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STMicroelectronics BALF-NRF01J5

Part No.:
BALF-NRF01J5
Manufacturer:
STMicroelectronics
Category:
Balun
Package:
5-XFBGA, FCBGA
Datasheet:
AetrixBALF-NRF01J5.pdf
Description:
BALUN 2.4GHZ-2.54GHZ 5XFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,922

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Product details

Overview

BALF-NRF01J5 from STMicroelectronics is an ultra-thin 5-bump flip-chip balun with integrated harmonic filtering and conjugate impedance matching optimized for Nordic Semiconductor's nRF51822-CTAA/CTAC WLCSP RF transceivers. It delivers 2.4–2.54 GHz operation, 2.4 dB typical insertion loss, ±0.3 dB amplitude imbalance, ±7.2° phase imbalance, and >12 dB return loss at 2.45 GHz - enabling compact, high-efficiency Bluetooth Smart wearable designs.

For engineers reviewing the BALF-NRF01J5 datasheet, BALF-NRF01J5 pinout, BALF-NRF01J5 application, or BALF-NRF01J5 equivalent, this component addresses critical RF front-end integration challenges in space-constrained 2.45 GHz ISM band systems requiring matched differential output, harmonic suppression, and minimal PCB footprint (<1.2 mm²) with sub-350 µm profile after reflow.

Technical Context

This balun implements a monolithic IPD (Integrated Passive Device) structure on high-resistivity silicon to achieve precise 50 Ω single-ended to balanced 100 Ω differential conversion while suppressing 2nd harmonic (4.88 GHz, 13.5 dB attenuation) and 3rd harmonic (7.32 GHz, 25 dB attenuation). Its design eliminates external matching components for nRF51822 WLCSP packages.

The device operates across –40 °C to +85 °C, supports 20 dBm maximum input power, and meets HBM ESD rating of 2000 V. Its ultra-thin flip-chip construction uses five solder bumps (227 µm typ. diameter) with 500 µm × 400 µm pitch and 1345 µm × 815 µm die size - enabling direct die-attach without wire bonds or laminate substrates.

Key Specifications

ParameterValue and Actual Design Meaning
Frequency Range2400–2540 MHz - full coverage of 2.4 GHz ISM band including Bluetooth LE channels.
Insertion Loss2.4 dB typ. - ensures minimal RF power loss between nRF51822 SE port and antenna/differential PA path.
Return Loss12 dB typ. - indicates strong 50 Ω input match, reducing reflected power and improving PA efficiency.
Amplitude Imbalance±0.3 dB max - maintains signal symmetry critical for IQ modulation fidelity in BLE transceivers.
Phase Imbalance±7.2° max - preserves orthogonality between differential outputs, minimizing EVM degradation.
2nd Harmonic Attenuation13.5 dB at 4880 MHz - suppresses even-order distortion to meet FCC/ETSI spurious emission limits.
Package Size1345 × 815 µm die - enables placement directly adjacent to nRF51822 WLCSP, minimizing trace inductance.

Pinout & Package

Ultra-thin flip-chip 5-bump package (ECOPACK® compliant, lead-free, UL94 V0 epoxy). No discrete leads; electrical connection via five solder bumps arranged in a defined pitch pattern.

Pin/TerminalCircuit RoleDesign Meaning
Bump 1Single-ended RF input (RFIN)Connects directly to nRF51822 RFO pin; designed for 50 Ω system impedance.
Bump 2Differential RF output (OUT+)Drives positive leg of balanced antenna or PA input; matched to 100 Ω differential load.
Bump 3GNDPrimary RF ground reference; placed centrally for low-inductance return path.
Bump 4Differential RF output (OUT–)Drives negative leg of balanced antenna or PA input; complements OUT+ for true differential signaling.
Bump 5GNDSecondary ground bump; improves thermal dissipation and reduces ground loop inductance.

Key Features

FeatureDesign Value
Conjugate impedance match to nRF51822-CTAA/CTACEliminates need for external matching network, reducing BOM count and layout area by >30%.
Integrated 2nd/3rd harmonic filterMeets ETSI EN 300 328 spectral mask without external LC traps or filters.
Flip-chip 5-bump constructionEnables <350 µm total height after reflow - essential for ultra-thin wearables and hearables.
IPD on high-resistivity siliconDelivers stable Q-factor and temperature-invariant performance across –40 °C to +85 °C.
Nordic-qualified and ST-reliability testedValidated per standard SiP reliability protocols (HTOL, TC, UHAST), supporting industrial lifecycle requirements.

Applications

Bluetooth Low Energy WearablesCompact Medical Sensors

Use Scenario: Ultra-thin wristband with embedded nRF51822 running BLE heart rate monitoring firmware.

IC Role / Device Role / Timing Role: Balun provides matched 50 Ω SE-to-diff conversion and harmonic filtering between nRF51822 RFO and miniature PCB trace antenna.

Use Value: Enables 1.1 mm total stack height while maintaining >75% antenna radiation efficiency and passing FCC Part 15.247 radiated emission tests.

Use Scenario: Disposable patch sensor transmitting ECG data via BLE to smartphone gateway.

IC Role / Device Role / Timing Role: Balun interfaces nRF51822-CTAC to a folded dipole antenna etched on flexible polyimide substrate.

