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Nexperia USA Inc. BC53-10PASX

Part No.:
BC53-10PASX
Manufacturer:
Nexperia USA Inc.
Category:
Single Bipolar Transistors
Package:
3-UDFN Exposed Pad
Datasheet:
AetrixBC53-10PASX.pdf
Description:
TRANS PNP 80V 1A DFN2020D-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,590

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Product details

Overview

BC53-10PASX from Nexperia is a PNP medium power transistor in an ultra-thin DFN2020D-3 (SOT1061D) leadless SMD package, rated for −80 V VCEO, −1 A continuous collector current, and 160 hFE at −150 mA/−2 V, used as high-side switch or MOSFET driver in compact power management circuits.

For engineers reviewing the BC53-10PASX datasheet, BC53-10PASX pinout, BC53-10PASX application, or BC53-10PASX equivalent, key selection criteria include its exposed thermal pad for PCB heat sinking, side-wettable flanks for AOI-compatible solder joint inspection, and dual-current-gain binning within the BC53xPAS family.

Technical Context

This PNP bipolar junction transistor operates with open-base VCEO = −80 V and peak pulsed ICM = −2 A, supporting linear regulation and switching functions where low saturation voltage (VCEsat ≤ −500 mV at −500 mA/−50 mA) and stable DC current gain across temperature are required.

Its DFN2020D-3 package features solderable side pads and an exposed collector thermal pad, enabling thermal resistance as low as 76 K/W (4-layer PCB, 1 cm² collector pad), and supports reflow soldering per JEDEC J-STD-020.

Key Specifications

Parameter Value and Actual Design Meaning
VCEO −80 V - Maximum safe collector-emitter voltage with base open; defines high-side switch blocking capability.
IC −1 A - Continuous DC collector current rating; supports medium-power load switching without forced cooling.
hFE 63–160 - DC current gain range at VCE = −2 V, IC = −150 mA; enables predictable base drive sizing for saturation.
VCEsat ≤ −500 mV - Collector-emitter saturation voltage at IC = −500 mA, IB = −50 mA; minimizes conduction loss in switching applications.
Ptot 1.65 W - Total power dissipation on 4-layer FR4 PCB with 1 cm² collector pad; sets thermal design margin for ambient up to 125 °C.
fT 145 MHz - Transition frequency at VCE = −5 V, IC = −50 mA; supports moderate-speed switching (e.g., <500 kHz PWM).
Rth(j-sp) 20 K/W - Junction-to-solder-point thermal resistance in free air; confirms efficient heat transfer via side-wettable flanks.

Pinout & Package

BC53-10PASX uses the DFN2020D-3 (SOT1061D) 3-terminal leadless package: 2.0 mm × 2.0 mm × 0.65 mm body, exposed collector thermal pad on underside, and side-wettable flanks for automated optical inspection.

Pin/Terminal Circuit Role Design Meaning
1 Base (B) Control terminal for forward-biased PNP operation; requires negative base current relative to emitter to turn on.
2 Emitter (E) Current source terminal; connected to higher potential rail in high-side configuration; electrically tied to PCB ground plane when used as low-side switch.
3 Collector (C) Output current path; thermally and electrically connected to exposed bottom pad for enhanced power handling and thermal dissipation.

Key Features

Feature Design Value
Exposed thermal pad Enables 76 K/W junction-to-ambient thermal resistance on 4-layer PCB, reducing die temperature rise by >30 % vs. standard SOIC.
Side-wettable flanks Allows 100 % Automated Optical Inspection (AOI) of solder joints without X-ray, improving manufacturing yield and reliability verification.
Two hFE bins BC53-10PASX (63–160) and BC53-16PASX (100–250) allow precise gain matching in parallel or feedback-critical designs like linear regulators.
Ultra-thin profile 0.65 mm max height enables use in space-constrained portable electronics and stacked PCB assemblies.

Applications

Linear Voltage Regulators Battery-Driven Devices

Use Scenario: Pass transistor in adjustable LDOs delivering up to 1 A output with <1 % line/load regulation.

IC Role / Device Role / Timing Role: PNP pass element controlling output voltage via emitter-follower configuration with feedback to base.

Use Value: Low VCEsat (≤−500 mV) reduces dropout voltage and improves efficiency at full load; stable hFE ensures consistent loop gain across temperature.

Use Scenario: Load switch disconnecting battery from peripheral circuitry during sleep mode in wearables and IoT sensors.

IC Role / Device Role / Timing Role: High-side PNP switch controlled by microcontroller GPIO through base resistor network.

Use Value: −80 V VCEO provides margin against battery overvoltage transients; side-wettable flanks ensure reliable solder joint integrity in high-volume SMT assembly.

MOSFET Drivers Power Management

Use Scenario: Level-shifting stage driving N-channel high-side MOSFET gates in half-bridge motor drivers or DC-DC converters.

IC Role / Device Role / Timing Role: Fast-switching PNP pull-up device complementing NPN/NMOS pull-down for gate charge/discharge control.

