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Nexperia USA Inc. BC55-16PASX
- Part No.:
- BC55-16PASX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- 3-UDFN Exposed Pad
- Datasheet:
-
BC55-16PASX.pdf
- Description:
- TRANS NPN 60V 1A DFN2020D-3
- Quantity:
- Payment:
- Shipping:
Inventory:8,620
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Product details
Overview
BC55-16PASX from Nexperia is an NPN medium power transistor in a DFN2020D-3 (SOT1061D) leadless surface-mount package, rated for 60 V VCEO, 1 A continuous collector current, and 250 hFE at IC = 150 mA / VCE = 2 V. It serves as a high-side switch or MOSFET driver in compact power management circuits where thermal efficiency and AOI-compatible solder joints are critical.
For engineers reviewing the BC55-16PASX datasheet, BC55-16PASX pinout, BC55-16PASX application, or BC55-16PASX equivalent, this device is selected for linear voltage regulation, battery-powered load switching, and low-voltage amplifier stages requiring stable DC current gain across −55 °C to 150 °C ambient range.
Technical Context
This transistor operates in active and saturation regions with guaranteed hFE of 100–250 under pulsed conditions (tp ≤ 300 µs, duty cycle ≤ 0.02), enabling precise current-controlled switching in power stage interfaces. Its exposed collector pad provides direct thermal conduction to PCB copper, supporting up to 1.65 W total power dissipation on 4-layer FR4 with 1 cm² collector pad.
The DFN2020D-3 package features side-wettable flanks for automated optical inspection of solder joints and delivers 76 K/W junction-to-ambient thermal resistance under optimized mounting - significantly lower than legacy SOT-23 equivalents due to enhanced thermal path geometry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 60 V - Maximum safe collector-emitter voltage with base open; defines upper rail limit in high-side switch designs. |
| IC | 1 A - Continuous DC collector current rating; supports sustained 1 A loads without derating at Tamb ≤ 25 °C. |
| hFE | 100–250 - DC current gain at VCE = 2 V, IC = 150 mA, Tamb = 25 °C; enables low-base-drive-current switching in driver applications. |
| VCE(sat) | ≤ 500 mV - Collector-emitter saturation voltage at IC = 500 mA, IB = 50 mA; ensures <1 W conduction loss in saturated switching mode. |
| Rth(j-a) | 76 K/W - Junction-to-ambient thermal resistance on 4-layer FR4 with 1 cm² collector pad; allows reliable operation up to 125 °C ambient with 1.1 W dissipation. |
| fT | 100–180 MHz - Transition frequency at VCE = 5 V, IC = 50 mA; supports stable small-signal amplification up to ~100 MHz. |
Pinout & Package
BC55-16PASX uses the DFN2020D-3 (SOT1061D) ultra-thin leadless package: 2 mm × 2 mm × 0.65 mm body, 1.3 mm pitch, side-wettable flanks, and exposed collector pad for thermal and electrical performance. The package is compatible with standard reflow profiles and AOI inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Current-controlled input node; requires ≥50 mA base drive for full saturation at 500 mA collector load. |
| 2 | Emitter (E) | Reference terminal for biasing; connected to ground or low-side return path in high-side configurations. |
| 3 | Collector (C) | Main power output terminal; thermally and electrically tied to exposed bottom pad for PCB heat sinking. |
Key Features
| Feature | Design Value |
|---|---|
| Exposed collector pad | Enables direct thermal coupling to PCB copper, reducing Rth(j-a) by up to 50% vs. standard SOT-23 packages. |
| Side-wettable flanks | Supports automated optical inspection (AOI) of solder fillets without X-ray, improving manufacturing yield in high-volume SMT lines. |
| Two hFE bins | BC55-16PASX offers 100–250 hFE binning (vs. 63–160 for BC55-10PASX), allowing tighter current gain control in precision driver circuits. |
| Ultra-thin profile | 0.65 mm max height enables use in space-constrained portable electronics and stacked PCB assemblies. |
Applications
| Linear Voltage Regulators | Battery-Driven Devices |
|---|---|
Use Scenario: Low-dropout series pass element in adjustable linear regulators powering microcontrollers from 5 V rails. IC Role / Device Role / Timing Role: NPN pass transistor controlling output voltage via base bias feedback loop. Use Value: 500 mV VCE(sat) minimizes dropout voltage and improves efficiency at 500 mA load. |
Use Scenario: Load switch enabling/disabling power to Bluetooth modules in wearables during sleep mode. IC Role / Device Role / Timing Role: High-side switch controlled by MCU GPIO to isolate downstream circuitry. Use Value: 1 A IC rating supports peak BLE transmit currents while 150 °C Tj rating ensures reliability in sealed enclosures. |
| MOSFET Drivers | Power Management |
Use Scenario: Gate driver stage boosting current to rapidly charge/discharge power MOSFET gates in DC-DC converters. IC Role / Device Role / Timing Role: Current amplifier between logic-level controller and high-capacitance MOSFET gate. Use Value: 180 MHz fT and 250 hFE ensure sub-100 ns switching transitions with minimal gate drive energy loss. |