Use Value: Reduces RF front-end area by 45% vs. discrete matching + filter solution, extending battery life through lower insertion loss (2.4 dB).

Smart JewelryIndustrial Asset Tags

Use Scenario: Ring-shaped BLE beacon with curved antenna and constrained internal volume.

IC Role / Device Role / Timing Role: Balun delivers phase/amplitude-balanced differential drive to a meandered ceramic chip antenna.

Use Value: Achieves ±0.3 dB amplitude and ±7.2° phase balance - critical for consistent RSSI accuracy across orientation changes.

Use Scenario: Battery-powered warehouse tag using nRF51822 for periodic temperature/humidity reporting.

IC Role / Device Role / Timing Role: Balun connects nRF51822 to a printed IFA antenna on FR4 PCB with minimal parasitic coupling.

Use Value: 12 dB return loss ensures stable transmit power across voltage droop (1.8–3.3 V), maintaining link budget over 10-year shelf life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar balun/filter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SKY13353-374LFHigher insertion loss (3.1 dB typ.), larger 1.6 × 0.9 mm QFN package, no integrated harmonic filtering.Requires external 2nd/3rd harmonic suppression; unsuitable for sub-1.2 mm² layouts.Select only if board-level filtering is already implemented and footprint margin allows 33% larger area.
DA1311A0.6 dB higher IL (3.0 dB), ±1.2° phase imbalance, not qualified for nRF51822 WLCSP interface.Lacks conjugate match tuning - requires custom matching network for nRF51822 CTAA/CTAC.Use only with newer Nordic SoCs (e.g., nRF52832) where matching differs; not drop-in for nRF51822.

Compared with SKY13353-374LF and DA1311A, BALF-NRF01J5 uniquely combines nRF51822-specific conjugate matching, integrated harmonic filtering, and sub-350 µm profile - delivering lowest system-level RF BOM count and smallest PCB area for legacy BLE wearable designs.

Availability

BALF-NRF01J5 is available at Aetrix Electronics and suitable for Bluetooth Low Energy wearables, compact medical sensors, smart jewelry, and industrial asset tags requiring stable component supply and proven Nordic Semiconductor interoperability.

Supply support for BALF-NRF01J5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for automotive, industrial, and consumer markets.

BALF-NRF01J5 belongs to ST's RF passive portfolio targeting ultra-miniaturized wireless connectivity modules, specifically engineered to simplify RF front-end integration for Nordic-based BLE SoC platforms.

FAQ

Is BALF-NRF01J5 compatible with nRF52 series SoCs?

No. BALF-NRF01J5 is specifically tuned for nRF51822-CTAA and CTAC WLCSP variants. Its conjugate matching network does not align with the output impedance of nRF52832 or nRF52840. Using it with nRF52-series devices results in >3 dB additional insertion loss and degraded return loss below specification.

What assembly process is required for the flip-chip package?

A flux-only reflow process is mandatory - solder paste must not be used. Recommended stencil aperture is 290 × 290 × 100 µm³ (with 0.725 area ratio). Flux residue must be compatible with post-reflow cleaning for medical-grade assemblies. Reflow peak temperature must not exceed 260 °C to avoid bump deformation.

Does BALF-NRF01J5 require external DC blocking capacitors?

No. The device is fully AC-coupled internally; no external DC blocking capacitors are needed on RFIN, OUT+, or OUT– paths. Its IPD structure inherently blocks DC while passing 2.4–2.54 GHz RF signals - verified per DS12205 Section 3.2 on-board measurements.

How is ESD protection implemented in this balun?

BALF-NRF01J5 incorporates on-die ESD protection structures meeting JESD22-A114-C (2000 V HBM) and JESD22-C101-C (500 V CDM) standards. Protection is distributed across all five bumps, with dedicated clamping diodes between RFIN and GND bumps, and symmetric protection on differential outputs relative to GND.

BALF-NRF01J5 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
5-XFBGA, FCBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Frequency Range:
2.4GHz ~ 2.54GHz
Impedance - Unbalanced/Balanced:
-
Phase Difference:
Insertion Loss (Max):
2.4dB
Return Loss (Min):
9dB
Mounting Type:
Surface Mount

BALF-NRF01J5 FAQ

1.How can I place an order for BALF-NRF01J5 through Aetrix?

Please submit a Request for Quotation (RFQ) for BALF-NRF01J5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BALF-NRF01J5 reliable?

The price and inventory of BALF-NRF01J5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-NRF01J5 is usually 5 days.

3.What payment methods are accepted for BALF-NRF01J5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-NRF01J5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BALF-NRF01J5?

BALF-NRF01J5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BALF-NRF01J5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BALF-NRF01J5?

For technical support, including BALF-NRF01J5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-NRF01J5 requirements.

6.How does Aetrix verify that BALF-NRF01J5 is sourced from the original manufacturer or authorized distributors?

All BALF-NRF01J5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-NRF01J5 meets industry standards.

7.What is the process for return or replacement of BALF-NRF01J5?

All BALF-NRF01J5 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-NRF01J5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BALF-NRF01J5 part is unused and in its original packaging.

Return procedure for BALF-NRF01J5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BALF-NRF01J5 Tags

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