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Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BC807-16QCZ

Name: BC807-16QCZ
Brand: Nexperia USA Inc.
SKU: BC807-16QCZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BC807-16QCZ

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: 3-XDFN Exposed Pad

Datasheet:: BC807-16QCZ.pdf

Description:: TRANS 45V 0.5A DFN1412D-3

Quantity:: RFQ Add To RFQ list

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Inventory:25,000

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Product details

Overview

BC807-16QC from Nexperia is a PNP general-purpose bipolar junction transistor (BJT) in a leadless DFN1412D-3 (SOT8009) package, rated for −45 V V_CEO, −500 mA I_C, and DC current gain (h_FE) of 100–250 at V_CE = −1 V and I_C = −100 mA. It serves as a compact, surface-mount switching or amplification device in space-constrained consumer and industrial PCBs.

For engineers reviewing the BC807-16QC datasheet, BC807-16QC pinout, BC807-16QC application, or BC807-16QC equivalent, this page delivers verified electrical parameters, thermal derating behavior, side-wettable flank soldering guidance, and direct substitution options - all validated against Nexperia's Rev. 2 (July 2023) product data sheet.

Technical Context

This PNP BJT operates with open-base collector-emitter breakdown voltage of −45 V and emitter-base breakdown voltage of −5 V, supporting reliable cutoff and saturation in low-voltage DC control circuits. Its pulsed h_FE range (100–250) and −700 mV V_CE(sat) at −500 mA/−50 mA drive enable efficient switching in battery-powered logic interfaces and LED drivers.

The DFN1412D-3 package features side-wettable flanks for automated optical inspection (AOI) of solder joints, 0.48 mm profile, and thermal resistance R_th(j-a) of 329 K/W on standard FR4 (35 μm Cu), enabling stable operation up to 150 °C junction temperature under defined PCB layout conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	−45 V: Maximum safe collector-emitter voltage before breakdown under open-base condition; defines upper rail limit in PNP switch designs.
I_C	−500 mA continuous: Rated collector current at 25 °C ambient; usable up to this level with appropriate PCB copper area for thermal management.
h_FE	100–250 at V_CE = −1 V, I_C = −100 mA: Confirmed DC current gain range for bias network design; supports predictable base drive calculation.
V_CE(sat)	−700 mV max at I_C = −500 mA, I_B = −50 mA: Low saturation voltage ensures minimal power loss and heat generation during switch-on state.
P_tot	380 mW on FR4 (35 μm Cu): Total power dissipation limit at ≤25 °C ambient; derates linearly above 25 °C per published curve (Fig. 1).
R_th(j-a)	329 K/W: Junction-to-ambient thermal resistance on standard FR4; determines temperature rise per watt dissipated in typical layout.
Package	DFN1412D-3 (SOT8009): 1.4 × 1.2 × 0.48 mm leadless package with side-wettable flanks for AOI-compatible reflow soldering.

Pinout & Package

DFN1412D-3 (SOT8009) is a 3-terminal, leadless, ultra-thin plastic package with side-wettable flanks for automated optical inspection. Dimensions: 1.4 mm × 1.2 mm × 0.48 mm body, 0.8 mm pitch, and exposed thermal pad not connected internally.

Pin/Terminal	Circuit Role	Design Meaning
1	Base (B)	Control terminal for forward-biased PNP operation; requires negative current relative to emitter to turn on.
2	Emitter (E)	Current source terminal in PNP configuration; typically tied to higher potential (e.g., V_CC) in common-emitter switches.
3	Collector (C)	Current sink terminal; connects to load and ground-side circuitry in standard switching topologies.

Key Features

Feature	Design Value
Side-wettable flanks	Enables automated optical inspection (AOI) of solder joints without X-ray, improving manufacturing yield in high-volume SMT lines.
Ultra-low profile (0.48 mm)	Reduces board stack height in slim portable electronics and multi-layer modules where Z-axis clearance is constrained.
Three h_FE variants	BC807-16QC (100–250), -25QC (160–400), -40QC (250–600) allow precise gain matching across production batches or signal-chain stages.
High power dissipation capability	380 mW on standard FR4 enables >400 mA switching without external heatsinking in thermally optimized layouts.
Low V_BE (−1.2 V max)	Minimizes base drive voltage overhead in 3.3 V or 5 V logic-controlled applications, easing microcontroller GPIO compatibility.

Applications

LED Driver Circuit

Microcontroller GPIO Interface

Use Scenario: Driving 20–50 mA indicator LEDs from 3.3 V or 5 V supply in handheld devices.

IC Role / Device Role / Timing Role: PNP switch controlling current path from V_CC to LED anode; base driven by MCU output pin.

Use Value: −700 mV V_CE(sat) minimizes voltage drop across transistor, preserving LED forward voltage margin and brightness consistency.

Use Scenario: Level-shifting and inverting logic signals between 1.8 V/3.3 V MCUs and 5 V peripherals.

IC Role / Device Role / Timing Role: Active-low inverter stage providing rail-to-rail swing and current gain for fan-out extension.

Use Value: 100–250 h_FE ensures robust base current amplification, allowing weak GPIO pins to drive heavier capacitive loads reliably.

Power Rail Switching

Current-Sense Amplifier Bias

Use Scenario: Enabling/disabling auxiliary 3.3 V or 5 V power rails in IoT sensor nodes based on system sleep/wake state.

