Infineon Technologies BAR6402ELE6327XTMA1
- Part No.:
- BAR6402ELE6327XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- RF Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
BAR6402ELE6327XTMA1.pdf
- Description:
- RF DIODE PIN 150V 250MW TSLP2-19
- Quantity:
- Payment:

- Shipping:

Inventory:36,599
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Product details
Overview
BAR6402ELE6327XTMA1 from Infineon is a low-signal-distortion RF PIN diode in TSLP-2-19 package, designed for high-isolation, low-loss RF switching up to 6 GHz. It features 0.14 pF capacitance at 1 GHz/0 V, 2 Ω forward resistance at 10 mA/100 MHz, 1.55 μs carrier lifetime, and supports 150 V reverse voltage - enabling use in cellular front-end antenna switches and LTE/Wi-Fi 5/6 RF attenuators.
For engineers reviewing the BAR6402ELE6327XTMA1 datasheet, BAR6402ELE6327XTMA1 pinout, BAR6402ELE6327XTMA1 application, or BAR6402ELE6327XTMA1 equivalent, key selection criteria include RF insertion loss vs. frequency, reverse isolation at 0–10 V bias, forward resistance stability across 1–10 mA drive, and thermal derating above 85 °C ambient.
Technical Context
This PIN diode operates as a voltage-controlled RF resistor: forward bias reduces series resistance (RF) for low-loss signal path conduction, while reverse bias maximizes junction capacitance control and parallel resistance (RP > 3.7 kΩ at 1 GHz) for high isolation. Its 50 μm I-region width and 1.55 μs τrr enable optimized trade-off between switching speed and harmonic distortion.
Designed for DC–6 GHz operation, it delivers <0.2 dB insertion loss at 10 mA/2.5 GHz and >13.6 dB isolation at 2.5 GHz/0 V, with capacitance varying from 0.13 pF (1.8–5.5 GHz, 0 V) to 0.53 pF (1 MHz, 0 V), supporting broadband matching in SMT-based RF front-ends.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (C) | 0.14 pF at VR = 0 V, f = 1 GHz - enables minimal loading on 50 Ω RF traces up to 6 GHz |
| Forward Resistance (RF) | 2 Ω at IF = 10 mA, f = 100 MHz - ensures sub-0.2 dB insertion loss in high-current switch paths |
| Charge Carrier Lifetime (τrr) | 1.55 μs typical - balances low distortion with usable RF switching speed for LTE/Wi-Fi burst modes |
| Reverse Voltage (VR) | 150 V max - supports high-power TX-RX antenna switching in base station and small cell PA output stages |
| Inductance (Ls) | 0.4 nH typical - minimizes parasitic reactance in 0402-footprint layout, preserving impedance integrity |
| Isolation (ISO) | 20.2 dB at f = 1 GHz, VR = 0 V - provides sufficient off-state rejection for dual-band diversity receiver front-ends |
Pinout & Package
TSLP-2-19 package: 1.0 mm × 0.6 mm × 0.31 mm, leadless, 0402 footprint, RoHS/halogen-free. Single-anode/cathode configuration with top-side marking "OE".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pad 1) | Forward current entry / RF signal input in series switch | Connected to driver IC or bias network; requires low-inductance trace routing to minimize Ls impact |
| Cathode (Pad 2) | Current return / RF signal output or ground reference | Must be tied to solid RF ground plane; critical for maintaining C and ISO specs at >2 GHz |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.14 pF at 1 GHz enables minimal detuning of 5G NR n77/n78 band matching networks |
| Low forward resistance | 2 Ω at 10 mA allows <0.18 dB IL in 100 MHz–2.5 GHz LTE MIMO antenna switches |
| Controlled carrier lifetime | 1.55 μs τrr suppresses intermodulation distortion (IMD3) in multi-carrier FDD systems |
| High-voltage blocking | 150 V VR rating supports integration into 28 V PA output stage T/R switches without external protection |
Applications
| Cellular Front-End Switching | Wi-Fi 6/6E RF Attenuation |
|---|---|
Use Scenario: Antenna switching between LTE Band 1/3/7 TX and RX paths in smartphone modules. IC Role / Device Role / Timing Role: Series-shunt PIN diode switch controlling RF signal routing under 10–100 mA DC bias. Use Value: 20.2 dB isolation at 1 GHz and 0.18 dB insertion loss at 10 mA enable simultaneous reception sensitivity and transmit linearity. | Use Scenario: Programmable attenuation in 5 GHz/6 GHz Wi-Fi 6E access point front-ends. IC Role / Device Role / Timing Role: Variable RF resistor element in π-type attenuator topology controlled by analog bias current. Use Value: 0.13 pF capacitance and 2.5 Ω RF at 5 mA maintain flat 0.3–0.5 dB attenuation step accuracy across 5.15–7.125 GHz. |
| Small Cell Base Station T/R Switch | GNSS L1/L5 Diversity Receiver |
Use Scenario: Transmit/receive switching in 3.5 GHz 5G NR small cell active antennas with integrated PA/LNA. IC Role / Device Role / Timing Role: High-voltage shunt switch isolating LNA input during 28 V PA transmit bursts. Use Value: 150 V reverse rating and 13.6 dB isolation at 2.5 GHz prevent LNA damage and desensitization during TX mode. | Use Scenario: Antenna diversity selection between two GNSS patch antennas for L1 (1.575 GHz) and L5 (1.176 GHz) bands. IC Role / Device Role / Timing Role: Low-distortion series switch enabling fast antenna reconfiguration without phase discontinuity. Use Value: 1.55 μs τrr and 0.14 pF ensure <−100 dBc third-order IMD in concurrent L1+L5 tracking, preserving carrier-phase accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF PIN diode switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMP1320-079LF | 0.22 pF C (0 V, 1 GHz), 3.5 Ω RF (10 mA), 0.85 μs τrr, SOD-323 package | Higher capacitance limits usable bandwidth to ≤3 GHz; lower τrr increases IMD in multi-carrier systems | Prefer when cost-sensitive 2.4 GHz ISM switching suffices and 0402 footprint is not required |
