STMicroelectronics BAL-NRF02D3
- Part No.:
- BAL-NRF02D3
- Manufacturer:
- STMicroelectronics
- Category:
- Balun
- Package:
- 5-UFBGA, CSPBGA
- Datasheet:
-
BAL-NRF02D3.pdf
- Description:
- BALUN 2.4-2.54GHZ 5UFBGA CSPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:59,598
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAL-NRF02D3 from STMicroelectronics is an ultraminiature 2.45 GHz balun with integrated matching network and harmonics filter, designed for differential RF interface between Nordic Semiconductor nRF51422/nRF51822 transceivers and antenna. It provides 50 Ω single-ended input impedance, conjugate match to nRF51xx CEAA/CDAB/CFAC variants, 1.9 dB typical insertion loss, <0.15 dB amplitude imbalance, and <6° phase imbalance across 2400–2540 MHz.
For engineers reviewing the BAL-NRF02D3 datasheet, BAL-NRF02D3 pinout, BAL-NRF02D3 application, or BAL-NRF02D3 equivalent, key selection criteria include its flip-chip 5-bump package footprint (<1.2 mm²), ESD robustness (2000 V HBM), 2nd/3rd harmonic suppression (44 dB & 20 dB), and qualification for nRFgo module integration.
Technical Context
The BAL-NRF02D3 implements a passive, glass-substrate IPD-based balun architecture optimized for 2.4 GHz ISM band operation. It integrates both impedance transformation (50 Ω SE → matched differential) and harmonic filtering-providing 44 dB attenuation at 4880 MHz (2f₀) and 20 dB at 7320 MHz (3f₀).
Its design targets direct replacement of discrete matching networks in nRF51xx reference layouts, eliminating external components while maintaining RF performance compliance with Nordic's CEAA/CDAB/CFAC IC revisions. The device operates over −40 °C to +105 °C and supports ≤20 dBm input power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2400–2540 MHz bandwidth covering full 2.4 GHz ISM band |
| Insertion Loss | 1.9 dB typical - minimizes RF path loss between transceiver and antenna |
| Return Loss | 12 dB minimum - ensures ≥94% power transfer at SE port |
| Amplitude Imbalance | ≤0.15 dB - maintains balanced signal integrity for I/Q or differential PA drive |
| Phase Imbalance | ≤6° - preserves orthogonality critical for modulation fidelity |
| Harmonic Suppression | 44 dB @ 4880 MHz, 20 dB @ 7320 MHz - meets FCC/ETSI spurious emission limits |
| ESD Rating | 2000 V HBM - enables robust handling during PCB assembly and field operation |
Pinout & Package
Flip-Chip 5-bump package (SK marking), dimensions 0.85 × 1.4 mm, height <585 µm after reflow (220 µm pad). No solder mask defined land pattern recommended with 220 µm copper pad and 320 µm solder mask opening.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Bump 1 | Single-Ended RF Input (RFIN) | 50 Ω matched port connecting to nRF51xx RFOUT pin |
| Bump 2 | Differential Output A (ANT1) | One leg of balanced antenna interface; requires symmetric trace routing |
| Bump 3 | GND | RF ground reference; must connect to solid ground plane under device |
| Bump 4 | Differential Output B (ANT2) | Complementary leg of balanced antenna interface; 180° phase opposite ANT1 |
| Bump 5 | GND | Second RF ground terminal; improves grounding integrity in compact layout |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Matching + Filtering | Eliminates ≥4 external components (capacitors/inductors) in nRF51xx reference designs |
| Ultralow Profile | <585 µm height enables ultra-thin wearable and IoT PCBs with tight Z-axis constraints |
| nRF51xx-Specific Optimization | Validated by Nordic for CEAA/CDAB/CFAC IC revisions across all build codes listed in datasheet Tables 4–5 |
| IPD-on-Glass Technology | Delivers stable Q-factor and temperature-invariant performance vs. FR4-based discrete solutions |
Applications
| Bluetooth Low Energy Module | Wireless Sensor Node |
|---|---|
Use Scenario: Compact BLE beacon using nRF51822-CEAA in coin-cell-powered asset tracker. IC Role / Device Role / Timing Role: Balun interfaces transceiver RFOUT to chip antenna, enabling certified 2.4 GHz radiated performance. Use Value: Reduces BOM count by 4 passive components and saves 1.2 mm² PCB area versus discrete matching network. | Use Scenario: Battery-operated environmental sensor node transmitting temperature/humidity via BLE. IC Role / Device Role / Timing Role: Provides matched differential drive to PCB loop antenna, ensuring reliable link budget in metal-enclosed enclosures. Use Value: Maintains <6° phase imbalance to preserve modulation EVM, supporting >95% packet success rate at 10 m range. |
| Smart Wearable Device | Medical IoT Transmitter |
Use Scenario: Wrist-worn fitness tracker requiring sub-1 mm profile and FCC/CE certification. IC Role / Device Role / Timing Role: Balun delivers low-loss RF path from nRF51422-CFAC to flexible printed antenna. Use Value: Achieves <585 µm total height post-reflow, meeting mechanical stack-up requirements without sacrificing RF efficiency. | Use Scenario: ISO 13485-compliant glucose monitor transmitting encrypted BLE data to smartphone. IC Role / Device Role / Timing Role: Harmonic-filtering balun suppresses 2nd/3rd harmonics to meet medical EMC immunity standards. Use Value: 44 dB 2f₀ attenuation eliminates need for additional shielding or filtering, reducing design validation time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balun applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK MM8430-2600 | 0.8 × 1.0 mm footprint; 2.2 dB IL; no integrated harmonic filtering | Requires external LC filter for 2f₀/3f₀ suppression | Select when board space is tighter but harmonic compliance can be handled externally |
