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STMicroelectronics BALF-CC25-02D3
- Part No.:
- BALF-CC25-02D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 4-WFBGA, FCBGA
- Datasheet:
-
BALF-CC25-02D3.pdf
- Description:
- BALUN 2.4GHZ-2.5GHZ 50/50 4WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,914
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Product details
Overview
BALF-CC25-02D3 from STMicroelectronics is a 2.45 GHz integrated balun with conjugate matching network optimized for CC2541 Bluetooth Low Energy RF transceivers. It delivers 1.8 dB typical insertion loss, ±0.6 dB amplitude imbalance, ±7° phase imbalance, and 50 Ω single-ended input impedance in a flip-chip-on-glass package. Used in compact BLE modules for wireless sensor nodes and wearable devices.
For engineers reviewing the BALF-CC25-02D3 datasheet, BALF-CC25-02D3 pinout, BALF-CC25-02D3 application, or BALF-CC25-02D3 equivalent, key selection criteria include differential output impedance matching to CC2541, insertion loss across 2379–2507 MHz, ESD robustness (2000 V HBM), thermal operation from –40 °C to +105 °C, and footprint compatibility with 0.5 mm bump pitch layouts.
Technical Context
This balun implements a monolithic IPD (integrated passive device) structure on non-conductive glass substrate, enabling precise impedance transformation from 50 Ω SE to conjugate-matched differential output for CC2541's RF port. Its design eliminates discrete matching components while maintaining tight amplitude/phase balance.
The flip-chip construction uses solder bumps (0.205 mm typ. diameter, 0.5 mm pitch) directly bonded to PCB pads, supporting high-frequency signal integrity up to 2.5 GHz. Thermal performance is validated over –40 °C to +105 °C ambient, with 20 dBm max RF input power handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2379–2507 MHz: Full BLE band coverage including advertising, scanning, and connection channels. |
| Insertion Loss | 1.8 dB typ.: Minimizes RF path attenuation between CC2541 and antenna, preserving link budget. |
| Amplitude Imbalance | ±0.6 dB max: Ensures symmetric differential drive for low EVM in GFSK modulation. |
| Phase Imbalance | ±7° max: Maintains orthogonal I/Q signal fidelity critical for BLE receiver sensitivity. |
| ESD Rating (HBM) | 2000 V: Protects against handling-induced discharge during assembly without external TVS. |
| Operating Temp | –40 to +105 °C: Supports industrial-grade BLE deployments in enclosed or thermally stressed enclosures. |
| Input Impedance | 50 Ω nominal: Direct interface to standard RF trace routing without series matching. |
Pinout & Package
Flip-chip package with four solder bumps on 0.5 mm pitch; no wire bonds or leadframe. Total die area < 0.88 mm². Substrate thickness 0.400 mm, bump height 0.205 mm typ., overall height 0.630 mm max.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Single-ended RF input | 50 Ω matched port connecting directly to CC2541 RFIO pin. |
| RF2 | Differential RF output (non-inverting) | One leg of balanced output driving antenna feed point or matching network. |
| RF3 | Differential RF output (inverting) | Complementary leg providing 180° phase shift relative to RF2 for true differential signaling. |
| GND | RF ground reference | Direct thermal and RF return path to PCB ground plane; must be low-inductance connection. |
Key Features
| Feature | Design Value |
|---|---|
| Conjugate match to CC2541 | Pre-tuned differential output impedance eliminates need for external matching components. |
| Low profile (0.63 mm height) | Enables ultra-thin wearable and coin-cell-powered designs where Z-height is constrained. |
| IPD on glass substrate | Reduces parasitic coupling vs. silicon-based passives, improving isolation above 2 GHz. |
| 0.5 mm bump pitch layout | Supports fine-pitch PCB routing and automated placement with standard SMT equipment. |
| ECOPACK® lead-free | Meets RoHS and REACH requirements without compromising RF performance or thermal reliability. |
Applications
| BLE Wearable Sensor Node | Smart Home Beacon |
|---|---|
Use Scenario: Compact wrist-worn health monitor transmitting heart rate and motion data via BLE. IC Role / Device Role / Timing Role: Balun interfaces CC2541 RFIO to miniature PCB antenna, converting single-ended output to balanced drive. Use Value: 1.8 dB insertion loss preserves transmit range within 10 m; ±0.6 dB amplitude balance maintains < 5% EVM at 1 Mbps. | Use Scenario: Battery-powered indoor location beacon broadcasting iBeacon packets in retail environments. IC Role / Device Role / Timing Role: RF front-end balun enabling efficient power transfer from CC2541 to chip antenna under size constraints. Use Value: 0.63 mm height allows integration into 3.2 mm thick plastic enclosure; 2000 V HBM ESD withstands factory handling. |
| Medical Patch Transmitter | Industrial BLE Gateway Module |