Use Scenario: Current-sense amplifier front-end in USB-C power delivery negotiation circuits. IC Role / Device Role / Timing Role: Transimpedance amplifier transistor converting shunt resistor current to measurable voltage. Use Value: Stable hFE over −55 °C to 100 °C enables accurate current measurement across industrial temperature ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN medium power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC54-16PASX | Lower VCEO (50 V vs. 60 V); identical hFE bin and package. | Not suitable for 60 V rail applications; acceptable in 3.3/5/12 V systems with margin. | Select when operating voltage stays ≤ 45 V and cost optimization is prioritized. |
| ZTX851 | TO-92 package; higher VCEO (60 V), but no side-wettable flanks or exposed pad; Rth(j-a) ≈ 200 K/W. | Lacks AOI support and thermal performance; unsuitable for high-density SMT or thermally constrained layouts. | Choose only for through-hole prototyping or legacy board redesigns where DFN footprint is unavailable. |
Compared with BC55-16PASX, BC54-16PASX trades voltage headroom for cost in low-voltage systems, while ZTX851 sacrifices thermal efficiency and manufacturability for through-hole compatibility - making BC55-16PASX optimal for modern high-density, thermally demanding SMT designs.
Availability
BC55-16PASX is available at Aetrix Electronics and suitable for linear voltage regulators, battery-driven devices, and MOSFET drivers requiring stable component supply, consistent hFE binning, and AOI-ready packaging.
Supply support for BC55-16PASX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors for automotive, industrial, mobile, and computing applications, with leadership in discrete, logic, and MOSFET technologies.
The BC55xPAS series targets space- and thermally constrained power management functions in consumer and industrial equipment, emphasizing manufacturability (AOI support), thermal efficiency (exposed pad), and parametric consistency (tight hFE bins).
FAQ
What is the maximum allowable junction temperature for BC55-16PASX?
The absolute maximum junction temperature (Tj) is 150 °C per IEC 60134 limiting values. Operation above this threshold risks permanent degradation of hFE and VCE(sat). Derating is required above 25 °C ambient - e.g., maximum Ptot drops to 1.10 W at 75 °C ambient on single-sided FR4 with 6 cm² collector pad.
Is BC55-16PASX qualified for automotive applications?
No. Per Nexperia's revision history (v.3, October 2024), BC55-16PASX is explicitly non-automotive qualified. It lacks AEC-Q101 stress testing and automotive-grade process controls. For automotive use, consult Nexperia's BC55-16PAS-Q series, which carries separate qualification and marking.
How does the side-wettable flank design improve manufacturing yield?
Side-wettable flanks allow automated optical inspection (AOI) systems to verify solder joint formation on the lateral edges of the DFN2020D-3 package - eliminating reliance on X-ray for hidden-joint validation. This reduces false call rates and increases first-pass yield in high-speed SMT lines without adding process steps.
What is the significance of the 'CJ' top-side marking on BC55-16PASX?
'CJ' is the manufacturer-assigned marking code confirming the BC55-16PASX variant (hFE = 100–250 bin). It distinguishes this part from BC55PAS ('CG') and BC55-10PASX ('CH') on tape-and-reel reels and PCBs, enabling visual verification of correct hFE selection during assembly and field service.
BC55-16PASX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 3-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 60 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 63 @ 150mA, 2V
- Power - Max:
- 420 mW
- Frequency - Transition:
- 180MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2020D-3
BC55-16PASX FAQ
1.How can I place an order for BC55-16PASX through Aetrix?
Please submit a Request for Quotation (RFQ) for BC55-16PASX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC55-16PASX reliable?
The price and inventory of BC55-16PASX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC55-16PASX is usually 5 days.
3.What payment methods are accepted for BC55-16PASX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC55-16PASX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC55-16PASX?
BC55-16PASX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC55-16PASX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC55-16PASX?
For technical support, including BC55-16PASX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC55-16PASX requirements.
6.How does Aetrix verify that BC55-16PASX is sourced from the original manufacturer or authorized distributors?
All BC55-16PASX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC55-16PASX meets industry standards.
7.What is the process for return or replacement of BC55-16PASX?
All BC55-16PASX units undergo pre-shipment inspection (PSI). If there is an issue with BC55-16PASX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC55-16PASX part is unused and in its original packaging.
Return procedure for BC55-16PASX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BC55-16PASX Tags
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