Use Value: 145 MHz fT supports clean 100–500 kHz gate drive edges; low Cc (15 pF) minimizes Miller effect-induced delay.

Use Scenario: Current-sense amplifier front-end or enable logic in multi-rail PMIC subsystems for industrial controllers.

IC Role / Device Role / Timing Role: Discrete gain stage amplifying shunt voltage or buffering enable signals between isolated domains.

Use Value: Dual hFE binning allows matched gain pairs for differential sensing; exposed thermal pad maintains <125 °C junction temp under sustained 0.8 A load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP medium power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
BC807-16W Same SOT-323 package; lower VCEO (−45 V), lower IC (−500 mA), hFE 100–250; no side-wettable flanks. Limited to ≤36 V systems; unsuitable for high-side switches above 40 V or >0.7 A loads. Select only if board space is constrained to SOT-323 footprint and voltage/current demands are reduced.
MBT3906DW1T1G SOT-363 dual PNP; VCEO = −40 V, IC = −200 mA per device; hFE 100–300; no thermal pad. Designed for signal-level dual-channel logic inversion or small-signal biasing-not medium-power switching. Use only for low-current complementary pair applications; not a functional replacement for BC53-10PASX's power capability.

Compared with BC807-16W and MBT3906DW1T1G, BC53-10PASX delivers 78 % higher voltage rating, 100 % higher continuous current, and integrated thermal management-making it uniquely suitable for compact, high-efficiency 12–48 V power rails requiring AOI-verified assembly.

Availability

BC53-10PASX is available at Aetrix Electronics and suitable for linear voltage regulators, battery-driven devices, MOSFET drivers, and high-side switches requiring stable component supply across automotive-adjacent industrial, medical, and consumer electronics programs.

Supply support for BC53-10PASX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable discrete, logic, and MOSFET solutions for high-volume applications.

BC53-10PASX belongs to the BC53xPAS series of medium-power PNP transistors engineered for space-constrained, thermally demanding power management and switching applications in portable and industrial equipment.

FAQ

What is the maximum allowable junction temperature for BC53-10PASX?

The absolute maximum junction temperature (Tj) is 150 °C, as defined in IEC 60134 limiting values. Operation above this threshold risks permanent degradation of hFE and increased leakage. Derating is required above 25 °C ambient-e.g., Ptot drops to 1.1 W at 75 °C ambient on a 4-layer PCB with 1 cm² collector pad.

Does BC53-10PASX support lead-free reflow soldering?

Yes-BC53-10PASX is qualified for lead-free reflow per JEDEC J-STD-020, with a peak temperature of 260 °C for 30 seconds. Its DFN2020D-3 package uses matte tin-plated side pads and an exposed copper thermal pad compatible with standard SnAgCu paste and profile ramp/soak/reflow cycles.

How does the side-wettable flank design improve manufacturability?

The side-wettable flanks provide visible, solderable surfaces along the package edges, enabling 100 % Automated Optical Inspection (AOI) of solder fillet formation without X-ray. This eliminates hidden voids or insufficient wetting-critical for field-reliability in high-volume consumer and industrial production lines.

Can BC53-10PASX replace BC53-16PASX in a design?

Only if the application does not require hFE ≥100 at IC = −150 mA. BC53-10PASX has hFE 63–160, while BC53-16PASX guarantees 100–250 in the same condition. In feedback-critical circuits (e.g., precision LDOs), substituting may cause instability or poor load regulation due to lower minimum gain.

BC53-10PASX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
3-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Transistor Type:
PNP
Current - Collector (Ic) (Max):
1 A
Voltage - Collector Emitter Breakdown (Max):
80 V
Vce Saturation (Max) @ Ib, Ic:
500mV @ 50mA, 500mA
Current - Collector Cutoff (Max):
100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce:
63 @ 150mA, 2V
Power - Max:
420 mW
Frequency - Transition:
145MHz
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2020D-3

BC53-10PASX FAQ

1.How can I place an order for BC53-10PASX through Aetrix?

Please submit a Request for Quotation (RFQ) for BC53-10PASX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BC53-10PASX reliable?

The price and inventory of BC53-10PASX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC53-10PASX is usually 5 days.

3.What payment methods are accepted for BC53-10PASX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC53-10PASX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BC53-10PASX?

BC53-10PASX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BC53-10PASX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BC53-10PASX?

For technical support, including BC53-10PASX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC53-10PASX requirements.

6.How does Aetrix verify that BC53-10PASX is sourced from the original manufacturer or authorized distributors?

All BC53-10PASX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC53-10PASX meets industry standards.

7.What is the process for return or replacement of BC53-10PASX?

All BC53-10PASX units undergo pre-shipment inspection (PSI). If there is an issue with BC53-10PASX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BC53-10PASX part is unused and in its original packaging.

Return procedure for BC53-10PASX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BC53-10PASX Tags

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