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STMicroelectronics BALF-NRG-02J5
- Part No.:
- BALF-NRG-02J5
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 4-XFBGA, FCBGA
- Datasheet:
-
BALF-NRG-02J5.pdf
- Description:
- 50 OHM ULTRA THIN BALUN WITH
- Quantity:
- Payment:
- Shipping:
Inventory:3,789
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Product details
Overview
BALF-NRG-02J5 from STMicroelectronics is an ultraminiature 2.45 GHz balun filter with integrated harmonic suppression and conjugate impedance matching optimized for BlueNRG-134 and BlueNRG-234 WLCSP Bluetooth SoCs. It delivers 1.65 dB typical insertion loss, ±1.1 dB amplitude imbalance, ±4.5° phase imbalance, 50 Ω single-ended input, and <350 µm profile after reflow-enabling compact wearable RF front-end designs.
For engineers reviewing the BALF-NRG-02J5 datasheet, BALF-NRG-02J5 pinout, BALF-NRG-02J5 application, or BALF-NRG-02J5 equivalent, key selection criteria include differential-to-single-ended conversion fidelity at 2.4–2.5 GHz, harmonic attenuation (H2–H7), ultra-thin flip-chip integration, and ST-qualified reliability for SiP modules.
Technical Context
This balun implements a passive IPD (Integrated Passive Device) structure on high-resistivity silicon to achieve precise 50 Ω single-ended to balanced 100 Ω differential transformation. Its design targets the specific package parasitics and RF port impedances of ST's BlueNRG-134/234 WLCSP, enabling direct die-to-die integration without external matching components.
The device integrates bandpass filtering and harmonic rejection up to 7th order (16.8–17.5 GHz), with measured H2 attenuation ≥37 dB and H3 ≥50 dB in differential mode. Its 4-bump flip-chip construction eliminates bond wires, minimizing parasitic inductance and preserving phase/amplitude balance across the 2.4–2.5 GHz ISM band.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2400–2500 MHz - Full 100 MHz bandwidth covering entire Bluetooth LE 2.4 GHz ISM band |
| Insertion Loss | 1.35–1.65 dB - Low loss preserves RF link budget between SoC and antenna |
| Amplitude Imbalance | ±1.1 dB - Ensures minimal I/Q signal distortion in differential receiver paths |
| Phase Imbalance | ±4.5° - Maintains orthogonal signal integrity critical for BLE demodulation |
| H3 Attenuation | 50–56 dB - Strong third-harmonic suppression prevents out-of-band emissions & interference |
| Package Size | 1.385 mm × 0.855 mm - <1.2 mm² footprint enables placement directly adjacent to WLCSP die |
| Profile Height | <350 µm after reflow - Enables ultra-thin system-in-package (SiP) and wearable form factors |
Pinout & Package
Ultra-thin flip-chip package with 4 solder bumps: two DIFF (differential output), one SE (single-ended RF input), and one GND (ground reference). Bump layout supports direct mounting onto PCB pads aligned to BlueNRG WLCSP land patterns.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DIFF (Bump 1) | Differential output terminal A | Provides one leg of balanced 100 Ω output to SoC's differential RF transceiver port |
| DIFF (Bump 2) | Differential output terminal B | Provides complementary leg of balanced output; phase inverted relative to Bump 1 |
| SE | Single-ended RF input | 50 Ω matched port for connection to external antenna or RF switch |
| GND | RF ground reference | Low-inductance return path essential for harmonic suppression and impedance stability |
Key Features
| Feature | Design Value |
|---|---|
| Conjugate match to BlueNRG-134/234 | Pre-characterized 50 Ω SE → 100 Ω diff transformation eliminates need for discrete matching network |
| Harmonic filtering (H2–H7) | Integrated bandstop response suppresses 2nd–7th harmonics without external filters or ferrites |
| Flip-chip bump geometry | Four precisely spaced Cu bumps (202–252 µm diameter) enable low-parasitic, high-yield assembly |
| ECOPACK® compliance | Lead-free, RoHS-compliant epoxy meets UL94 V0 flammability rating |
| ST-qualified reliability | Validated per standard JEDEC/ST reliability protocols for use in SiP modules |
Applications
| Wearable BLE Sensor Node | Compact Smart Tag |
|---|---|
Use Scenario: Ultra-low-power Bluetooth beacon worn on wrist or embedded in clothing. IC Role / Device Role / Timing Role: Balun interface between BlueNRG-234 WLCSP and miniature chip antenna. Use Value: <350 µm height and <1.2 mm² area allow full RF front-end integration within 8 mm × 8 mm module footprint. | Use Scenario: Asset-tracking tag powered by coin cell, requiring minimal board space and EMI control. IC Role / Device Role / Timing Role: Harmonic filter and impedance transformer in transmit/receive path. Use Value: Integrated H2–H7 attenuation eliminates need for external SAW filter, reducing BOM count and layout complexity. |
| Medical Patch Monitor | Wireless Hearing Aid Link |
Use Scenario: Disposable skin-adherent patch transmitting physiological data via BLE. IC Role / Device Role / Timing Role: Differential RF interface ensuring robust signal integrity under mechanical flex. Use Value: ±1.1 dB amplitude and ±4.5° phase imbalance maintain EVM performance despite PCB bending or thermal cycling. | Use Scenario: Miniaturized earpiece with bidirectional audio streaming over BLE. IC Role / Device Role / Timing Role: Matched balun enabling low-noise receive sensitivity and clean transmit spectrum. Use Value: 26–34 dB SE return loss ensures stable 50 Ω antenna coupling, minimizing SWR-induced power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun filter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BALF-NRG-02D3 | Same IPD architecture but 0.4 mm pitch, 0.6 mm × 0.6 mm footprint; 1.8 dB max IL | Designed for BlueNRG-1/2 QFN packages-not WLCSP; larger footprint limits wearable use | Select only if using QFN-based BlueNRG variants and board space permits larger device |
| SKY13370-374LF | Discrete GaAs balun; 2.4–2.5 GHz; 1.9 dB IL; no integrated harmonic filtering | Requires external LC or SAW filter for harmonic compliance; higher assembly cost | Choose when legacy PCB layout lacks space for integrated filter or when GaAs process preference exists |
Compared with BALF-NRG-02D3 and SKY13370-374LF, BALF-NRG-02J5 uniquely combines WLCSP-optimized conjugate matching, sub-350 µm profile, and full H2–H7 harmonic suppression in a single passive die-reducing total RF BOM count by up to three components in wearable SiP designs.
