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STMicroelectronics BALFLB-WL-09D3
- Part No.:
- BALFLB-WL-09D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 8-WFBGA, CSPBGA
- Datasheet:
-
BALFLB-WL-09D3.pdf
- Description:
- BALUN,FILTERING AND MATCHING OF
- Quantity:
- Payment:
- Shipping:
Inventory:2,725
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Product details
Overview
BALFLB-WL-09D3 from STMicroelectronics is an ultra-miniature integrated balun, matching network, and Tx harmonic filter optimized for QFN-packaged STM32WL sub-GHz wireless microcontrollers in high-power mode. It provides 50 Ω nominal input impedance conjugate-matched to the STM32WL RFO_HP and RFI_P/N pins, delivers ≤2.15 dB Rx insertion loss and ≤2.00 dB Tx insertion loss across 470–510 MHz, and achieves ≥44 dB harmonic attenuation at 2f₀, enabling LoRa®, (G)FSK, and BPSK modulation in LPWAN edge nodes.
For engineers reviewing the BALFLB-WL-09D3 datasheet, BALFLB-WL-09D3 pinout, BALFLB-WL-09D3 application, or BALFLB-WL-09D3 equivalent, key selection criteria include its CSPG-8 bump package footprint (2.15 × 1.85 mm), 630 µm max profile after reflow, differential Rx balun phase/amplitude imbalance (±2.8° / ±1.1 dB), and verified 470–510 MHz band performance with antenna-side 50 Ω termination.
Technical Context
This device implements ST's IPD (Integrated Passive Device) technology on a nonconductive glass substrate to achieve high RF linearity and thermal stability. Its architecture integrates three functional blocks: a differential Rx balun (SDS-mode), a single-ended Tx harmonic filter (S21-mode), and impedance-matching networks-each tuned specifically for the STM32WL's RFO_HP (92 Ω), RFI_P/N (92 Ω differential), and antenna (50 Ω) interfaces.
The balun operates within a -40 °C to +105 °C ambient range and supports 27 dBm maximum input power. Its RF performance is validated on a 2-layer PCB stack-up with 500–900 µm dielectric thickness, requiring strict adherence to recommended land patterns, ground plane continuity under the device, and via density near RF pads to maintain Z₀ = 50 Ω (antenna lines) and Z₀ = 92 Ω / Zodd = 55 Ω / Zeven = 154 Ω (MCU-side lines).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 470–510 MHz - Covers EU 863–870 MHz and CN 470–510 MHz LPWAN bands with full spec compliance. |
| Rx Insertion Loss | 1.90–2.15 dB - Enables >98% RF power transfer from STM32WL RFI_P/N outputs to antenna path in receive mode. |
| Tx Insertion Loss | 1.65–2.00 dB - Minimizes power loss between STM32WL RFO_HP and antenna while preserving PA efficiency. |
| Harmonic Rejection | ≥44 dB at 2f₀ - Meets ETSI EN 300 220 and FCC Part 15.247 spectral mask requirements for out-of-band emissions. |
| Phase Imbalance | ±2.8° - Ensures <0.1° EVM degradation in differential Rx paths for high-sensitivity LoRa® demodulation. |
| Package Size | 2.15 × 1.85 × 0.63 mm - Fits compact IoT sensor nodes and battery-powered trackers without compromising RF layout integrity. |
Pinout & Package
Delivered in CSPG (Chip Scale Package Glass) format with 8 solder bumps, BALFLB-WL-09D3 uses a flip-chip construction optimized for minimal parasitic inductance and thermal resistance on 2-layer PCBs. The package height is ≤630 µm after reflow, and the marking "W9" identifies the device on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Tx filter input | Connects directly to STM32WL RFO_HP pin (92 Ω single-ended output); requires controlled-Z trace. |
| A2, A3 | Differential Rx balun outputs | Drive STM32WL RFI_N_out and RFI_P_out (92 Ω differential); must be routed as matched-length 55 Ω odd-mode pair. |
| B1, B2, C2 | Ground terminals | Three dedicated GND bumps ensure low-inductance return paths; all must connect to solid layer-1 ground plane. |
| C1 | Tx filter output | 50 Ω single-ended antenna port; connects to external antenna or matching network with 50 Ω microstrip. |
| C3 | Rx balun input | 50 Ω single-ended antenna port shared with C1; enables T/R switching via external RF switch or MCU GPIO control. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated balun + filter | Eliminates need for discrete matching components and external harmonic filters, reducing RF BOM count by ≥6 parts. |
| STM32WL-optimized impedance | Conjugate match to RFO_HP (92 Ω) and RFI_P/N (92 Ω diff) ensures >95% power transfer without external tuning. |
| ECOPACK2 compliance | Meets RoHS, REACH, and halogen-free requirements; qualified for industrial temperature range (-40 to +105 °C). |
| Low-profile CSPG | 0.63 mm max height enables use in space-constrained wearables and smart utility meters with tight mechanical envelopes. |
Applications
| Smart Utility Meters | LoRaWAN End Nodes | |
|---|---|---|
|
Use Scenario: Battery-powered gas/water meters transmitting hourly consumption data over 1–5 km using LoRa® in 470–510 MHz band. IC Role / Device Role / Timing Role: RF front-end balun and harmonic filter interfacing STM32WL MCU to monopole antenna. Use Value: Enables certified ETSI-compliant transmission with >15-year battery life due to ≤2.0 dB Tx insertion loss and integrated filtering. |
