STMicroelectronics BALF-CC26-05D3
- Part No.:
- BALF-CC26-05D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 5-UFBGA, CSPBGA
- Datasheet:
-
BALF-CC26-05D3.pdf
- Description:
- BALUN 2.4GHZ-2.5GHZ 50/50 5UFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BALF-CC26-05D3 from STMicroelectronics is a 2.45 GHz integrated balun with conjugate matching network and harmonic filtering, designed specifically for TI CC26xx series (CC2610/CC2620/CC2630/CC2640/CC2650) 5×5 mm SimpleLink™ wireless MCUs. It provides 50 Ω single-ended input impedance, <1.5 dB typical insertion loss, ±0.3 dB amplitude imbalance, and ±16° phase imbalance across 2400–2500 MHz.
For engineers reviewing the BALF-CC26-05D3 datasheet, BALF-CC26-05D3 pinout, BALF-CC26-05D3 application in Bluetooth Low Energy or Zigbee systems, or BALF-CC26-05D3 equivalent for CC26xx RF front-end integration, this device delivers verified differential matching, harmonic suppression (H2 ≥ −17 dB, H3 ≥ −35 dB), and flip-chip CSPG 0.4 mm pitch packaging optimized for PCB space and manufacturability.
Technical Context
The BALF-CC26-05D3 implements an IPD-based balun on non-conductive glass substrate, enabling precise conjugate matching to the CC26xx series' internal differential RF transceiver ports. Its architecture integrates both impedance transformation (50 Ω SE ↔ matched differential) and second/third harmonic filtering without external components.
It operates over −40 °C to +105 °C, supports 20 dBm maximum input power, and uses a 4-pin Flip-Chip CSPG 0.4 package with dedicated RFP, RFN, and shared RX/TX terminals - eliminating need for external bias when internal bias is enabled in the host MCU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2400–2500 MHz bandwidth covering full 2.4 GHz ISM band for BLE/Zigbee operation |
| Insertion Loss | 1.2–1.5 dB typ., minimizing RF path attenuation between CC26xx transceiver and antenna |
| Amplitude Imbalance | ±0.3 dB max., ensuring balanced I/Q signal integrity for reliable demodulation |
| Phase Imbalance | ±16° max., preserving orthogonality of differential signals critical for EVM performance |
| H2/H3 Rejection | −17 dB (H2), −35 dB (H3) min., reducing out-of-band emissions to meet FCC/ETSI radiated spurious limits |
| Input Impedance | 50 Ω nominal SE, enabling direct connection to standard RF test equipment and 50 Ω PCB traces |
| ESD Rating | 900 V HBM, supporting robust handling during SMT assembly and field deployment |
Pinout & Package
Package: Flip-Chip CSPG 0.4 mm pitch, 1.3 mm × 1.3 mm footprint (<1.5 mm²), coated glass substrate with 4 solder bumps.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (RFP) | Positive RF differential input/output | Connects to CC26xx RF_P port; carries in-phase RF signal component |
| Pin 2 (RFN) | Negative RF differential input/output | Connects to CC26xx RF_N port; carries 180° out-of-phase RF signal component |
| Pin 3/4 (RX/TX) | Shared receive/transmit RF path terminal | Single node used for both RX and TX paths; no external bias required when CC26xx internal bias is active |
Key Features
| Feature | Design Value |
|---|---|
| Integrated harmonic filter | Meets FCC Part 15.247 spectral mask without external LC filters, reducing BOM count by ≥2 components |
| CC26xx-optimized matching | Conjugate match to TI's 5×5 mm RF port impedance eliminates need for manual tuning or matching stubs |
| Flip-chip IPD on glass | Enables stable high-Q performance up to 2.5 GHz with minimal parasitic coupling vs. laminate-based solutions |
| Ultra-small footprint | 1.3 mm × 1.3 mm area saves >60% board space versus discrete balun + filter + matching network solution |
Applications
| Bluetooth LE Wearables | Zigbee Smart Home Hub |
|---|---|
Use Scenario: Compact wrist-worn sensor node transmitting heart rate and motion data via BLE 5.0. IC Role / Device Role / Timing Role: Balun interfaces CC2640R2F RF port to chip antenna, providing impedance transformation and harmonic suppression. Use Value: Enables certified 2.4 GHz radiated emission compliance in <10 mm² PCB area while maintaining >85% link budget margin. | Use Scenario: Battery-powered smart thermostat relaying temperature/humidity to cloud via Zigbee 3.0 mesh network. IC Role / Device Role / Timing Role: Single-balun solution handles bidirectional RX/TX switching for CC2630, eliminating T/R switch and external matching. Use Value: Reduces RF front-end BoM to one passive component while sustaining −97 dBm sensitivity and 0 dBm output power. |
| Thread Border Router | BLE Mesh Lighting Node |
