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STMicroelectronics BALF-SPI2-02D3
- Part No.:
- BALF-SPI2-02D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 6-WFBGA, FCBGA
- Datasheet:
-
BALF-SPI2-02D3.pdf
- Description:
- BALUN 433MHZ 6WFBGA FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:27,470
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Product details
Overview
BALF-SPI2-02D3 from STMicroelectronics is an ultra-miniature flip-chip balun filter integrating matching network and harmonic suppression, specifically conjugate-matched to the ST S2-LP RF transceiver at 433 MHz with 50 Ω nominal input impedance, 2.20 dB typical RX insertion loss, and 58 dB harmonic attenuation at 2fo - deployed in sub-GHz ISM band wireless sensor nodes.
For engineers reviewing the BALF-SPI2-02D3 datasheet, BALF-SPI2-02D3 pinout, BALF-SPI2-02D3 application, or BALF-SPI2-02D3 equivalent, key selection criteria include differential RX impedance matching to S2-LP, TX harmonic filtering performance up to 7fo, insertion loss budget under 3.6 dB, phase imbalance ≤ ±2.1°, and compatibility with 0.63 mm × 1.55 mm flip-chip assembly.
Technical Context
This balun uses ST's IPD (Integrated Passive Device) technology on non-conductive glass substrate to achieve high Q-factor and low parasitic coupling. It integrates both RX-side differential-to-single-ended conversion and TX-side harmonic filtering in a single passive die.
The device implements a custom impedance transformation network optimized for the S2-LP's differential RX port (ZRX ≈ 100 Ω differential) and single-ended TX output (ZTX ≈ 50 Ω), while maintaining antenna port impedance at 50 Ω across 433 MHz ±10 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency range | 433 MHz center frequency, ±10 MHz operational bandwidth for ISM band compliance |
| RX insertion loss | 2.20 dB typical - defines minimum signal path loss between S2-LP RX pins and antenna |
| TX harmonic attenuation | 58 dB at 2fo - ensures >50 dB suppression of second harmonic to meet ETSI EN 300 220 radiated emission limits |
| Phase imbalance | ±2.1° - maintains quadrature integrity critical for S2-LP's O-QPSK demodulation accuracy |
| Amplitude imbalance | ±1.1 dB - preserves I/Q amplitude symmetry required for <1% EVM in sub-GHz PHY layer |
| Package height | <620 μm after reflow - enables ultra-thin PCB designs in wearables and compact IoT modules |
| ESD rating | 2000 V HBM - supports robust handling during automated SMT assembly without additional protection circuitry |
Pinout & Package
Flip-Chip 6-bump package (0.63 mm × 1.55 mm footprint, 0.255 mm bump pitch), mounted face-down with solder bumps contacting PCB pads. Total thickness <620 μm after reflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TX | Single-ended TX output connection | Connects directly to S2-LP's TX pin; matches 50 Ω source impedance into balun input |
| GND | Ground reference terminal | Two dedicated GND bumps provide low-inductance return path for both TX and RX paths |
| RXP / RXN | Differential RX input terminals | Interface to S2-LP's differential RX port (100 Ω diff); require matched trace lengths on PCB |
| ANT | Single-ended antenna port | 50 Ω output to antenna feedline; integrates harmonic filtering before radiation |
Key Features
| Feature | Design Value |
|---|---|
| Conjugate impedance match to S2-LP | Optimized ZTX = 50 Ω and ZRX = 100 Ω differential - eliminates external matching components |
| Integrated harmonic filter | 52–57 dB attenuation from 2fo to 7fo - replaces discrete LC filter stages in BOM |
| Ultra-low profile | Height <620 μm - enables conformal shielding and stacked-module integration in space-constrained designs |
| IPD-on-glass construction | Reduces substrate loss vs. silicon-based passives - improves Q-factor and insertion loss stability over temperature |
| ECOPACK®2 compliance | Halogen-free, RoHS-compliant materials - meets industrial and medical regulatory requirements |
Applications
| Wireless Sensor Node | Smart Metering Transmitter |
|---|---|
Use Scenario: Battery-powered environmental sensor transmitting temperature/humidity data via S2-LP at 433 MHz. IC Role / Device Role / Timing Role: Balun filter providing impedance transformation and harmonic suppression between S2-LP and PCB trace antenna. Use Value: Enables >10-year battery life by eliminating discrete matching components and reducing RF path loss to 2.2 dB. | Use Scenario: AMI smart meter using S2-LP for periodic utility data upload in licensed sub-GHz band. IC Role / Device Role / Timing Role: Integrated TX filter ensuring harmonics remain below ETSI Class 1 limits without external filtering. Use Value: Reduces BOM count by 4 passive components and shrinks RF section area by 35% vs. discrete solution. |
| Industrial Remote Control | Asset Tracking Beacon |
