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STMicroelectronics BAL-NRF02D3

Part No.:
BAL-NRF02D3
Manufacturer:
STMicroelectronics
Category:
Balun
Package:
5-UFBGA, CSPBGA
Datasheet:
AetrixBAL-NRF02D3.pdf
Description:
BALUN 2.4-2.54GHZ 5UFBGA CSPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:59,598

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Product details

Overview

BAL-NRF02D3 from STMicroelectronics is an ultraminiature 2.45 GHz balun with integrated matching network and harmonics filter, designed for differential RF interface between Nordic Semiconductor nRF51422/nRF51822 transceivers and antenna. It provides 50 Ω single-ended input impedance, conjugate match to nRF51xx CEAA/CDAB/CFAC variants, 1.9 dB typical insertion loss, <0.15 dB amplitude imbalance, and <6° phase imbalance across 2400–2540 MHz.

For engineers reviewing the BAL-NRF02D3 datasheet, BAL-NRF02D3 pinout, BAL-NRF02D3 application, or BAL-NRF02D3 equivalent, key selection criteria include its flip-chip 5-bump package footprint (<1.2 mm²), ESD robustness (2000 V HBM), 2nd/3rd harmonic suppression (44 dB & 20 dB), and qualification for nRFgo module integration.

Technical Context

The BAL-NRF02D3 implements a passive, glass-substrate IPD-based balun architecture optimized for 2.4 GHz ISM band operation. It integrates both impedance transformation (50 Ω SE → matched differential) and harmonic filtering-providing 44 dB attenuation at 4880 MHz (2f₀) and 20 dB at 7320 MHz (3f₀).

Its design targets direct replacement of discrete matching networks in nRF51xx reference layouts, eliminating external components while maintaining RF performance compliance with Nordic's CEAA/CDAB/CFAC IC revisions. The device operates over −40 °C to +105 °C and supports ≤20 dBm input power.

Key Specifications

ParameterValue and Actual Design Meaning
Frequency Range2400–2540 MHz bandwidth covering full 2.4 GHz ISM band
Insertion Loss1.9 dB typical - minimizes RF path loss between transceiver and antenna
Return Loss12 dB minimum - ensures ≥94% power transfer at SE port
Amplitude Imbalance≤0.15 dB - maintains balanced signal integrity for I/Q or differential PA drive
Phase Imbalance≤6° - preserves orthogonality critical for modulation fidelity
Harmonic Suppression44 dB @ 4880 MHz, 20 dB @ 7320 MHz - meets FCC/ETSI spurious emission limits
ESD Rating2000 V HBM - enables robust handling during PCB assembly and field operation

Pinout & Package

Flip-Chip 5-bump package (SK marking), dimensions 0.85 × 1.4 mm, height <585 µm after reflow (220 µm pad). No solder mask defined land pattern recommended with 220 µm copper pad and 320 µm solder mask opening.

Pin/TerminalCircuit RoleDesign Meaning
Bump 1Single-Ended RF Input (RFIN)50 Ω matched port connecting to nRF51xx RFOUT pin
Bump 2Differential Output A (ANT1)One leg of balanced antenna interface; requires symmetric trace routing
Bump 3GNDRF ground reference; must connect to solid ground plane under device
Bump 4Differential Output B (ANT2)Complementary leg of balanced antenna interface; 180° phase opposite ANT1
Bump 5GNDSecond RF ground terminal; improves grounding integrity in compact layout

Key Features

FeatureDesign Value
Integrated Matching + FilteringEliminates ≥4 external components (capacitors/inductors) in nRF51xx reference designs
Ultralow Profile<585 µm height enables ultra-thin wearable and IoT PCBs with tight Z-axis constraints
nRF51xx-Specific OptimizationValidated by Nordic for CEAA/CDAB/CFAC IC revisions across all build codes listed in datasheet Tables 4–5
IPD-on-Glass TechnologyDelivers stable Q-factor and temperature-invariant performance vs. FR4-based discrete solutions

Applications

Bluetooth Low Energy ModuleWireless Sensor Node

Use Scenario: Compact BLE beacon using nRF51822-CEAA in coin-cell-powered asset tracker.

IC Role / Device Role / Timing Role: Balun interfaces transceiver RFOUT to chip antenna, enabling certified 2.4 GHz radiated performance.

Use Value: Reduces BOM count by 4 passive components and saves 1.2 mm² PCB area versus discrete matching network.

Use Scenario: Battery-operated environmental sensor node transmitting temperature/humidity via BLE.

IC Role / Device Role / Timing Role: Provides matched differential drive to PCB loop antenna, ensuring reliable link budget in metal-enclosed enclosures.

Use Value: Maintains <6° phase imbalance to preserve modulation EVM, supporting >95% packet success rate at 10 m range.

Smart Wearable DeviceMedical IoT Transmitter

Use Scenario: Wrist-worn fitness tracker requiring sub-1 mm profile and FCC/CE certification.