IC Role / Device Role / Timing Role: High-side PNP pass switch controlled by low-power PMIC or RTC output.

Use Value: −45 V V_CEO provides 10× safety margin over 3.3/5 V rails, ensuring long-term reliability under transient overvoltage events.

Use Scenario: Providing stable bias current to precision op-amps or instrumentation amplifiers in analog front-ends.

IC Role / Device Role / Timing Role: Constant-current source configured in common-emitter with emitter resistor feedback.

Use Value: Tight h_FE tolerance (100–250) and low V_BE drift (−2 mV/K) support <±2% bias current stability across −55 °C to 125 °C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BC807-16LT	Same electrical specs but in SOT23 package (3.0 × 1.4 × 1.1 mm); no side-wettable flanks; R_th(j-a) ≈ 400 K/W.	Less suitable for AOI-based production; better for prototyping or legacy SMT lines lacking DFN capability.	Select when board real estate allows larger footprint and AOI is not required.
MMBT3906LT1G	SOT23 package; −40 V V_CEO, −200 mA I_C, h_FE 100–300; higher V_CE(sat) (−400 mV typ. at −10 mA).	Limited to lower-current switching (<200 mA); unsuitable for 500 mA loads or high-efficiency LED drivers.	Choose only for low-power signal inversion where thermal performance is secondary.

Compared with BC807-16LT and MMBT3906LT1G, BC807-16QC delivers superior thermal performance (329 K/W vs ≥400 K/W), smaller footprint (1.4 × 1.2 mm vs 3.0 × 1.4 mm), and AOI-ready side-wettable flanks - making it optimal for high-density, high-volume production of compact power-switching and interface circuits.

Availability

BC807-16QC is available at Aetrix Electronics and suitable for LED driver circuits, microcontroller GPIO interfaces, and power rail switching requiring stable component supply, consistent parametric binning, and full traceability through JESD-46-compliant lot codes.

Supply support for BC807-16QC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The BC807QC series belongs to Nexperia's general-purpose transistor product line, engineered specifically for space-constrained, high-yield SMT applications demanding AOI-compatible packaging, tight h_FE grading, and robust thermal performance in ultra-thin profiles.

FAQ

What is the maximum allowable junction temperature for BC807-16QC?

The absolute maximum junction temperature (T_j) is 150 °C, as specified in Table 6 of the Nexperia datasheet. Operation beyond this limit risks permanent degradation of h_FE, increased leakage, and accelerated failure. Derating must follow Fig. 1: power dissipation drops linearly above 25 °C ambient, reaching zero at ~145 °C for the 35 μm Cu FR4 mounting condition.

Does BC807-16QC support reflow soldering with standard lead-free profiles?

Yes - BC807-16QC is qualified for lead-free reflow per JEDEC J-STD-020, with peak temperature up to 260 °C. Figure 17 provides the recommended solder land pattern (1.3 × 0.4 mm pads, 0.8 mm center-to-center), and the side-wettable flanks ensure reliable solder fillet formation visible to AOI systems without requiring X-ray inspection.

How does the h_FE of BC807-16QC vary with temperature and current?

Per Fig. 4, h_FE decreases with rising temperature: at I_C = −100 mA, typical gain is ~200 at 25 °C, ~160 at 150 °C, and ~240 at −55 °C. At higher currents (e.g., −500 mA), h_FE drops significantly - the datasheet specifies minimum 40 at V_CE = −1 V, confirming reduced gain in saturated switching mode.

Can BC807-16QC replace BC807-25QC or BC807-40QC in existing designs?

No - BC807-16QC has lower h_FE (100–250) than BC807-25QC (160–400) and BC807-40QC (250–600). Substituting it into a design relying on ≥160 gain may cause insufficient base drive, leading to elevated V_CE(sat), thermal stress, or logic-level errors. Always verify bias network margins using the actual h_FE min value for the selected variant.

BC807-16QCZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 3-XDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: -

Current - Collector (Ic) (Max):: 500 mA

Voltage - Collector Emitter Breakdown (Max):: 45 V

Vce Saturation (Max) @ Ib, Ic:: 700mV @ 50mA, 500mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 100 @ 100mA, 1V

Power - Max:: 380 mW

Frequency - Transition:: 80MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: DFN1412D-3

BC807-16QCZ FAQ

1.How can I place an order for BC807-16QCZ through Aetrix?

Please submit a Request for Quotation (RFQ) for BC807-16QCZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BC807-16QCZ reliable?

The price and inventory of BC807-16QCZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC807-16QCZ is usually 5 days.

3.What payment methods are accepted for BC807-16QCZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC807-16QCZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BC807-16QCZ?

BC807-16QCZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BC807-16QCZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BC807-16QCZ?

For technical support, including BC807-16QCZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC807-16QCZ requirements.

6.How does Aetrix verify that BC807-16QCZ is sourced from the original manufacturer or authorized distributors?

All BC807-16QCZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC807-16QCZ meets industry standards.

7.What is the process for return or replacement of BC807-16QCZ?

All BC807-16QCZ units undergo pre-shipment inspection (PSI). If there is an issue with BC807-16QCZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BC807-16QCZ part is unused and in its original packaging.

Return procedure for BC807-16QCZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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