Nexperia USA Inc. BC807-16QBH-QZ
- Part No.:
- BC807-16QBH-QZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- 3-XDFN Exposed Pad
- Datasheet:
-
BC807-16QBH-QZ.pdf
- Description:
- TRANS PNP 45V 0.5A DFN1110D-3
- Quantity:
- Payment:

- Shipping:

Inventory:18,868
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BC807-16QBH-Q from Nexperia is a PNP general-purpose transistor in a DFN1110D-3 (SOT8015) leadless SMD package, rated for −45 V VCEO, −500 mA IC, DC current gain (hFE) of 100–250 at −100 mA, junction temperature up to 175 °C, and qualified per AEC-Q101 for automotive use. It serves as a compact, high-reliability switching and amplification device in space-constrained PCBs.
For engineers reviewing the BC807-16QBH-Q datasheet, BC807-16QBH-Q pinout, BC807-16QBH-Q application, or BC807-16QBH-Q equivalent, this page delivers verified electrical parameters, thermal derating behavior, AOI-compatible side-wettable flank geometry, and automotive-grade reliability context - all critical for high-density, high-temperature, and production-ready designs.
Technical Context
This PNP bipolar junction transistor operates with open-base collector-emitter breakdown voltage of −45 V and emitter-base breakdown voltage of −5 V, supporting robust off-state isolation in low-voltage control circuits. Its pulsed peak collector current reaches −1 A with ≤1 ms pulse width, enabling short-duration surge handling in load switching.
The device exhibits VCE(sat) ≤ −700 mV at −500 mA/−50 mA drive and VBE ≈ −1.2 V under same conditions, confirming low-loss conduction suitable for efficient active-mode operation. Thermal resistance Rth(j-a) is 272 K/W on 70 μm FR4 copper, directly informing power budgeting in thermally constrained layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −45 V: Maximum safe collector-emitter voltage with base open; defines off-state blocking capability in switching applications. |
| IC | −500 mA continuous: Rated DC collector current at 25 °C ambient; sets steady-state load-driving capacity. |
| hFE | 100–250 at VCE = −1 V, IC = −100 mA: Confirmed DC current gain range enabling predictable base drive sizing. |
| VCE(sat) | ≤ −700 mV at IC = −500 mA, IB = −50 mA: Low saturation voltage minimizes conduction loss and self-heating during switching. |
| Tj(max) | 175 °C: Maximum junction temperature; supports operation in under-hood automotive or industrial environments. |
| Ptot | 550 mW on 70 μm FR4 PCB: Total power dissipation limit defining thermal design margin at room ambient. |
| AEC-Q101 | Qualified: Meets stress-test requirements for discrete semiconductors in automotive applications. |
Pinout & Package
DFN1110D-3 (SOT8015) is a 3-terminal, leadless, ultra-thin surface-mount package measuring 1.1 × 1.0 × 0.5 mm with side-wettable flanks for automated optical inspection (AOI) of solder joints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Control terminal; requires −50 mA drive for full −500 mA collector conduction; polarity-sensitive for PNP biasing. |
| 2 | Emitter (E) | Current source terminal; connected to higher potential rail in common-emitter configurations; anchors internal substrate reference. |
| 3 | Collector (C) | Current sink terminal; handles −500 mA continuous load current; electrically tied to package thermal pad via internal die attach. |
Key Features
| Feature | Design Value |
|---|---|
| Side-wettable flanks | Enables automated optical inspection (AOI) of solder fillets without X-ray, improving manufacturing yield verification. |
| Ultra-small footprint | 1.1 × 1.0 mm body area reduces PCB real estate by >50% vs. conventional SOT23, critical for wearables and dense modules. |
| Low package height | 0.5 mm max profile allows stacking under shields or in ultra-low-profile enclosures without mechanical interference. |
| AEC-Q101 qualification | Validated for automotive powertrain, body control, and ADAS subsystems requiring extended temperature and reliability compliance. |
| High-temperature operation | Rated up to 175 °C junction temperature, supporting placement near heat sources like power ICs or motors without derating. |
Applications
| Automotive Door Module Switching | Industrial Sensor Signal Amplification |
|---|---|
|
Use Scenario: Driving window lift motor relays and LED status indicators in door control units exposed to −40 °C to +125 °C ambient. IC Role / Device Role / Timing Role: PNP switch controlling 12 V loads with logic-level base drive from MCU GPIO. Use Value: AEC-Q101 qualification and 175 °C Tj ensure long-term reliability without thermal shutdown in sealed modules. |
Use Scenario: Amplifying low-level analog signals from pressure or temperature sensors in factory automation PLC I/O cards. IC Role / Device Role / Timing Role: Linear-mode PNP amplifier stage providing stable hFE-based gain with minimal distortion at 100 kHz bandwidth. Use Value: Tight hFE bin (100–250) and low VCE(sat) enable predictable gain calibration and low offset error across temperature. |
| Portable Medical Device Power Control | Smart Home Actuator Interface |
|
Use Scenario: Enabling/disabling battery-powered pump drivers and display backlights in handheld diagnostic tools. IC Role / Device Role / Timing Role: Low-quiescent-current PNP switch isolating subsystems during sleep mode while maintaining fast turn-on response. Use Value: 0.5 mm height and 1.1 × 1.0 mm footprint allow integration into sub-10 mm thick handheld enclosures without compromising thermal performance. |
