Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors B4860NXN7QUMD

Part No.:
B4860NXN7QUMD
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1020-BBGA, FCBGA
Datasheet:
AetrixB4860NXN7QUMD.pdf
Description:
IC MPU QORIQ 1.8GHZ 1020FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,706

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

B4860NXN7QUMD from NXP Semiconductors (formerly Freescale) is a 28 nm multi-standard wireless baseband SoC integrating four dual-threaded 64-bit e6500 Power Architecture cores (up to 1.8 GHz), six SC3900FP StarCore FVP DSP cores (up to 1.2 GHz), and MAPLE-B3 baseband accelerators. It enables simultaneous processing of three 20 MHz LTE sectors with FEC, FFT, MIMO equalization, and PDSCH/PUSCH data path acceleration in macro base stations.

For engineers reviewing the B4860NXN7QUMD datasheet, B4860NXN7QUMD pinout, B4860NXN7QUMD application, or B4860NXN7QUMD equivalent, key selection considerations include its 1020-pin FC-PBGA package, dual DDR3/3L memory controllers with 512 KB L3 cache each, IEEE 1588v2 support, eight CPRI v4.2 interfaces, and hardware-accelerated Layer 1 PHY functions for LTE-Advanced (Rel.10/11), LTE FDD/TDD, and WCDMA.

Technical Context

The B4860NXN7QUMD implements strict functional partitioning: Layer 1 baseband processing is offloaded to MAPLE-B3 accelerators (Turbo/Viterbi, FFT/iFFT, MIMO MMSE-IRC/SIC/PIC, CRC) and six SC3900FP FVP cores, while Layer 2/3 packet processing runs on four e6500 cores with DPAA (frame/queue/buffer managers) and security accelerators (AES, SHA-2, SNOW-3G, ZUC). CoreNet coherency fabric ensures full cache coherence across CPU, DSP, and accelerator clusters.

It supports heterogeneous traffic handling via eight CPRI v4.2 links (9.8 Gbps each), two 10G/2.5G/1G Ethernet controllers with IEEE 1588v2 timestamping, two Serial RapidIO Gen II ports (5 Gbps), and PCIe Gen II x4 - all multiplexed over a 16-lane 10 GHz SerDes array. Memory subsystem includes dual 64-bit DDR3/3L controllers, ECC protection, and 12.3 MB total on-die memory (L1/L2/L3 caches + embedded SRAM).

Key Specifications

ParameterValue and Actual Design Meaning
Process Technology28 nm HKMG - enables high core density and power efficiency for macro base station thermal envelopes.
CPU Cores4× e6500 dual-threaded 64-bit Power Architecture cores @ up to 1.8 GHz - delivers >100 GFLOPS integer+SIMD throughput for L2/L3 control and transport stack.
DSP Cores6× SC3900FP StarCore FVP cores @ up to 1.2 GHz - provides 32 MAC/cycle (16-bit) and SIMD8 vector execution for real-time PHY layer algorithms.
MAPLE-B3 AcceleratorsHardware-accelerated FEC (Turbo/Viterbi), FFT/iFFT, MIMO MMSE equalization, PDSCH/PUSCH flows - reduces L1 latency by >70% vs. pure software implementation.
Memory InterfaceDual 64-bit DDR3/3L controllers @ 1.867 GHz, each with 512 KB L3 cache and ECC - supports ≥25.6 GB/s aggregate bandwidth for multi-sector baseband buffers.
High-Speed I/O16× SerDes lanes (10 Gbps), 8× CPRI v4.2 (9.8 Gbps), 2× 10G Ethernet w/1588v2, 2× SRIO Gen II, PCIe Gen II x4 - enables fronthaul/backhaul convergence in single-chip macro designs.
Package1020-pin FC-PBGA, 1 mm pitch, RoHS-compliant - designed for industrial temperature range (–40°C to +105°C) and forced-air-cooled macro base station modules.

Pinout & Package

Package: 1020-pin Flip-Chip Plastic Ball Grid Array (FC-PBGA), 1 mm ball pitch, 37.5 mm × 37.5 mm body size, 1.27 mm height. Thermal design requires exposed thermal pad soldered to PCB ground plane.

Pin/TerminalCircuit RoleDesign Meaning
A1–A10, B1–B10, etc. (all 1020 balls)Power, Ground, I/O, Clock, JTAG, SerDes, DDR, CPRI, PCIe, SRIO, Ethernet, USB, I²C, UART, eSPI, eSDHC, IFCBall map defined in B4860FS REV 3 datasheet Section 3.1; power balls grouped by voltage domain (VDD_CORE, VDD_IO_1.0/1.2/1.35/1.5/1.8/2.5); DDR/CPRI/SerDes balls assigned to dedicated high-speed routing layers with controlled impedance.

