Nexperia USA Inc. BC807-25QB-QZ

Overview

BC807-25QB-Q from Nexperia is a PNP general-purpose bipolar junction transistor in a DFN1110D-3 (SOT8015) leadless package, rated for −45 V V_CEO, −500 mA I_C, and 160–400 h_FE at V_CE = −1 V and I_C = −100 mA. It serves as a compact, AEC-Q101-qualified switching or amplification device in space-constrained automotive and industrial control circuits.

For engineers reviewing the BC807-25QB-Q datasheet, BC807-25QB-Q pinout, BC807-25QB-Q application, or BC807-25QB-Q equivalent, this page delivers verified electrical parameters, thermal derating behavior, side-wettable flank soldering guidance, and automotive-grade reliability context - all specific to the SOT8015 footprint and PNP switching function.

Technical Context

This transistor operates as a current-controlled PNP switch with base-emitter forward voltage of −1.2 V at I_C = −500 mA and V_CE = −1 V, and collector-emitter saturation voltage of −700 mV under same conditions. Its transition frequency f_T is 80 MHz at V_CE = −5 V, I_C = −10 mA, enabling moderate-speed digital and analog signal handling.

The device uses a thermally enhanced ultra-thin DFN1110D-3 package with side-wettable flanks for AOI-compatible reflow soldering. Thermal resistance R_th(j-a) is 272 K/W on 70 μm FR4 copper, supporting up to 460 mW power dissipation at T_amb ≤ 25 °C.

Key Specifications

Pinout & Package

DFN1110D-3 (SOT8015) is a 3-terminal, leadless, ultra-thin surface-mount package measuring 1.1 mm × 1.0 mm × 0.48 mm with side-wettable flanks for automated optical inspection and reliable reflow soldering.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Compared with BC807-25,115 and MMBT3906LT1G, BC807-25QB-Q delivers superior thermal performance (272 K/W), smaller footprint (1.1 × 1.0 mm), and AEC-Q101 validation - making it the only option suitable for space-constrained, high-reliability automotive switching where solder joint inspection and transient robustness are critical.

Availability

BC807-25QB-Q is available at Aetrix Electronics and suitable for automotive door modules, industrial sensor interfaces, space-constrained power sequencing, and consumer appliance motor control requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for BC807-25QB-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, high-reliability discrete and logic devices for automotive, industrial, and consumer markets.

The BC807QB-Q series belongs to Nexperia's AEC-Q101-qualified general-purpose transistor product line, designed specifically for robust, miniaturized switching and amplification in automotive electronics and space-sensitive industrial systems.

FAQ

What is the maximum allowable junction temperature for BC807-25QB-Q?

The absolute maximum junction temperature (T_j) is 150 °C, as defined in the limiting values table. Operation above this temperature risks permanent degradation of h_FE and increased leakage. Derating begins at T_amb > 25 °C per Figure 1, with P_tot dropping linearly to zero at 150 °C ambient on 70 μm copper FR4.

Does BC807-25QB-Q support automatic optical inspection (AOI)?

Yes - its DFN1110D-3 package features side-wettable flanks (SWF), allowing AOI systems to inspect solder fillet quality on the exposed metal sidewalls. This capability is explicitly cited in Section 2 ("Features and benefits") and confirmed in the package outline (Figure 16) and soldering guidelines (Figure 17).

How does the h_FE of BC807-25QB-Q vary with temperature and current?

At V_CE = −1 V and I_C = −100 mA, h_FE remains within 160–400 across −55 °C to +150 °C (Figure 8). At I_C = −500 mA, h_FE drops to 40 minimum (Table 8), and decreases further at elevated temperatures - e.g., typical h_FE falls ~25% from 25 °C to 150 °C per Figure 8 curves.

Is BC807-25QB-Q pin-compatible with other BC807 variants?

Yes - all BC807QB-Q series parts (−16, −25, −40) share identical DFN1110D-3 pinout (B-E-C on pins 1–2–3) and package dimensions. Gain binning differs, but electrical connections, thermal layout, and solder stencil requirements are fully interchangeable across the series.