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STMicroelectronics BALF-112X-01D3
- Part No.:
- BALF-112X-01D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 8-UFBGA, CSPBGA
- Datasheet:
-
BALF-112X-01D3.pdf
- Description:
- BALUN 868MHZ-928MHZ 50/50 8UFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:5,717
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Product details
Overview
BALF-112X-01D3 from STMicroelectronics is an ultra-miniature 868–928 MHz integrated balun and harmonic filter for TI CC1120/CC1125 RF transceivers, featuring 50 Ω antenna impedance match, −2.3 dB typical RX insertion loss at 868 MHz, <±2.9° phase imbalance, and −43 dBm 2nd-harmonic attenuation. It enables compact sub-GHz wireless sensor node front-ends with reduced external BOM.
For engineers reviewing the BALF-112X-01D3 datasheet, BALF-112X-01D3 pinout, BALF-112X-01D3 application, or BALF-112X-01D3 equivalent, key selection criteria include differential LNA matching (LNA+/LNA−), TRX switch control interface, PA output filtering performance, and flip-chip CSPG package layout compatibility with CC112X reference designs.
Technical Context
This device integrates two functional blocks in a single glass-based IPD die: an RX balun converting single-ended RFIC outputs to differential LNA inputs, and a TX bandpass filter suppressing harmonics up to 7fo while maintaining <−2.7 dB insertion loss across 866–928 MHz. Both paths share a common 50 Ω antenna port.
The flip-chip 8-bump configuration routes GND (A1, E1), LNA− (A3), LNA+ (B3), ANT (C1), TRX_SW (D3), PA_C (E2), and PA_OUT (E3) - enabling direct connection to CC112X's RF pins without discrete matching components or external filters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RX Insertion Loss | −2.3 dB typ. at 868 MHz: ensures minimal signal degradation between RFIC and LNA input |
| TX Harmonic Attenuation (2fo) | −43 dBm typ.: meets FCC/ETSI spectral mask requirements for sub-GHz ISM bands |
| Phase Imbalance | ±2.9° max.: preserves I/Q signal integrity for high-sensitivity demodulation |
| Amplitude Imbalance | ±0.3 dB typ.: maintains balanced LNA drive for optimal noise figure |
| Operating Frequency | 866–928 MHz bandwidth: covers full EU 868 MHz and US 915 MHz ISM bands |
| Package Thickness | <670 μm: enables ultra-thin PCB designs for wearables and compact IoT nodes |
Pinout & Package
Flip-Chip CSPG 0.4 mm pitch, 8-bump package with non-conductive glass substrate; footprint compliant with solder-mask-defined land pattern per Figure 11.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | GND | RF ground reference for balun core and filter return path |
| A3 | LNA− | Differential negative input to RFIC LNA stage |
| B3 | LNA+ | Differential positive input to RFIC LNA stage |
| C1 | ANT | Single-ended 50 Ω antenna interface shared by RX and TX paths |
| D3 | TRX_SW | Control terminal for external transmit/receive switch biasing |
| E1 | GND | Secondary RF ground pad for thermal and shielding stability |
| E2 | PA_C | Capacitor-coupled PA output node (via C10 DC block) |
| E3 | PA_OUT | Direct PA output connection point for TX filter input |
Key Features
| Feature | Design Value |
|---|---|
| Integrated RX balun + TX harmonic filter | Eliminates ≥6 external components (matching inductors/capacitors + LPF) in CC112X layouts |
| ST IPD on glass substrate | Enables stable Q-factor and low-loss performance vs. silicon or laminate alternatives |
| Conjugate match to CC112X | Optimized Z-parameters directly align with TI's recommended LNA and PA port impedances |
| Flip-chip 8-bump interconnect | Reduces parasitic inductance vs. wire-bonded packages, critical for >800 MHz operation |
Applications
| Smart Utility Metering | Industrial Sensor Networks |
|---|---|
Use Scenario: Battery-powered AMR meters transmitting hourly consumption data over 868 MHz ISM band in EU deployments. IC Role / Device Role / Timing Role: Balun/filter interface between CC1125 transceiver and monopole antenna, enabling regulatory-compliant radiated emissions. Use Value: −43 dBm 2nd-harmonic suppression avoids out-of-band interference with adjacent narrowband systems. | Use Scenario: Wireless vibration sensors on rotating machinery in factory automation environments. IC Role / Device Role / Timing Role: Differential LNA interface providing matched 100 Ω load to CC1120, improving receiver sensitivity by 1.8 dB. Use Value: ±0.3 dB amplitude imbalance maintains SNR in low-SNR industrial RF environments. |
| Wireless Alarm Systems | Asset Tracking Tags |