Use Scenario: Asset tracking tags deployed in logistics hubs, reporting location via geolocated LoRaWAN gateways. IC Role / Device Role / Timing Role: Single-chip RF interface providing matched 50 Ω antenna port and differential Rx path for STM32WL. Use Value: Reduces PCB area by 35% vs. discrete balun+filter solution while maintaining ±1.1 dB amplitude balance for robust packet reception. |
|
| Industrial Sensor Networks | Smart Agriculture Gateways | |
|
Use Scenario: Wireless vibration/temperature sensors in factory environments operating at 490 MHz with 125 kHz LoRa® spreading factor. IC Role / Device Role / Timing Role: High-isolation balun ensuring clean Rx path amid industrial EMI and co-located 2.4 GHz BLE radios. Use Value: Delivers 18 dB Rx return loss and 48 dB 2f₀ rejection, preventing desensitization from local RF interference sources. |
Use Scenario: Solar-powered field gateways aggregating soil moisture and weather data from 50+ nodes using (G)FSK modulation. IC Role / Device Role / Timing Role: Dual-role RF interface supporting both Tx and Rx on shared antenna via external SPDT switch. |
Use Value: Supports simultaneous Tx/Rx optimization with 50 Ω antenna port and differential Rx inputs, enabling adaptive link budget management. |
Availability
BALFLB-WL-09D3 is available at Aetrix Electronics and suitable for LPWAN infrastructure, battery-powered sensor nodes, and industrial telemetry systems requiring stable component supply, consistent RF performance across production batches, and long-term lifecycle support.
Supply support for BALFLB-WL-09D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.
BALFLB-WL-09D3 belongs to ST's IPD-based RF front-end portfolio, developed specifically to simplify RF design for STM32WL wireless MCUs by integrating matched baluns, filters, and impedance networks into miniature glass-substrate packages.
FAQ
What is the maximum RF input power BALFLB-WL-09D3 can handle?
The device supports up to +27 dBm (500 mW) continuous RF input power at the RFO_in pin, validated per absolute maximum ratings in DS14106 Rev 3. This rating applies at Tamb = 25 °C with proper PCB thermal management, including full ground plane coverage and ≥8 thermal vias under the CSPG body.
Can BALFLB-WL-09D3 be used with STM32WL variants other than QFN-2L packages?
No-BALFLB-WL-09D3 is specifically impedance-matched to the QFN-2L STM32WL package's RFO_HP (92 Ω) and RFI_P/N (92 Ω differential) pinouts. Use with QFN-48 or WLCSP variants requires redesign of matching networks and is not supported per ST's characterization data.
Is external matching required when connecting to a 50 Ω PCB antenna trace?
No external matching is needed-the C1 (Tx) and C3 (Rx) terminals are designed for direct 50 Ω microstrip connection. Layout must follow ST's recommended 50 Ω characteristic impedance, 200 µm copper pad diameter, and 320 µm solder mask opening to maintain specified return loss and insertion loss.
Does BALFLB-WL-09D3 support time-division duplex (TDD) operation?
Yes-it supports TDD via external RF switch control: C1 serves as Tx output, C3 as Rx input, sharing the same 50 Ω antenna port. ST validates this configuration in AN5771 with STM32WL Nucleo boards, achieving <0.3 dB isolation degradation between Tx and Rx paths at 490 MHz.
BALFLB-WL-09D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-WFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 470MHz ~ 510MHz
- Impedance - Unbalanced/Balanced:
- -
- Phase Difference:
- 0°
- Insertion Loss (Max):
- 2.15dB
- Return Loss (Min):
- 14dB
- Mounting Type:
- Surface Mount
BALFLB-WL-09D3 FAQ
1.How can I place an order for BALFLB-WL-09D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALFLB-WL-09D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALFLB-WL-09D3 reliable?
The price and inventory of BALFLB-WL-09D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALFLB-WL-09D3 is usually 5 days.
3.What payment methods are accepted for BALFLB-WL-09D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALFLB-WL-09D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALFLB-WL-09D3?
BALFLB-WL-09D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALFLB-WL-09D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALFLB-WL-09D3?
For technical support, including BALFLB-WL-09D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALFLB-WL-09D3 requirements.
6.How does Aetrix verify that BALFLB-WL-09D3 is sourced from the original manufacturer or authorized distributors?
All BALFLB-WL-09D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALFLB-WL-09D3 meets industry standards.
7.What is the process for return or replacement of BALFLB-WL-09D3?
All BALFLB-WL-09D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALFLB-WL-09D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALFLB-WL-09D3 part is unused and in its original packaging.
Return procedure for BALFLB-WL-09D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALFLB-WL-09D3 Tags
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