IC Role / Device Role / Timing Role: Balun delivers low-loss RF path from nRF51422-CFAC to flexible printed antenna.

Use Value: Achieves <585 µm total height post-reflow, meeting mechanical stack-up requirements without sacrificing RF efficiency.

Use Scenario: ISO 13485-compliant glucose monitor transmitting encrypted BLE data to smartphone.

IC Role / Device Role / Timing Role: Harmonic-filtering balun suppresses 2nd/3rd harmonics to meet medical EMC immunity standards.

Use Value: 44 dB 2f₀ attenuation eliminates need for additional shielding or filtering, reducing design validation time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar balun applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TDK MM8430-26000.8 × 1.0 mm footprint; 2.2 dB IL; no integrated harmonic filteringRequires external LC filter for 2f₀/3f₀ suppressionSelect when board space is tighter but harmonic compliance can be handled externally
Johanson 2450BM14E00011.0 × 1.37 mm; 2.4 dB IL; 50 Ω SE to 100 Ω diff; no Nordic-specific tuningNeeds custom matching for nRF51xx output impedanceSelect for multi-platform designs where Nordic-specific optimization is not required

Compared with TDMM8430-2600 and Johanson 2450BM14E0001, BAL-NRF02D3 uniquely combines Nordic-validated conjugate matching, on-die harmonic filtering, and smallest footprint-reducing design iteration cycles for nRF51xx-based products.

Availability

BAL-NRF02D3 is available at Aetrix Electronics and suitable for Bluetooth Low Energy modules, wireless sensor nodes, smart wearables, and medical IoT transmitters requiring stable component supply and consistent RF performance across production batches.

Supply support for BAL-NRF02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering automotive, industrial, and consumer ICs with emphasis on energy efficiency and system integration.

BAL-NRF02D3 belongs to ST's RF Passive Components product line, engineered specifically to simplify RF front-end design for ultra-low-power wireless SoCs-targeting seamless integration with Nordic, Silicon Labs, and TI BLE transceivers.

FAQ

What is the maximum RF input power rating for BAL-NRF02D3?

The BAL-NRF02D3 has an absolute maximum input power rating of 20 dBm (100 mW) per the datasheet's limiting values table. This rating applies across the full 2400–2540 MHz operating band and is validated under continuous-wave conditions at Tamb = 25 °C. Exceeding this level risks permanent degradation of the IPD structure.

Does BAL-NRF02D3 require external DC blocking capacitors?

No. The BAL-NRF02D3 is fully AC-coupled internally and does not require external DC blocking capacitors on either the single-ended input or differential outputs. Its design integrates all necessary coupling elements within the IPD structure, enabling direct connection to nRF51xx RFOUT and antenna traces per Nordic's reference schematics.

Can BAL-NRF02D3 be used with nRF52832 or nRF52840 devices?

No. BAL-NRF02D3 is specifically characterized and qualified only for nRF51422 and nRF51822 variants (CEAA/CDAB/CFAC). Its impedance matching network is tuned to the output characteristics of those first-generation Nordic SoCs. nRF52-series devices have different RF output impedance and power levels, requiring baluns such as BALF-NRF02D3 or BALF-NRF01D3.

What is the recommended reflow profile for BAL-NRF02D3's flip-chip package?

ST specifies peak reflow temperature ≤260 °C for ≤10 seconds, with ramp-up rate ≤3 °C/s and ramp-down rate ≤6 °C/s. The device uses lead-free solder and complies with JEDEC J-STD-020 moisture sensitivity level 3. Boards must be baked if exposed to ambient >60% RH for >12 hours prior to reflow to prevent popcorning.

BAL-NRF02D3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
5-UFBGA, CSPBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Frequency Range:
2.4GHz ~ 2.54GHz
Impedance - Unbalanced/Balanced:
50 / -Ohm
Phase Difference:
Insertion Loss (Max):
1.9dB
Return Loss (Min):
12dB
Mounting Type:
Surface Mount

BAL-NRF02D3 FAQ

1.How can I place an order for BAL-NRF02D3 through Aetrix?

Please submit a Request for Quotation (RFQ) for BAL-NRF02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BAL-NRF02D3 reliable?

The price and inventory of BAL-NRF02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAL-NRF02D3 is usually 5 days.

3.What payment methods are accepted for BAL-NRF02D3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAL-NRF02D3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BAL-NRF02D3?

BAL-NRF02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BAL-NRF02D3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BAL-NRF02D3?

For technical support, including BAL-NRF02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAL-NRF02D3 requirements.

6.How does Aetrix verify that BAL-NRF02D3 is sourced from the original manufacturer or authorized distributors?

All BAL-NRF02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAL-NRF02D3 meets industry standards.

7.What is the process for return or replacement of BAL-NRF02D3?

All BAL-NRF02D3 units undergo pre-shipment inspection (PSI). If there is an issue with BAL-NRF02D3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BAL-NRF02D3 part is unused and in its original packaging.

Return procedure for BAL-NRF02D3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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