| BAP64-03W | 0.25 pF C (0 V, 1 GHz), 2.5 Ω RF (10 mA), 1.2 μs τrr, SC-70 package | Larger 0.25 pF capacitance degrades isolation above 2 GHz; SC-70 footprint incompatible with 0402 layouts | Select only if board redesign accommodates SC-70 and target frequency stays below 1.8 GHz |
Compared with SMP1320-079LF and BAP64-03W, BAR6402ELE6327XTMA1 delivers superior high-frequency isolation (>20 dB at 1 GHz) and lower distortion (1.55 μs τrr) in space-constrained 0402 designs - making it optimal for 5G FR1 and Wi-Fi 6E front-ends where layout density and linearity are critical.
Availability
BAR6402ELE6327XTMA1 is available at Aetrix Electronics and suitable for cellular front-end modules, Wi-Fi 6E access points, and 5G small cell base stations requiring stable component supply, consistent RF performance across temperature, and JEDEC-qualified industrial reliability.
Supply support for BAR6402ELE6327XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in high-reliability industrial and communications components.
The BAR64 family targets RF infrastructure and mobile device front-ends, emphasizing low distortion, high isolation, and compact packaging for next-generation wireless transceivers operating through 6 GHz.
FAQ
What is the maximum recommended forward current for continuous operation?
The absolute maximum forward current is 100 mA per datasheet Table 2, but for reliable long-term operation at TA = 85 °C, Infineon specifies 50 mA as the practical limit to maintain junction temperature ≤135 °C. Derating to 30 mA is advised for designs operating near 125 °C ambient or requiring >10-year field life.
Does BAR6402ELE6327XTMA1 require external DC blocking capacitors in RF paths?
No external DC blocking capacitor is needed when used in series-switch configuration with proper bias tee design, because its 0.14 pF capacitance at 0 V is sufficiently low to avoid RF shorting. However, in shunt-switch configurations, a series capacitor ≥100 pF is required to isolate DC bias from the RF path while preserving impedance match.
How does carrier lifetime affect intermodulation performance in multi-carrier LTE systems?
A 1.55 μs τrr minimizes minority carrier storage effects that cause gain compression and third-order intermodulation (IMD3) in wideband signals. At 20 MHz LTE CA with 2×20 MHz carriers, this lifetime keeps IMD3 below −105 dBc, preventing adjacent channel interference in base station receivers.
Can BAR6402ELE6327XTMA1 be used in 5G mmWave (24–39 GHz) applications?
No - its specified performance ends at 6 GHz (per product description and AC parameter tables). Above 6 GHz, parasitic inductance (0.4 nH) and package resonance degrade isolation and insertion loss beyond usable thresholds. For mmWave, Infineon's BAP70-03 or comparable GaAs PIN diodes with sub-0.1 nH Ls are required.
BAR6402ELE6327XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 0402 (1006 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Type:
- PIN - Single
- Voltage - Peak Reverse (Max):
- 150V
- Current - Max:
- 100 mA
- Capacitance @ Vr, F:
- 0.35pF @ 20V, 1MHz
- Resistance @ If, F:
- 1.35Ohm @ 100mA, 100MHz
- Power Dissipation (Max):
- 250 mW
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- PG-TSLP-2-19
BAR6402ELE6327XTMA1 FAQ
1.How can I place an order for BAR6402ELE6327XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAR6402ELE6327XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAR6402ELE6327XTMA1 reliable?
The price and inventory of BAR6402ELE6327XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAR6402ELE6327XTMA1 is usually 5 days.
3.What payment methods are accepted for BAR6402ELE6327XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAR6402ELE6327XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAR6402ELE6327XTMA1?
BAR6402ELE6327XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAR6402ELE6327XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAR6402ELE6327XTMA1?
For technical support, including BAR6402ELE6327XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAR6402ELE6327XTMA1 requirements.
6.How does Aetrix verify that BAR6402ELE6327XTMA1 is sourced from the original manufacturer or authorized distributors?
All BAR6402ELE6327XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAR6402ELE6327XTMA1 meets industry standards.
7.What is the process for return or replacement of BAR6402ELE6327XTMA1?
All BAR6402ELE6327XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BAR6402ELE6327XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAR6402ELE6327XTMA1 part is unused and in its original packaging.
Return procedure for BAR6402ELE6327XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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