Infineon Technologies BAR9002ELE6327XTMA1

Overview

BAR9002ELE6327XTMA1 from Infineon is a single silicon RF PIN diode optimized for high-speed RF switching in low-bias-current applications, featuring 0.23 pF capacitance at 1 GHz/0 V, 1.6 Ω forward resistance at 3 mA/100 MHz, and TSLP-2-19 (0402) package. It delivers high isolation (16.9 dB at 1 GHz) and low insertion loss (0.13 dB at 3 mA), enabling compact front-end switch designs in consumer digital media interfaces.

For engineers reviewing the BAR9002ELE6327XTMA1 datasheet, BAR9002ELE6327XTMA1 pinout, BAR9002ELE6327XTMA1 application, or BAR9002ELE6327XTMA1 equivalent, key selection criteria include RF insertion loss vs. bias current, reverse voltage handling (80 V), harmonic distortion balance, and 0402-compatible thermal performance up to 125 °C ambient.

Technical Context

This PIN diode operates as a voltage-controlled RF resistor: forward bias reduces series resistance (RF = 1.4 Ω typ. at 3 mA/1.8 GHz), while reverse bias maximizes shunt impedance (RP = 1.8 kΩ typ. at 0 V/1.8 GHz). Its I-region width (20 µm) and carrier lifetime (750 ns) are tuned for fast switching with minimal harmonic generation.

The device uses a symmetric single-diode structure in a leadless TSLP-2-19 package, supporting bidirectional RF signal routing. Its low parasitic inductance (0.4 nH) and capacitance enable stable performance from 1 GHz to 5.5 GHz without external matching networks in 50 Ω systems.

Key Specifications

Pinout & Package

TSLP-2-19 package (1.0 mm × 0.6 mm × 0.31 mm) with 0402 footprint; leadless, surface-mount, ESD-sensitive construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF PIN diode switching applications.

Compared with SXARD1002Z and BAP64-03W, BAR9002ELE6327XTMA1 uniquely balances ultra-low capacitance (0.23 pF), 80 V reverse rating, and 0402 footprint-making it optimal for space-constrained, multi-band consumer RF switches requiring >16 dB isolation above 1 GHz.

Availability

BAR9002ELE6327XTMA1 is available at Aetrix Electronics and suitable for set-top box tuner switching, digital media player antenna selection, and laptop wireless front-end designs requiring stable component supply across high-volume consumer electronics production.

Supply support for BAR9002ELE6327XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with global manufacturing and R&D centers.

The BAR90-02EL belongs to Infineon's RF PIN diode product line, engineered specifically for low-bias, high-isolation switching in consumer-grade wireless infrastructure and digital media interfaces.

FAQ

What is the maximum continuous forward current for BAR9002ELE6327XTMA1?

The absolute maximum forward current is 100 mA, but the recommended DC operating limit is 30 mA at TA = 25 °C to maintain junction temperature below 150 °C. Derating is required above 25 °C ambient per the thermal curve in Figure 7, where permissible IF drops to ~12 mA at 100 °C ambient.

Does BAR9002ELE6327XTMA1 require external DC blocking capacitors?

Yes-because it is a single-diode structure with no integrated bias tee, external DC blocking capacitors (typically 100 pF) must be placed in series with both anode and cathode paths to prevent RF shorting of bias networks. This is confirmed by the test fixture configuration shown in Figure 5 of the datasheet.

How does BAR9002ELE6327XTMA1 perform at 5.5 GHz?

At 5.5 GHz and 3 mA forward bias, it achieves 0.20 dB insertion loss and 5.6 dB isolation. While isolation degrades versus lower frequencies, its stable 0.20 pF capacitance ensures predictable impedance matching-critical for Wi-Fi 6E front-end filtering where phase consistency matters more than peak isolation.

Is BAR9002ELE6327XTMA1 compatible with standard 0402 pick-and-place equipment?

Yes-the TSLP-2-19 package has identical 1.0 mm × 0.6 mm footprint and coplanar terminal geometry to JEDEC-standard 0402 components. Its 0.31 mm height and leadless terminations meet IPC-7351B density level A requirements for automated assembly with 0.3 mm nozzle vacuum placement.