STMicroelectronics BALF-NRG-02D3
- Part No.:
- BALF-NRG-02D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 4-UFBGA, CSPBGA
- Datasheet:
-
BALF-NRG-02D3.pdf
- Description:
- BALUN 2.4GHZ-2.5GHZ 50/50 4UFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:16,629
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BALF-NRG-02D3 from STMicroelectronics is an ultra-miniature integrated balun with conjugate impedance matching (50 Ω nominal input) and harmonic filtering, optimized for direct interface with ST's BlueNRG Bluetooth Low Energy transceiver ICs. It delivers 1.33–1.85 dB insertion loss, <±1 dB amplitude imbalance, and <±3.5° phase imbalance across 2400–2500 MHz, enabling compact, high-performance RF front-end design in BLE wearable sensors.
For engineers reviewing the BALF-NRG-02D3 datasheet, BALF-NRG-02D3 pinout, BALF-NRG-02D3 application, or BALF-NRG-02D3 equivalent, key selection criteria include differential return loss (17–19 dB), H2–H7 harmonic attenuation (min. 29 dB), phase/amplitude balance tolerance, and CSPG 0.4 mm flip-chip package compatibility with BlueNRG reference layouts.
Technical Context
This device implements a monolithic passive RF network using ST's IPD (Integrated Passive Device) technology on non-conductive glass substrate, integrating both impedance transformation (single-ended 50 Ω to differential BlueNRG-matched Zdiff) and 2nd–7th harmonic suppression. No external matching components are required.
The balun operates as a fixed-ratio, frequency-specific interface: its conjugate match is tailored exclusively to BlueNRG transceiver output impedance and differential input requirements, with no tuning capability or voltage control. All performance metrics are specified at Tamb = 25 °C and validated over −40 to +105 °C operating range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency range | 2400–2500 MHz: Full BLE channel coverage without re-tuning or layout adjustment |
| Insertion loss | 1.33–1.85 dB: Directly impacts link budget margin and receiver sensitivity |
| Differential return loss | 17–19 dB: Ensures >98% power transfer into BlueNRG differential port |
| H2 harmonic attenuation | 40–49 dB: Meets ETSI EN 300 328 spectral mask for 2nd harmonic suppression |
| Phase imbalance | ±3.5°: Maintains I/Q signal orthogonality critical for BLE modulation fidelity |
| Package | CSPG 0.4 mm pitch flip-chip: Enables <1.0 mm² PCB footprint and eliminates wirebond inductance |
| ESD rating | 2000 V HBM: Supports handling during SMT assembly without special precautions |
Pinout & Package
Package: CSPG (Chip Scale Package on Glass), 0.4 mm pitch, 4-bump flip-chip configuration with solder bumps on non-conductive glass substrate. Dimensions: 0.85 × 0.85 × 0.25 mm (L × W × H).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RFIN | Single-ended RF input | Accepts 50 Ω matched output from BlueNRG PA; no DC blocking required |
| RFOUTP | Differential RF output (+) | Drives BlueNRG differential antenna port positive terminal |
| RFOUTN | Differential RF output (−) | Drives BlueNRG differential antenna port negative terminal |
| GND | RF ground reference | Direct thermal/electrical connection to PCB ground plane via bottom-side bump |
Key Features
| Feature | Design Value |
|---|---|
| Integrated harmonic filter (H2–H7) | Eliminates need for discrete LC harmonic traps, reducing BOM count by ≥3 parts |
| Conjugate impedance match to BlueNRG | Enables direct connection without external matching network or simulation iteration |
| Ultra-low phase/amplitude imbalance | Preserves BLE 2-Mbps GFSK modulation integrity and reduces EVM degradation |
| IPD-on-glass construction | Delivers stable Q-factor and minimal dielectric loss vs. silicon-based passive integration |
| CSPG 0.4 mm footprint | Supports routing under package and enables <1.2 mm² total RF section area in wearables |
Applications
| BLE Smart Tag | Medical Sensor Beacon |
|---|---|
Use Scenario: Compact asset tracker with coin-cell battery and PCB antenna. IC Role / Device Role / Timing Role: Balun interface between BlueNRG-M2SA SoC and inverted-F PCB antenna. Use Value: Enables 10+ meter BLE range while meeting FCC Part 15.247 radiated emission limits via integrated H2–H7 filtering. | Use Scenario: Disposable glucose monitor transmitting glucose readings every 5 minutes. IC Role / Device Role / Timing Role: RF interface element ensuring consistent differential drive to chip antenna under varying body coupling conditions. Use Value: ±1 dB amplitude/±3.5° phase balance maintains >95% packet success rate across temperature and mechanical flex. |
| Wireless Keyboard | Industrial BLE Gateway Node |
Use Scenario: Ultra-thin mechanical keyboard with low-latency HID-over-GATT reporting. IC Role / Device Role / Timing Role: Single-ended-to-differential conversion stage preceding BlueNRG-2 RF transceiver. Use Value: 1.33 dB typical insertion loss preserves transmit power efficiency, extending 2 AAA battery life to >18 months. | Use Scenario: Factory-floor sensor hub aggregating data from 32 BLE nodes in 2.4 GHz ISM band. IC Role / Device Role / Timing Role: Front-end balun in each BlueNRG-3-based sub-module for coexistence robustness. Use Value: 21–30 dB single-ended return loss minimizes inter-channel crosstalk in dense RF environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun filter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SKY13370-374LF | Wider bandwidth (2.4–2.5 GHz), higher IL (2.2 dB typ), no integrated harmonic filter | Requires external LC harmonic trap; suitable for multi-band Zigbee/BLE designs | Select only if harmonics filtering is handled elsewhere in RF chain |