Use Scenario: Handheld remote operating machinery via short-burst commands at 433 MHz. IC Role / Device Role / Timing Role: Differential RX interface preserving signal integrity for reliable packet reception in noisy factory environments. Use Value: Phase/amplitude imbalance ≤ ±2.1°/±1.1 dB maintains <0.8% EVM, enabling 99.95% packet success rate at -105 dBm RSSI. | Use Scenario: GPS-denied indoor asset tag broadcasting location via LoRaWAN-compatible sub-GHz PHY. IC Role / Device Role / Timing Role: Antenna interface with integrated harmonic rejection to avoid interference with adjacent 868 MHz ISM systems. Use Value: 58 dB 2fo attenuation prevents out-of-band emissions that would trigger co-location rejection in multi-radio gateways. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun filter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK MM8201-2450 | Designed for 2.45 GHz Wi-Fi/BT; no 433 MHz optimization or S2-LP matching | Requires full external matching network for S2-LP; adds 3–4 passive components | Select only if redesigning for dual-band operation and accepting +1.8 dB RX loss penalty |
| Qorvo QPB9050 | Active front-end module with LNA and PA; not a passive balun | Replaces entire S2-LP RF section - incompatible with existing S2-LP layout and firmware | Consider only for new architectures requiring higher output power (>13 dBm) and integrated receive gain |
Compared with TDMM8201-2450 and QPB9050, BALF-SPI2-02D3 delivers lowest system-level insertion loss and smallest footprint when used with ST S2-LP, avoiding redesign cost and performance trade-offs inherent in generic or active alternatives.
Availability
BALF-SPI2-02D3 is available at Aetrix Electronics and suitable for wireless sensor nodes, smart metering transmitters, industrial remote controls, and asset tracking beacons requiring stable component supply and guaranteed long-term availability.
Supply support for BALF-SPI2-02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.
BALF-SPI2-02D3 belongs to ST's IPD-based RF passive portfolio, engineered specifically to simplify RF front-end design for sub-GHz transceivers like S2-LP by integrating matching and filtering in one ultra-miniature package.
FAQ
What is the recommended PCB land pattern for BALF-SPI2-02D3?
The datasheet specifies a 220 µm copper pad diameter with 320 µm solder mask opening and 220 µm stencil aperture for 3-mil stencils. Clearance of 250 µm around pads is required for sensitivity, and a 1000 µm trace length between S2-LP QFN center and balun IPD center is mandatory to maintain impedance control and minimize coupling.
Can BALF-SPI2-02D3 be used with RFICs other than ST S2-LP?
No - its impedance network is customized exclusively for S2-LP's differential RX (100 Ω) and single-ended TX (50 Ω) ports. Using it with other transceivers results in mismatch loss exceeding 4 dB and degraded harmonic rejection due to unoptimized internal matching topology.
What reflow profile must be used for reliable solder joint formation?
A peak temperature of 240–245 °C for 60 seconds (max 90 s) is required, with ramp rates limited to ≤3 °C/s pre-peak and ≤2 °C/s cooling. Air convection must be minimized to prevent component shift, and PCB support must be rigid during reflow to avoid warpage-induced misalignment.
Is BALF-SPI2-02D3 compatible with halogen-free PCB laminates?
Yes - the device is ECOPACK®2 compliant and qualified for use with halogen-free FR-4 and polyimide substrates. Its glass-based IPD structure exhibits minimal CTE mismatch with these materials, preventing solder joint fatigue under thermal cycling from -40 °C to +105 °C.
BALF-SPI2-02D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 6-WFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 433MHz
- Impedance - Unbalanced/Balanced:
- 50 / -Ohm
- Phase Difference:
- 2.1°
- Insertion Loss (Max):
- 3.6dB
- Return Loss (Min):
- 6.5dB
- Mounting Type:
- Surface Mount
BALF-SPI2-02D3 FAQ
1.How can I place an order for BALF-SPI2-02D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BALF-SPI2-02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BALF-SPI2-02D3 reliable?
The price and inventory of BALF-SPI2-02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BALF-SPI2-02D3 is usually 5 days.
3.What payment methods are accepted for BALF-SPI2-02D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BALF-SPI2-02D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BALF-SPI2-02D3?
BALF-SPI2-02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BALF-SPI2-02D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BALF-SPI2-02D3?
For technical support, including BALF-SPI2-02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BALF-SPI2-02D3 requirements.
6.How does Aetrix verify that BALF-SPI2-02D3 is sourced from the original manufacturer or authorized distributors?
All BALF-SPI2-02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BALF-SPI2-02D3 meets industry standards.
7.What is the process for return or replacement of BALF-SPI2-02D3?
All BALF-SPI2-02D3 units undergo pre-shipment inspection (PSI). If there is an issue with BALF-SPI2-02D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BALF-SPI2-02D3 part is unused and in its original packaging.
Return procedure for BALF-SPI2-02D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BALF-SPI2-02D3 Tags
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