Use Scenario: Controlling solenoid locks and motorized blinds in battery-operated smart home hubs with strict size constraints. IC Role / Device Role / Timing Role: General-purpose PNP switch interfacing 3.3 V microcontroller outputs to 5–24 V actuator rails. Use Value: Side-wettable flanks support AOI on high-volume SMT lines, reducing post-reflow defect escapes in consumer-grade production. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP general-purpose transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC807-16LT1G | TO-236AB (SOT-23) package; 1.3 mm × 1.3 mm footprint; no side-wettable flanks; Rth(j-a) = 350 K/W on FR4. | Not AEC-Q101 qualified; limited to commercial-temperature industrial or consumer use. | Select when legacy SOT-23 compatibility or manual rework access is prioritized over AOI or automotive compliance. |
| MMBT3906-7-F | SOT-23 package; −40 V VCEO; hFE = 100–300; Ptot = 310 mW; not AEC-Q101 qualified. | Lower power rating and no automotive qualification; suited for non-safety-critical signal-level tasks only. | Choose for cost-sensitive, low-power signal inversion where thermal and reliability margins are less demanding. |
Compared with BC807-16LT1G and MMBT3906-7-F, BC807-16QBH-Q delivers superior thermal performance (550 mW vs. ≤310 mW), AEC-Q101 validation, and AOI-enabled manufacturability - making it the only option qualified for automotive and high-density industrial deployments requiring zero-defect solder joint assurance.
Availability
BC807-16QBH-Q is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, and portable medical devices requiring stable component supply, AEC-Q101 compliance, and ultra-compact SMD packaging.
Supply support for BC807-16QBH-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a leading global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET devices optimized for efficiency and miniaturization.
The BC807QBH-Q series targets space-constrained, high-reliability applications including automotive ECUs and industrial IoT nodes, emphasizing AEC-Q101 qualification, side-wettable flanks, and thermal resilience in ultra-thin packages.
FAQ
What is the maximum allowable junction temperature for BC807-16QBH-Q?
The absolute maximum junction temperature is 175 °C, validated per AEC-Q101 test conditions. Operation at this limit requires careful thermal design - including PCB copper area, airflow, and adjacent heat sources - as sustained 175 °C operation reduces long-term reliability. Derating curves in Figure 1 define safe power limits above 25 °C ambient.
Does BC807-16QBH-Q support automatic optical inspection (AOI) of solder joints?
Yes - its DFN1110D-3 package features side-wettable flanks specifically designed for AOI systems to inspect solder fillet formation without X-ray. This capability is confirmed in Section 2 of the datasheet and enables high-yield, zero-defect assembly in automotive and industrial SMT lines.
How does the hFE binning of BC807-16QBH-Q compare to BC807-25QBH-Q and BC807-40QBH-Q?
BC807-16QBH-Q has hFE = 100–250 at −100 mA, while BC807-25QBH-Q offers 160–400 and BC807-40QBH-Q provides 250–600 under identical test conditions. The "16", "25", and "40" suffixes denote distinct hFE bins - allowing precise base drive optimization for varying load and stability requirements.
Can BC807-16QBH-Q replace BC807-16 in through-hole designs?
No - BC807-16 uses TO-92 packaging and is incompatible with SMT processes. BC807-16QBH-Q is a surface-mount DFN1110D-3 device with different thermal, mechanical, and soldering requirements. Direct replacement would require PCB redesign, stencil changes, and requalification of thermal and reliability performance.
BC807-16QBH-QZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- BC807QBH-Q
- Package/Case:
- 3-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- PNP
- Current - Collector (Ic) (Max):
- 500 mA
- Voltage - Collector Emitter Breakdown (Max):
- 45 V
- Vce Saturation (Max) @ Ib, Ic:
- 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 100 @ 100mA, 1V
- Power - Max:
- 420 mW
- Frequency - Transition:
- 80MHz
- Operating Temperature:
- 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN1110D-3
BC807-16QBH-QZ FAQ
1.How can I place an order for BC807-16QBH-QZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BC807-16QBH-QZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC807-16QBH-QZ reliable?
The price and inventory of BC807-16QBH-QZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC807-16QBH-QZ is usually 5 days.
3.What payment methods are accepted for BC807-16QBH-QZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC807-16QBH-QZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC807-16QBH-QZ?
BC807-16QBH-QZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC807-16QBH-QZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC807-16QBH-QZ?
For technical support, including BC807-16QBH-QZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC807-16QBH-QZ requirements.
6.How does Aetrix verify that BC807-16QBH-QZ is sourced from the original manufacturer or authorized distributors?
All BC807-16QBH-QZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC807-16QBH-QZ meets industry standards.
7.What is the process for return or replacement of BC807-16QBH-QZ?
All BC807-16QBH-QZ units undergo pre-shipment inspection (PSI). If there is an issue with BC807-16QBH-QZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC807-16QBH-QZ part is unused and in its original packaging.
Return procedure for BC807-16QBH-QZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BC807-16QBH-QZ Tags

-
MMBT3906LT1G
onsemi

-
MMBT3904-7-F
Diodes Incorporated

-
MMBT3904LT1G
onsemi

-
MMBT3906-7-F
Diodes Incorporated

-
MMBT3904-TP
Micro Commercial Co

-
MMBT2222A-7-F
Diodes Incorporated

-
BC846BLT1G
onsemi

-
BC847B,215
Nexperia USA Inc.

-
SMMBT3904LT1G
onsemi

-
MMBT2222A-TP
Micro Commercial Co

-
MMBTA06LT1G
onsemi

-
MMBT2222ALT1G
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

