirmed in the B4860FS REV 3 datasheet and essential to B4860NSN7QUMD's role in C-RAN deployments.
What memory interfaces does the B4860NSN7QUMD provide, and what is their bandwidth capacity?
The B4860NSN7QUMD features two 64-bit DDR3/3L memory controllers running at 1.867 GHz, each backed by 512 KB of L3 cache. Together they deliver over 25 GB/s aggregate memory bandwidth - sufficient to sustain real-time buffering of IQ samples, Turbo decoder soft metrics, and protocol stack state tables across all three sectors. This memory subsystem is integral to B4860NSN7QUMD's deterministic baseband performance.
Is the B4860NSN7QUMD qualified for industrial temperature operation?
Yes, the B4860NSN7QUMD is rated for industrial temperature range (–40°C to +105°C) and packaged in a lead-free, RoHS-compliant 1020-pin FC-PBGA. This qualification enables deployment in outdoor macro base station cabinets without active cooling - a critical requirement for carrier acceptance that distinguishes B4860NSN7QUMD from commercial-grade alternatives.
How does the MAPLE-B3 accelerator enhance baseband processing efficiency in the B4860NSN7QUMD?
The MAPLE-B3 accelerator in the B4860NSN7QUMD provides hardware-implemented, standards-compliant execution of computationally intensive PHY functions - including Turbo/Viterbi coding, FFT/iFFT, MIMO MMSE equalization, and PDSCH/PUSCH data flows. By offloading these tasks from programmable cores, MAPLE-B3 reduces latency by up to 4× and cuts power consumption by >60% versus pure DSP implementations - directly improving B4860NSN7QUMD's spectral efficiency and thermal footprint.
B4860NSN7QUMD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1020-BBGA, FCBGA
- Series:
- QorIQ Qonverge B
- Packaging:
- Box
- Product Status:
- Active
- Core Processor:
- PowerPC e6500
- Number of Cores/Bus Width:
- 4 Core, 64-Bit
- Speed:
- 1.8GHz
- Co-Processors/DSP:
- Signal Processing; SC3900FP FVP - 6 Core
- RAM Controllers:
- DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 1/2.5Gbps (4), 1/2.5/10Gbps (2)
- SATA:
- -
- USB:
- USB 2.0 (1)
- Voltage - I/O:
- 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1020-FCPBGA (33x33)
- Additional Interfaces:
- I2C, MMC/SD, RapidIO, SPI, UART
B4860NSN7QUMD FAQ
1.How can I place an order for B4860NSN7QUMD through Aetrix?
Please submit a Request for Quotation (RFQ) for B4860NSN7QUMD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B4860NSN7QUMD reliable?
The price and inventory of B4860NSN7QUMD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B4860NSN7QUMD is usually 5 days.
3.What payment methods are accepted for B4860NSN7QUMD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B4860NSN7QUMD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B4860NSN7QUMD?
B4860NSN7QUMD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B4860NSN7QUMD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B4860NSN7QUMD?
For technical support, including B4860NSN7QUMD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B4860NSN7QUMD requirements.
6.How does Aetrix verify that B4860NSN7QUMD is sourced from the original manufacturer or authorized distributors?
All B4860NSN7QUMD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B4860NSN7QUMD meets industry standards.
7.What is the process for return or replacement of B4860NSN7QUMD?
All B4860NSN7QUMD units undergo pre-shipment inspection (PSI). If there is an issue with B4860NSN7QUMD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B4860NSN7QUMD part is unused and in its original packaging.
Return procedure for B4860NSN7QUMD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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