Key Features

FeatureDesign Value
MAPLE-B3 Baseband AccelerationHardwired FEC, FFT, MIMO equalization, and embedded PDSCH/PUSCH data paths - eliminates >85% of L1 compute load from programmable cores, enabling deterministic sub-100 µs PHY latency.
DPAA Data Path AccelerationIntegrated frame manager, queue manager, and buffer manager - reduces packet processing overhead by 40–60% and frees e6500 cores for value-added services like QoS enforcement and deep packet inspection.
Security AccelerationHardware engines for AES-128/256, SHA-2, HMAC, SNOW-3G, Kasumi, ZUC, and IPSec - enables line-rate encryption/decryption at 10 Gbps without CPU intervention.
Multi-Standard PHY SupportSingle silicon platform supporting LTE FDD/TDD Rel.10/11, LTE-Advanced carrier aggregation, and WCDMA/HSPA+ - eliminates need for separate chipsets across RAN generations.
Coherent Interconnect FabricCoreNet switching fabric with hardware cache coherency across e6500, SC3900FP, MAPLE, and accelerators - enables unified memory view and lock-free inter-core communication for real-time L1/L2 handoff.

Applications

Macrocell LTE FDD Base StationMacrocell LTE-Advanced TDD Base Station

Use Scenario: High-capacity urban macro site serving three 20 MHz sectors with 4×4 MIMO and 256-QAM modulation.

IC Role / Device Role / Timing Role: Primary baseband SoC performing real-time Layer 1 PHY (PDSCH/PUSCH, HARQ, channel estimation) and Layer 2 MAC/RLC/PDCP processing.

Use Value: MAPLE-B3 accelerators deliver 3× higher spectral efficiency and 40% lower latency than prior-generation SoCs, enabling 1.2 Gbps peak downlink throughput per sector.

Use Scenario: Dense deployment in time-division duplex spectrum with dynamic TDD UL/DL configuration and CoMP joint transmission.

IC Role / Device Role / Timing Role: Full-stack baseband processor executing synchronized TDD frame timing, uplink/downlink burst scheduling, and cross-sector interference coordination.

Use Value: Dual e6500 cluster virtualization and deterministic SC3900FP interrupt latency (<500 ns) ensure sub-frame boundary alignment across sectors for coordinated multipoint operation.

WCDMA/HSPA+ Macro Base StationConverged LTE/WCDMA Dual-Mode Base Station

Use Scenario: Legacy network upgrade site maintaining WCDMA coverage while adding LTE overlay in same RF front-end.

IC Role / Device Role / Timing Role: Unified PHY processor running concurrent WCDMA chip-rate processing and LTE OFDMA symbol processing on shared memory and MAPLE resources.

Use Value: Single B4860NXN7QUMD replaces discrete WCDMA DSP + LTE baseband ASIC, reducing BOM cost by 35% and board area by 42%.

Use Scenario: Greenfield deployment requiring seamless inter-RAT handover between LTE and WCDMA cells under single RNC control.

IC Role / Device Role / Timing Role: Dual-mode baseband controller managing synchronized timing, shared resource arbitration, and unified scheduler for mixed air interface traffic.

Use Value: Hardware-assisted inter-RAT synchronization and common L2 buffer pool reduce handover interruption time to <20 ms, meeting 3GPP Release 8 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar baseband SoC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Xilinx Zynq UltraScale+ RFSoC ZU28DRCombines ARM Cortex-A53 cores with RF-sampling ADC/DAC and FPGA fabric; no integrated MAPLE-style PHY accelerators; relies on HLS-based soft IP for FEC/FFT.Targeted at flexible, software-defined radio and mmWave small cells; lacks native CPRI v4.2 and 10G Ethernet with 1588v2 required for macro fronthaul.Choose ZU28DR when algorithm portability, RF integration, or post-deployment reconfiguration are prioritized over deterministic L1 latency and macro-scale throughput.
Intel Agilex F-Series FPGA + Intel Xeon D-2700Discrete compute + programmable logic architecture; no monolithic SoC integration; requires external DDR, SerDes retimers, and PHY glue logic.Suitable for disaggregated O-RAN CU/DU split architectures; not optimized for single-chip macro baseband with integrated CPRI/Ethernet fronthaul.Choose Agilex+Xeon D when deploying cloud-native RAN with Kubernetes orchestration and workload partitioning across CU/DU layers.

Compared with Zynq RFSoC ZU28DR and Agilex+Xeon D, the B4860NXN7QUMD delivers higher deterministic Layer 1 throughput per watt, native CPRI v4.2 and 1588v2 support, and monolithic integration - making it optimal for cost-sensitive, high-throughput macro base stations where hardware-accelerated PHY latency and fronthaul convergence are critical.

Availability

B4860NXN7QUMD is available at Aetrix Electronics and suitable for macrocell LTE-Advanced base stations, converged LTE/WCDMA infrastructure, and high-density CPRI fronthaul systems requiring stable component supply across multi-year production cycles.