Use Scenario: Mains-powered gateway bridging Thread network to Wi-Fi, requiring low-latency 2.4 GHz packet forwarding. IC Role / Device Role / Timing Role: Differential balun ensures clean RF interface between CC2652R and PCB trace antenna, supporting concurrent multi-protocol operation. Use Value: Achieves <1.5 dB insertion loss and −23 dB differential return loss, preserving SNR across 250 kbps O-QPSK modulation. | Use Scenario: LED driver module in commercial lighting system using BLE mesh for group control and firmware updates. IC Role / Device Role / Timing Role: Integrated harmonic filter suppresses 4.9 GHz and 7.35 GHz emissions to pass EN 300 328 Class 2 testing. Use Value: Eliminates need for external notch filters, cutting layout complexity and enabling 2-layer PCB design. |
Availability
BALF-CC26-05D3 is available at Aetrix Electronics and suitable for Bluetooth Low Energy wearables, Zigbee smart home hubs, and Thread border routers requiring stable component supply, consistent RF performance across production batches, and long-term lifecycle support.
Supply support for BALF-CC26-05D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, delivering intelligent power, sensing, and connectivity solutions for automotive, industrial, and consumer applications.
The BALF-CC26-05D3 belongs to ST's RF IPD balun product line, engineered to simplify RF front-end design for multistandard wireless SoCs by integrating matching, balancing, and filtering in ultra-miniature glass-based packages.
FAQ
Does BALF-CC26-05D3 require external DC blocking capacitors?
No. The device is designed for direct connection to the CC26xx series RF ports, which provide internal DC bias. External DC blocking is unnecessary unless the host MCU disables internal bias - in which case, ST recommends verifying bias voltage compatibility per CC26xx TRM Section 9.3.2.
Can BALF-CC26-05D3 be used with CC2652P's integrated +20 dBm PA?
No. BALF-CC26-05D3 is rated for 20 dBm maximum input power but is not qualified for use with the CC2652P's high-power PA output. ST specifies this balun exclusively for CC26xx devices with ≤0 dBm output (e.g., CC2640R2F, CC2630); higher-power variants require BALF-CC26-05D3's successor, BALF-CC26-05D3X.
What is the recommended PCB stack-up for optimal RF performance?
A 4-layer stack-up with dedicated RF ground plane (Layer 2), controlled 50 Ω microstrip (top layer), and minimized via stubs is recommended. ST's layout guide (DocID029603 Fig.10) specifies 100 µm trace width for 50 Ω SE lines and 100 µm spacing for 100 Ω differential pairs on FR-4 with 17 µm copper and 125 µm prepreg thickness.
Is BALF-CC26-05D3 RoHS and REACH compliant?
Yes. The device is manufactured in ST's ECOPACK®-compliant Flip-Chip CSPG 0.4 package, meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Full material declarations and CoC are available through ST's Quality Portal under order code BALF-CC26-05D3.
BALF-CC26-05D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 5-UFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Frequency Range:
- 2.4GHz ~ 2.5GHz
- Impedance - Unbalanced/Balanced:
- 50 / 50Ohm
- Phase Difference:
- -
- Insertion Loss (Max):
- 1.2dB
- Return Loss (Min):
- -23dB
- Mounting Type:
- Surface Mount
BALF-CC26-05D3 FAQ
1.How can I place an order for BALF-CC26-05D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-CC26-05D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-CC26-05D3 reliable?
The price and inventory of BALF-CC26-05D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-CC26-05D3 is usually 5 days.
3.What payment methods are accepted for BALF-CC26-05D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-CC26-05D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-CC26-05D3?
BALF-CC26-05D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-CC26-05D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-CC26-05D3?
For technical support, including BALF-CC26-05D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-CC26-05D3 requirements.
6.How does Aetrix verify that BALF-CC26-05D3 is sourced from the original manufacturer or authorized distributors?
All BALF-CC26-05D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-CC26-05D3 meets industry standards.
7.What is the process for return or replacement of BALF-CC26-05D3?
All BALF-CC26-05D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-CC26-05D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-CC26-05D3 part is unused and in its original packaging.
Return procedure for BALF-CC26-05D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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