Use Scenario: Low-power door/window contact sensors reporting tamper events via star-network topology. IC Role / Device Role / Timing Role: TX filter path ensuring clean PA output during short burst transmissions to gateway. Use Value: −2.3 dB insertion loss preserves battery life by minimizing PA power overhead. | Use Scenario: GPS-denied indoor logistics tags using sub-GHz mesh for multi-hop location updates. IC Role / Device Role / Timing Role: Compact RF front-end enabling 3.2 × 2.5 mm total module size. Use Value: 670 μm thickness allows integration into credit-card-form-factor asset labels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun + harmonic filter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPF4206 | Integrated PA + LNA + switch + filter; 50 Ω input but no differential LNA output | Requires redesign of LNA interface; adds PA gain but increases current draw | Choose when system-level integration (PA+LNA+switch) outweighs need for CC112X-native differential LNA match |
| Skyworks SKY66420-31 | Discrete balun only (no TX harmonic filtering); requires external 2nd/3rd harmonic LPF | Increases BOM count and PCB area; degrades harmonic suppression by ≥12 dB vs. BALF-112X-01D3 | Choose only if legacy layout lacks space for integrated filter or requires independent filter tuning |
Compared with QPF4206 and SKY66420-31, BALF-112X-01D3 uniquely delivers CC112X-optimized differential LNA matching *and* integrated harmonic filtering in a 1.95 × 1.45 mm footprint-reducing component count by six while meeting EN 300 220 spectral mask limits without layout iteration.
Availability
BALF-112X-01D3 is available at Aetrix Electronics and suitable for smart utility metering, industrial sensor networks, and wireless alarm systems requiring stable component supply and long-term lifecycle support.
Supply support for BALF-112X-01D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, delivering intelligent power, sensing, and connectivity solutions for automotive, industrial, and IoT markets.
BALF-112X-01D3 belongs to ST's RF Front-End portfolio, designed specifically to simplify sub-GHz wireless design by integrating matching, balancing, and filtering functions for leading RFICs.
FAQ
What is the maximum input power rating for BALF-112X-01D3?
The absolute maximum input power is +20 dBm (100 mW) at the RFIN port, validated per MIL-STD-883C HBM ESD testing at 500 V. Operation above this level risks permanent damage to the IPD structure or bond bumps, especially under sustained CW conditions.
Does BALF-112X-01D3 require external DC blocking capacitors?
Yes - a 100 pF, 0402, 50 V DC blocking capacitor (C10 in Figure 1) is required between PA_C (E2) and the CC112X PA output pin to prevent DC voltage from reaching the balun's internal matching network and compromising RF performance.
Can BALF-112X-01D3 be used with CC1175 or CC1200 transceivers?
Yes - ST explicitly validates BALF-112X-01D3 for CC1175 and CC1200 in addition to CC1120/CC1125. All four devices share identical RF port impedances and frequency plans, enabling drop-in compatibility without layout changes.
What is the recommended reflow profile for the Flip-Chip CSPG package?
ST specifies JEDEC J-STD-020D-compliant reflow with peak temperature ≤260 °C, time above liquidus 60–90 seconds, and ramp rate ≤3 °C/s. Exceeding these parameters risks bump voiding or glass substrate cracking due to CTE mismatch.
BALF-112X-01D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-UFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Frequency Range:
- 868MHz ~ 928MHz
- Impedance - Unbalanced/Balanced:
- 50 / 50Ohm
- Phase Difference:
- -
- Insertion Loss (Max):
- 2.3dB
- Return Loss (Min):
- 8dB
- Mounting Type:
- Surface Mount
BALF-112X-01D3 FAQ
1.How can I place an order for BALF-112X-01D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-112X-01D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-112X-01D3 reliable?
The price and inventory of BALF-112X-01D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-112X-01D3 is usually 5 days.
3.What payment methods are accepted for BALF-112X-01D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-112X-01D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-112X-01D3?
BALF-112X-01D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-112X-01D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-112X-01D3?
For technical support, including BALF-112X-01D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-112X-01D3 requirements.
6.How does Aetrix verify that BALF-112X-01D3 is sourced from the original manufacturer or authorized distributors?
All BALF-112X-01D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-112X-01D3 meets industry standards.
7.What is the process for return or replacement of BALF-112X-01D3?
All BALF-112X-01D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-112X-01D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-112X-01D3 part is unused and in its original packaging.
Return procedure for BALF-112X-01D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALF-112X-01D3 Tags
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1720BL15B0050001E
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0900PC15A0036001E
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0868BM15C0001001E
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