Supply support for B4860NXN7QUMD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial & IoT, mobile, and communication infrastructure markets.

The B4860NXN7QUMD belongs to the QorIQ Qonverge platform - a family of highly integrated baseband SoCs designed specifically for wireless infrastructure equipment requiring deterministic real-time processing, multi-standard support, and fronthaul/backhaul convergence in macro base stations.

FAQ

What is the maximum operating frequency of the e6500 cores in the B4860NXN7QUMD?

The B4860NXN7QUMD integrates four dual-threaded e6500 64-bit Power Architecture cores rated for operation up to 1.8 GHz. This frequency is validated across the industrial temperature range (–40°C to +105°C) with appropriate thermal management and voltage regulation. The B4860NXN7QUMD datasheet specifies this as the guaranteed maximum clock rate under nominal VDD_CORE conditions.

Does the B4860NXN7QUMD support IEEE 1588v2 Precision Time Protocol?

Yes, the B4860NXN7QUMD includes hardware timestamping support for IEEE 1588v2 in both of its 10G/2.5G/1G Ethernet controllers. This enables sub-100 ns timestamp accuracy for synchronization-critical fronthaul applications such as CPRI-based LTE macro deployments. The B4860NXN7QUMD implements full PTP slave and master functionality per IEEE Std. 1588-2008.

How many CPRI links does the B4860NXN7QUMD support, and at what version and speed?

The B4860NXN7QUMD integrates eight CPRI v4.2 controllers, each capable of 9.8304 Gbps line rate - matching the maximum CPRI Option 10 specification. These are implemented as dedicated SerDes lanes within the 16-lane 10 GHz SerDes array and require external CPRI PHYs. The B4860NXN7QUMD does not support CPRI v5 or eCPRI natively.

What memory technologies and capacities are supported by the B4860NXN7QUMD?

The B4860NXN7QUMD features two independent 64-bit DDR3/3L memory controllers, each supporting data rates up to 1.867 GHz and attached to 512 KB of dedicated L3/M3 cache. It supports DDR3-1866 and DDR3L-1866 DIMMs or discrete components with ECC enabled. Total on-die memory (L1/L2/L3 + embedded SRAM) totals 12.3 MB, as specified in the B4860NXN7QUMD reference manual.

Is the B4860NXN7QUMD pin-compatible with other QorIQ Qonverge devices like the B4460?

No, the B4860NXN7QUMD is not pin-compatible with the B4460 or other QorIQ Qonverge SoCs. It uses a unique 1020-pin FC-PBGA package with distinct ball mapping for SerDes, DDR, CPRI, and power domains. Migration from B4460 to B4860NXN7QUMD requires full PCB redesign due to differences in package size, thermal pad layout, and high-speed interface routing constraints.

B4860NXN7QUMD Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1020-BBGA, FCBGA
Series:
QorIQ Qonverge B
Packaging:
Bulk
Product Status:
Active
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
SATA:
-
USB:
USB 2.0 (1)
Voltage - I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Supplier Device Package:
1020-FCPBGA (33x33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART

B4860NXN7QUMD FAQ

1.How can I place an order for B4860NXN7QUMD through Aetrix?

Please submit a Request for Quotation (RFQ) for B4860NXN7QUMD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for B4860NXN7QUMD reliable?

The price and inventory of B4860NXN7QUMD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B4860NXN7QUMD is usually 5 days.

3.What payment methods are accepted for B4860NXN7QUMD?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B4860NXN7QUMD transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for B4860NXN7QUMD?

B4860NXN7QUMD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your B4860NXN7QUMD order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for B4860NXN7QUMD?

For technical support, including B4860NXN7QUMD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B4860NXN7QUMD requirements.

6.How does Aetrix verify that B4860NXN7QUMD is sourced from the original manufacturer or authorized distributors?

All B4860NXN7QUMD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B4860NXN7QUMD meets industry standards.

7.What is the process for return or replacement of B4860NXN7QUMD?

All B4860NXN7QUMD units undergo pre-shipment inspection (PSI). If there is an issue with B4860NXN7QUMD, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The B4860NXN7QUMD part is unused and in its original packaging.

Return procedure for B4860NXN7QUMD:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

B4860NXN7QUMD Tags

  • B4860NXN7QUMD
  • B4860NXN7QUMD PDF
  • B4860NXN7QUMD Datasheet
  • B4860NXN7QUMD Specifications
  • B4860NXN7QUMD Images
  • NXP Semiconductors
  • NXP Semiconductors B4860NXN7QUMD
  • Buy B4860NXN7QUMD
  • B4860NXN7QUMD Price
  • B4860NXN7QUMD Distributor
  • B4860NXN7QUMD Supplier
  • B4860NXN7QUMD Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER