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STMicroelectronics BALFLB-WL-08D3
- Part No.:
- BALFLB-WL-08D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 8-WFBGA, CSPBGA
- Datasheet:
-
BALFLB-WL-08D3.pdf
- Description:
- BALUN,FILTERING AND MATCHING OF
- Quantity:
- Payment:
- Shipping:
Inventory:1,757
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Product details
Overview
BALFLB-WL-08D3 from STMicroelectronics is an ultra-miniature integrated balun, matching network, and Tx harmonic filter optimized for QFN-packaged STM32WL sub-GHz wireless microcontrollers in high-power mode. It provides 50 Ω conjugate-matched differential Rx balun input, 50 Ω antenna-side Tx/Rx impedance, deep harmonic rejection (≥45 dB at 2f₀), ≤2.2 dB typical insertion loss, and operates across 470–510 MHz for LoRa®, (G)FSK, and BPSK LPWAN radio solutions.
For engineers reviewing the BALFLB-WL-08D3 datasheet, BALFLB-WL-08D3 pinout, BALFLB-WL-08D3 application, or BALFLB-WL-08D3 equivalent, this component delivers verified RF performance in compact CSPG packaging with validated layout rules for 4-layer PCBs, precise impedance-controlled trace routing, and ECOPACK2-compliant assembly.
Technical Context
The BALFLB-WL-08D3 integrates three RF functions on a single glass-based IPD substrate: a differential Rx balun matched to STM32WL's RFI_P/N outputs, a single-ended Tx filter matched to RFO_HP, and a wideband harmonic suppression network targeting 2f₀–10f₀. Its design eliminates discrete matching components and reduces RF BOM count while maintaining strict amplitude/phase imbalance limits (±0.8 dB / ±2.0°).
It supports simultaneous Tx/Rx operation in sub-GHz LPWAN systems by isolating Tx harmonics from antenna coupling and preserving Rx sensitivity via high return loss (>13 dB on Rx, >16 dB on Tx antenna port). The device requires exact PCB stack-up control-especially 110–210 µm dielectric thickness between layer 1 (RF pads) and layer 2 (ground plane)-to sustain specified 50 Ω, 57 Ω, and 61 Ω transmission line impedances.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 470–510 MHz - Covers EU 433 MHz and CN 470–510 MHz ISM bands for certified LoRa® deployments. |
| Rx Balun Insertion Loss | Typ. 2.20 dB - Minimizes signal attenuation between STM32WL RFI_P/N outputs and antenna path. |
| Tx Filter Insertion Loss | Typ. 2.15 dB - Preserves transmit power efficiency while enabling harmonic compliance. |
| Harmonic Rejection (2f₀) | Typ. 52 dB - Meets ETSI EN 300 220 spectral mask requirements without external filtering. |
| Amplitude Imbalance | ±0.8 dB - Ensures <0.5 dB EVM degradation in differential Rx paths for (G)FSK demodulation. |
| Phase Imbalance | ±2.0° - Maintains quadrature integrity critical for BPSK and LoRa® symbol timing recovery. |
| Package Height | ≤630 µm after reflow - Enables ultra-low-profile designs in space-constrained IoT sensors and wearables. |
Pinout & Package
Package: CSPG (Chip Scale Package Glass), 8-bump flip-chip, 2.15 mm × 1.85 mm footprint, 0.63 mm height, ECOPACK2 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Tx filter input | Connects to STM32WL RFO_HP pin; requires 57 Ω controlled-impedance trace. |
| A2 | Differential-N Rx output | One leg of balanced Rx interface to STM32WL RFI_N_out; routed as 61 Ω odd-mode pair. |
| A3 | Differential-P Rx output | Second leg of balanced Rx interface to STM32WL RFI_P_out; paired with A2 for 53 Ω odd-mode impedance. |
| B1, B2, C2 | Ground terminals | Three dedicated GND bumps (GND1–GND3) ensure low-inductance RF grounding and minimize ground bounce. |
| C1 | Tx filter output | Single-ended 50 Ω antenna port; connects directly to PCB antenna feed point or matching network. |
| C3 | Rx balun input | Single-ended 50 Ω antenna port shared with C1; enables T/R switchless half-duplex operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated balun + filter + matching | Eliminates ≥6 discrete RF components (inductors, capacitors, balun transformer), reducing PCB area by >40% vs. discrete solution. |
| Harmonic rejection up to 10f₀ | Attenuates 2nd–10th harmonics by 36–57 dB, enabling full ETSI/ FCC certification without external filters. |
| Low-profile CSPG construction | 0.63 mm max height post-reflow allows integration into <1.0 mm total-thickness modules (e.g., NB-IoT trackers). |
| Optimized for QFN-4L STM32WL | Pre-characterized impedance match to STM32WL RFO_HP (57 Ω) and RFI_P/N (61 Ω differential), removing layout tuning effort. |
| ECOPACK2 compliance | Meets RoHS, REACH, and halogen-free requirements; qualified for industrial temperature range (−40 °C to +105 °C). |
Applications
| Smart Utility Metering | LoRaWAN Sensor Node |
|---|---|
Use Scenario: Battery-powered water/gas meters transmitting hourly consumption data over 1–5 km using LoRa® in 470–510 MHz band. IC Role / Device Role / Timing Role: RF front-end balun and harmonic filter enabling STM32WL to meet ETSI spectral mask while sustaining >140 dB link budget. Use Value: Reduces bill-of-materials cost by eliminating external SAW filters and matching networks, lowering total RF BOM to 1 passive component. | Use Scenario: Compact environmental sensor node (temp/humidity/pressure) deployed in agricultural fields with 10-year battery life. IC Role / Device Role / Timing Role: Single-component RF interface providing simultaneous Tx harmonic suppression and Rx balun functionality for sub-GHz (G)FSK modulation. Use Value: Enables 2.15 mm × 1.85 mm PCB footprint for complete RF section, supporting enclosure sizes under 25 cm³. |
| Industrial Asset Tracker | LPWAN Gateway Front-End |
Use Scenario: GPS-enabled asset tracker operating in harsh industrial environments with vibration, dust, and wide temperature swings. IC Role / Device Role / Timing Role: Robust RF interface ensuring STM32WL maintains >13 dB Rx return loss and <2.2 dB insertion loss across −40 °C to +105 °C. Use Value: Eliminates thermal drift-induced impedance mismatch seen in discrete LC networks, improving long-term RF stability. | Use Scenario: Multi-channel LoRa® gateway receiving concurrent uplinks from hundreds of end-devices in smart city infrastructure. IC Role / Device Role / Timing Role: High-isolation Tx filter preventing self-desensitization during simultaneous Tx/Rx operation on shared antenna. Use Value: Achieves >50 dB harmonic rejection at 2f₀, allowing co-location of Tx and Rx chains without diplexer or circulator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF front-end balun and harmonic filter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SKY66420-394 | Discrete GaAs MMIC PA + integrated balun; no built-in harmonic filter; requires external LC filter for ETSI compliance. | Targeted at higher-output (+22 dBm) applications; not optimized for STM32WL pinout or impedance. | Select when higher Tx power is required and board space permits external filtering. |
| BALF-SPI-02D3 | Same CSPG package but designed for SPI-based STM32WB Bluetooth LE; 2.4 GHz only; no sub-GHz harmonic filtering. | Not usable in 470–510 MHz LPWAN systems; incompatible impedance network for STM32WL RFO_HP. | Only suitable for dual-band (2.4 GHz + sub-GHz) designs where separate baluns are used per band. |
Compared with SKY66420-394 and BALF-SPI-02D3, BALFLB-WL-08D3 uniquely combines STM32WL-specific impedance matching, integrated harmonic filtering up to 10f₀, and sub-GHz band optimization-enabling certified LPWAN operation with zero external RF components.
Availability
BALFLB-WL-08D3 is available at Aetrix Electronics and suitable for smart utility metering, LoRaWAN sensor nodes, industrial asset tracking, and LPWAN gateway front-ends requiring stable component supply, ECOPACK2 compliance, and validated 4-layer PCB layout support.
Supply support for BALFLB-WL-08D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management devices, and RF components for industrial, automotive, and IoT markets.
BALFLB-WL-08D3 belongs to ST's IPD (Integrated Passive Device) RF portfolio, engineered specifically to simplify sub-GHz wireless system design by replacing discrete matching networks with monolithic glass-based baluns and filters for STM32WL MCUs.
FAQ
What is the maximum RF input power the BALFLB-WL-08D3 can handle?
The BALFLB-WL-08D3 supports a maximum input power of 27 dBm (500 mW) at the RFO_in pin under continuous operation at 25 °C ambient. This rating ensures compatibility with STM32WL's high-power Tx mode (up to +22 dBm output) while maintaining reliability across the full −40 °C to +105 °C operating temperature range.
Does the BALFLB-WL-08D3 require external matching components?
No external matching components are required. The device integrates a fully optimized conjugate-matching network for STM32WL's RFO_HP (57 Ω) and RFI_P/N (61 Ω differential) ports, plus 50 Ω antenna-side termination. Layout must follow ST's recommended land pattern, trace impedances, and ground via density-but no discrete capacitors or inductors are needed.
Can BALFLB-WL-08D3 be used with non-STMicroelectronics MCUs?
While electrically functional with other 470–510 MHz transceivers, BALFLB-WL-08D3's impedance network is specifically tuned for STM32WL's RFO_HP and RFI_P/N pin characteristics. Using it with alternate MCUs may result in >3 dB insertion loss increase or degraded harmonic rejection due to mismatched source/load impedances.
What PCB stack-up parameters are mandatory for optimal RF performance?
The dielectric thickness between layer 1 (RF pads) and layer 2 (solid ground plane) must be maintained within 110–210 µm (±30 % of nominal 160 µm). Deviations beyond this range degrade characteristic impedance control for the 57 Ω RFO_HP and 61 Ω RFI_P/N traces, directly impacting return loss and harmonic suppression performance.
BALFLB-WL-08D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-WFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 470MHz ~ 510MHz
- Impedance - Unbalanced/Balanced:
- -
- Phase Difference:
- 0°
- Insertion Loss (Max):
- 2.2dB
- Return Loss (Min):
- 13dB
- Mounting Type:
- Surface Mount
BALFLB-WL-08D3 FAQ
1.How can I place an order for BALFLB-WL-08D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALFLB-WL-08D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALFLB-WL-08D3 reliable?
The price and inventory of BALFLB-WL-08D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALFLB-WL-08D3 is usually 5 days.
3.What payment methods are accepted for BALFLB-WL-08D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALFLB-WL-08D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALFLB-WL-08D3?
BALFLB-WL-08D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALFLB-WL-08D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALFLB-WL-08D3?
For technical support, including BALFLB-WL-08D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALFLB-WL-08D3 requirements.
6.How does Aetrix verify that BALFLB-WL-08D3 is sourced from the original manufacturer or authorized distributors?
All BALFLB-WL-08D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALFLB-WL-08D3 meets industry standards.
7.What is the process for return or replacement of BALFLB-WL-08D3?
All BALFLB-WL-08D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALFLB-WL-08D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALFLB-WL-08D3 part is unused and in its original packaging.
Return procedure for BALFLB-WL-08D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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