| Johanson 2450BM14E0001 | 1.0 × 1.37 mm; 2.4 dB IL; 50 Ω SE to 100 Ω diff; no Nordic-specific tuning | Needs custom matching for nRF51xx output impedance | Select for multi-platform designs where Nordic-specific optimization is not required |
Compared with TDMM8430-2600 and Johanson 2450BM14E0001, BAL-NRF02D3 uniquely combines Nordic-validated conjugate matching, on-die harmonic filtering, and smallest footprint-reducing design iteration cycles for nRF51xx-based products.
Availability
BAL-NRF02D3 is available at Aetrix Electronics and suitable for Bluetooth Low Energy modules, wireless sensor nodes, smart wearables, and medical IoT transmitters requiring stable component supply and consistent RF performance across production batches.
Supply support for BAL-NRF02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering automotive, industrial, and consumer ICs with emphasis on energy efficiency and system integration.
BAL-NRF02D3 belongs to ST's RF Passive Components product line, engineered specifically to simplify RF front-end design for ultra-low-power wireless SoCs-targeting seamless integration with Nordic, Silicon Labs, and TI BLE transceivers.
FAQ
What is the maximum RF input power rating for BAL-NRF02D3?
The BAL-NRF02D3 has an absolute maximum input power rating of 20 dBm (100 mW) per the datasheet's limiting values table. This rating applies across the full 2400–2540 MHz operating band and is validated under continuous-wave conditions at Tamb = 25 °C. Exceeding this level risks permanent degradation of the IPD structure.
Does BAL-NRF02D3 require external DC blocking capacitors?
No. The BAL-NRF02D3 is fully AC-coupled internally and does not require external DC blocking capacitors on either the single-ended input or differential outputs. Its design integrates all necessary coupling elements within the IPD structure, enabling direct connection to nRF51xx RFOUT and antenna traces per Nordic's reference schematics.
Can BAL-NRF02D3 be used with nRF52832 or nRF52840 devices?
No. BAL-NRF02D3 is specifically characterized and qualified only for nRF51422 and nRF51822 variants (CEAA/CDAB/CFAC). Its impedance matching network is tuned to the output characteristics of those first-generation Nordic SoCs. nRF52-series devices have different RF output impedance and power levels, requiring baluns such as BALF-NRF02D3 or BALF-NRF01D3.
What is the recommended reflow profile for BAL-NRF02D3's flip-chip package?
ST specifies peak reflow temperature ≤260 °C for ≤10 seconds, with ramp-up rate ≤3 °C/s and ramp-down rate ≤6 °C/s. The device uses lead-free solder and complies with JEDEC J-STD-020 moisture sensitivity level 3. Boards must be baked if exposed to ambient >60% RH for >12 hours prior to reflow to prevent popcorning.
BAL-NRF02D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 5-UFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency Range:
- 2.4GHz ~ 2.54GHz
- Impedance - Unbalanced/Balanced:
- 50 / -Ohm
- Phase Difference:
- 6°
- Insertion Loss (Max):
- 1.9dB
- Return Loss (Min):
- 12dB
- Mounting Type:
- Surface Mount
BAL-NRF02D3 FAQ
1.How can I place an order for BAL-NRF02D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAL-NRF02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAL-NRF02D3 reliable?
The price and inventory of BAL-NRF02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAL-NRF02D3 is usually 5 days.
3.What payment methods are accepted for BAL-NRF02D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAL-NRF02D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAL-NRF02D3?
BAL-NRF02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAL-NRF02D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAL-NRF02D3?
For technical support, including BAL-NRF02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAL-NRF02D3 requirements.
6.How does Aetrix verify that BAL-NRF02D3 is sourced from the original manufacturer or authorized distributors?
All BAL-NRF02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAL-NRF02D3 meets industry standards.
7.What is the process for return or replacement of BAL-NRF02D3?
All BAL-NRF02D3 units undergo pre-shipment inspection (PSI). If there is an issue with BAL-NRF02D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAL-NRF02D3 part is unused and in its original packaging.
Return procedure for BAL-NRF02D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAL-NRF02D3 Tags

-
2450BL15B0100001E
Johanson Technology Inc.

-
0900BL15D0050001E
Johanson Technology Inc.

-
0900PC16J0042001E
Johanson Technology Inc.

-
2450BM15A0002001E
Johanson Technology Inc.

-
2450BM14G0011001T
Johanson Technology Inc.

-
BD0810N50100AHF
TTM Technologies, Inc.

-
1720BL15B0050001E
Johanson Technology Inc.

-
0900PC15A0036001E
Johanson Technology Inc.

-
0868BM15C0001001E
Johanson Technology Inc.

-
0915BM15A0001001E
Johanson Technology Inc.

-
HHM1776B3
TDK Corporation

-
2450BM14E0003001T
Johanson Technology Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