| DA1311A | Same 2.4–2.5 GHz range, 1.5 dB IL, but 0.9 mm × 0.9 mm LGA package (vs. 0.85 mm × 0.85 mm CSPG) | Larger footprint and higher parasitic inductance; less optimal for space-constrained wearables | Prefer when reworkability or standard reflow profile compatibility is prioritized over miniaturization |
Compared with SKY13370-374LF and DA1311A, BALF-NRG-02D3 uniquely combines BlueNRG-specific conjugate matching, integrated H2–H7 filtering, and sub-1 mm² CSPG packaging-enabling zero-component RF front-end simplification in ST BlueNRG-based designs.
Availability
BALF-NRG-02D3 is available at Aetrix Electronics and suitable for Bluetooth Low Energy wearables, medical telemetry devices, and industrial sensor beacons requiring stable component supply, long-term lifecycle support, and guaranteed ST original sourcing.
Supply support for BALF-NRG-02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.
The BALF-NRG-02D3 belongs to ST's RF passive portfolio, developed specifically to simplify and miniaturize BLE system-level integration for its BlueNRG family of ultra-low-power wireless SoCs.
FAQ
Is BALF-NRG-02D3 compatible with BlueNRG-1, BlueNRG-2, and BlueNRG-3?
Yes. The BALF-NRG-02D3 is explicitly designed for conjugate matching to all BlueNRG-series transceivers (BlueNRG-1, -2, -3, and -M2SA). Its impedance network and harmonic filtering meet the RF port specifications and layout recommendations published in each device's reference design documentation.
Can this balun be used with non-ST BLE transceivers like nRF52832 or CC2640R2F?
No. The BALF-NRG-02D3's matching network is customized to BlueNRG's specific differential port impedance and output characteristics. Using it with other transceivers results in degraded return loss (>12 dB), increased insertion loss (>2.5 dB), and insufficient harmonic suppression due to mismatched source impedance.
What is the recommended PCB layout for optimal H2–H7 harmonic suppression?
Follow ST's land pattern in Figure 15: symmetric 0.22 mm copper pads with 0.32 mm solder mask opening, grounded keep-out zone beneath the package, and uninterrupted ground plane under the entire RF path. Avoid vias or traces within 0.3 mm of bump edges to preserve harmonic filter Q-factor.
Does BALF-NRG-02D3 require DC blocking capacitors on its RF ports?
No. The device contains no internal DC path; RFIN, RFOUTP, and RFOUTN are all AC-coupled by design. ST's reference schematics omit DC blocking capacitors, and adding them degrades amplitude/phase balance and return loss performance.
BALF-NRG-02D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 4-UFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 2.4GHz ~ 2.5GHz
- Impedance - Unbalanced/Balanced:
- 50 / 50Ohm
- Phase Difference:
- 3°
- Insertion Loss (Max):
- 1.3dB
- Return Loss (Min):
- 19dB
- Mounting Type:
- Surface Mount
BALF-NRG-02D3 FAQ
1.How can I place an order for BALF-NRG-02D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-NRG-02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-NRG-02D3 reliable?
The price and inventory of BALF-NRG-02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-NRG-02D3 is usually 5 days.
3.What payment methods are accepted for BALF-NRG-02D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-NRG-02D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-NRG-02D3?
BALF-NRG-02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-NRG-02D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-NRG-02D3?
For technical support, including BALF-NRG-02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-NRG-02D3 requirements.
6.How does Aetrix verify that BALF-NRG-02D3 is sourced from the original manufacturer or authorized distributors?
All BALF-NRG-02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-NRG-02D3 meets industry standards.
7.What is the process for return or replacement of BALF-NRG-02D3?
All BALF-NRG-02D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-NRG-02D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-NRG-02D3 part is unused and in its original packaging.
Return procedure for BALF-NRG-02D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALF-NRG-02D3 Tags

-
2450BL15B0100001E
Johanson Technology Inc.

-
0900BL15D0050001E
Johanson Technology Inc.

-
0900PC16J0042001E
Johanson Technology Inc.

-
2450BM15A0002001E
Johanson Technology Inc.

-
2450BM14G0011001T
Johanson Technology Inc.

-
BD0810N50100AHF
TTM Technologies, Inc.

-
1720BL15B0050001E
Johanson Technology Inc.

-
0900PC15A0036001E
Johanson Technology Inc.

-
0868BM15C0001001E
Johanson Technology Inc.

-
0915BM15A0001001E
Johanson Technology Inc.

-
HHM1776B3
TDK Corporation

-
2450BM14E0003001T
Johanson Technology Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