Availability
BALF-NRG-02J5 is available at Aetrix Electronics and suitable for wearable sensor nodes, compact smart tags, and medical patch monitors requiring stable component supply and qualified RF performance at 2.45 GHz.
Supply support for BALF-NRG-02J5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader delivering intelligent solutions for automotive, industrial, and consumer applications, with deep expertise in RF analog, MEMS, and microcontroller technologies.
This part belongs to ST's BALF balun filter product line, engineered specifically for seamless RF integration with its BlueNRG Bluetooth SoC family-minimizing design risk and accelerating time-to-market for ultra-compact wireless devices.
FAQ
What is the recommended PCB land pattern for BALF-NRG-02J5?
The datasheet specifies a non-solder-mask-defined copper pad diameter of 220 µm (180–260 µm range), with 320 µm solder mask opening and 220 µm stencil aperture. The recommended land pattern aligns with BlueNRG WLCSP bump pitch and includes 100 µm clearance to adjacent traces to prevent RF coupling.
Does BALF-NRG-02J5 require external DC blocking capacitors?
No. BALF-NRG-02J5 is a fully passive, AC-coupled IPD device with no DC path between ports. It operates without external DC blocking capacitors and is compatible with both AC- and DC-coupled BlueNRG-134/234 RF interfaces as specified in ST's hardware design guides.
How is BALF-NRG-02J5 qualified for reliability in SiP modules?
ST qualified BALF-NRG-02J5 per standard JEDEC and internal reliability procedures-including HTOL, TC, UHAST, and MSL3 testing-specifically for integration into system-in-package modules. Qualification covers thermal cycling, moisture sensitivity, and long-term bias stress under conditions representative of wearable end-use environments.
Can BALF-NRG-02J5 be used with non-ST Bluetooth SoCs?
While optimized for BlueNRG-134/234 WLCSP impedance profiles, BALF-NRG-02J5 may be usable with other 2.4 GHz SoCs if their differential port impedance matches ~100 Ω and layout allows flip-chip mounting. However, ST does not characterize or guarantee performance outside its qualified BlueNRG ecosystem.
BALF-NRG-02J5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 4-XFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 2.4GHz ~ 2.5GHz
- Impedance - Unbalanced/Balanced:
- 50 / 50Ohm
- Phase Difference:
- 4.5°
- Insertion Loss (Max):
- 1.65dB
- Return Loss (Min):
- 26dB
- Mounting Type:
- Surface Mount
BALF-NRG-02J5 FAQ
1.How can I place an order for BALF-NRG-02J5 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-NRG-02J5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-NRG-02J5 reliable?
The price and inventory of BALF-NRG-02J5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-NRG-02J5 is usually 5 days.
3.What payment methods are accepted for BALF-NRG-02J5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-NRG-02J5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-NRG-02J5?
BALF-NRG-02J5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-NRG-02J5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-NRG-02J5?
For technical support, including BALF-NRG-02J5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-NRG-02J5 requirements.
6.How does Aetrix verify that BALF-NRG-02J5 is sourced from the original manufacturer or authorized distributors?
All BALF-NRG-02J5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-NRG-02J5 meets industry standards.
7.What is the process for return or replacement of BALF-NRG-02J5?
All BALF-NRG-02J5 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-NRG-02J5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-NRG-02J5 part is unused and in its original packaging.
Return procedure for BALF-NRG-02J5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALF-NRG-02J5 Tags
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2450BL15B0100001E
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0900BL15D0050001E
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0900PC16J0042001E
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BD0810N50100AHF
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1720BL15B0050001E
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0900PC15A0036001E
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0868BM15C0001001E
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HHM1776B3
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2450BM14E0003001T
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