Use Scenario: Disposable skin patch relaying ECG data to nearby hub using BLE 4.2. IC Role / Device Role / Timing Role: Impedance-transforming balun ensuring stable RF output despite variable PCB stack-up and flex-circuit bending. Use Value: Glass-substrate IPD maintains phase balance stability across –40 to +85 °C operating range. | Use Scenario: DIN-rail mounted gateway aggregating sensor data from multiple BLE endpoints in factory settings. IC Role / Device Role / Timing Role: High-reliability balun supporting continuous 24/7 BLE advertising and connection cycles. Use Value: 105 °C max operating temperature enables use in unventilated enclosures near motor drives or PLCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SKY13370-374LF | Higher IL (2.3 dB typ.), wider bandwidth (2.4–2.5 GHz), larger 1.2 mm² footprint. | Designed for general-purpose 2.4 GHz ISM, not CC2541-optimized. | Choose if multi-band support needed beyond BLE; avoid if board space or CC2541 matching is critical. |
| DA202200R | 0.9 mm² footprint, 2.1 dB IL, requires external matching for CC2541. | Generic 2.45 GHz balun; no CC2541-specific conjugate tuning. | Select only when redesigning matching network is acceptable; adds BOM and layout complexity. |
Compared with SKY13370-374LF and DA202200R, BALF-CC25-02D3 uniquely integrates CC2541-conjugate matching in minimal area, delivering lowest insertion loss and smallest height-critical for space-constrained BLE endpoints where RF efficiency and manufacturability are prioritized.
Availability
BALF-CC25-02D3 is available at Aetrix Electronics and suitable for BLE wearable sensors, smart home beacons, and medical telemetry devices requiring stable component supply and consistent RF performance across production batches.
Supply support for BALF-CC25-02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, analog ICs, power management, and MEMS sensors.
BALF-CC25-02D3 belongs to ST's RF passive portfolio built on IPD-on-glass technology, designed specifically to simplify BLE and Zigbee RF front-end integration for ultra-compact IoT endpoints.
FAQ
What is the recommended PCB layout for BALF-CC25-02D3?
ST recommends a coplanar waveguide layout with solid ground beneath the balun die, 0.25 mm solder mask opening around each bump, and 0.5 mm pitch pad centers. Figure 16 in DocID028619 shows minimum clearance (0.22 mm) from bumps to die edge and strict control of copper thickness to maintain impedance.
Does BALF-CC25-02D3 require external DC blocking capacitors?
No. The balun is fully AC-coupled internally; no external DC blocking capacitors are needed on RF1, RF2, or RF3 terminals. The device operates with DC-grounded RF ports and relies on internal capacitive coupling for signal path isolation.
Can BALF-CC25-02D3 be used with CC2640R2F?
No. BALF-CC25-02D3 is specifically tuned for CC2541's output impedance and bias conditions. CC2640R2F has different RF characteristics and requires dedicated baluns such as BALF-CC26-02D3 or discrete matching networks.
What is the maximum reflow temperature profile for this flip-chip device?
The device supports standard Pb-free reflow per JEDEC J-STD-020, with peak temperature ≤ 260 °C for ≤ 30 seconds. ST specifies ramp rates ≤ 3 °C/s and avoids thermal shock by limiting cooling rate to ≤ 6 °C/s after peak.
BALF-CC25-02D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 4-WFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 2.4GHz ~ 2.5GHz
- Impedance - Unbalanced/Balanced:
- 50 / 50Ohm
- Phase Difference:
- 7°
- Insertion Loss (Max):
- 1.6dB
- Return Loss (Min):
- -
- Mounting Type:
- Surface Mount
BALF-CC25-02D3 FAQ
1.How can I place an order for BALF-CC25-02D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-CC25-02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-CC25-02D3 reliable?
The price and inventory of BALF-CC25-02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-CC25-02D3 is usually 5 days.
3.What payment methods are accepted for BALF-CC25-02D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-CC25-02D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-CC25-02D3?
BALF-CC25-02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-CC25-02D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-CC25-02D3?
For technical support, including BALF-CC25-02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-CC25-02D3 requirements.
6.How does Aetrix verify that BALF-CC25-02D3 is sourced from the original manufacturer or authorized distributors?
All BALF-CC25-02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-CC25-02D3 meets industry standards.
7.What is the process for return or replacement of BALF-CC25-02D3?
All BALF-CC25-02D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-CC25-02D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-CC25-02D3 part is unused and in its original packaging.
Return procedure for BALF-CC25-02D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALF-CC25-02D3 Tags
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0868BM15C0001001E
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