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Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BC807-25QCZ

Name: BC807-25QCZ
Brand: Nexperia USA Inc.
SKU: BC807-25QCZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BC807-25QCZ

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: 3-XDFN Exposed Pad

Datasheet:: BC807-25QCZ.pdf

Description:: TRANS 45V 0.5A DFN1412D-3

Quantity:: RFQ Add To RFQ list

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Inventory:30,000

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Product details

Overview

BC807-25QCZ from Nexperia is a PNP general-purpose bipolar junction transistor in a leadless DFN1412D-3 (SOT8009) package, rated for −45 V V_CEO, −500 mA I_C, and DC current gain (h_FE) of 160–400 at V_CE = −1 V and I_C = −100 mA. It serves as a compact, high-reliability switching and amplification device in space-constrained consumer and industrial PCBs.

For engineers reviewing the BC807-25QCZ datasheet, BC807-25QCZ pinout, BC807-25QCZ application, or BC807-25QCZ equivalent, this page delivers verified electrical parameters, thermal derating behavior, side-wettable flank soldering guidance, and direct alternatives with documented h_FE and power dissipation differences.

Technical Context

This PNP BJT operates in linear and saturation regions with guaranteed h_FE range of 160–400 under pulsed conditions (t_p ≤ 300 μs, δ ≤ 0.02), enabling predictable biasing in low-voltage logic-level interfaces. Its −700 mV V_CE(sat) at I_C = −500 mA / I_B = −50 mA supports efficient switching in battery-powered load control circuits.

The DFN1412D-3 package features side-wettable flanks for automated optical inspection (AOI) of solder joints and delivers 480 mW total power dissipation on 70 μm copper FR4 - 23% higher than standard 35 μm layouts - while maintaining a 1.4 × 1.2 × 0.48 mm footprint and 0.5 mm profile.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	−45 V: Maximum safe collector-emitter voltage with base open; defines upper rail limit in high-side switch designs.
I_C	−500 mA continuous: Sustained collector current capability at 25 °C ambient; enables driving LEDs, relays, or small solenoids directly.
h_FE	160–400 at V_CE = −1 V, I_C = −100 mA: Tight DC current gain bin ensures consistent base drive requirements across production lots.
V_CE(sat)	−700 mV max at I_C = −500 mA, I_B = −50 mA: Low saturation voltage minimizes conduction loss and self-heating in switching applications.
P_tot	480 mW on 70 μm FR4: Thermal performance allows higher sustained current vs. legacy SOT-23 packages without heatsinking.
R_th(j-a)	261 K/W on 70 μm FR4: Junction-to-ambient thermal resistance confirms suitability for thermally dense layouts with limited airflow.

Pinout & Package

DFN1412D-3 (SOT8009) is a 3-terminal, leadless, ultra-thin plastic package measuring 1.4 × 1.2 × 0.48 mm with side-wettable flanks for AOI-compatible reflow soldering.

Pin/Terminal	Circuit Role	Design Meaning
1	Base (B)	Current-controlled input node; requires series resistor to limit I_B and ensure h_FE-based I_C scaling.
2	Emitter (E)	Common reference terminal for PNP operation; connected to higher potential rail in high-side switch configurations.
3	Collector (C)	Output current path; sinks load current to ground or lower-potential node when saturated.

Key Features

Feature	Design Value
Side-wettable flanks	Enables 100% automated optical inspection (AOI) of solder joint integrity on bottom terminals - critical for Class II/III reliability screening.
Ultra-small footprint	1.4 × 1.2 mm body area reduces PCB real estate by >50% vs. SOT-23, supporting miniaturized wearables and sensor modules.
Low profile (0.48 mm)	Facilitates stacking with thin batteries or conformal coating over components in sealed enclosures.
Three h_FE bins	BC807-25QCZ's 160–400 h_FE range allows precise gain matching in matched-pair amplifier stages or current mirrors.

Applications

LED Driver Circuit

Microcontroller GPIO Expander

Use Scenario: Driving multi-color status LEDs from 3.3 V microcontroller outputs with current limiting.

IC Role / Device Role / Timing Role: PNP switch sinking LED anode current to ground; configured as low-side active-high driver.

Use Value: −700 mV V_CE(sat) ensures <10 mW conduction loss per LED at 20 mA, preserving battery life in portable devices.

Use Scenario: Level-shifting and current boosting for 5 V peripheral enable lines controlled by 1.8 V/3.3 V MCU GPIOs.

IC Role / Device Role / Timing Role: Inverting level translator with gain; converts weak MCU output into robust 5 V logic signal.

Use Value: 160–400 h_FE guarantees reliable turn-on with ≤10 µA base drive, eliminating need for external pull-up resistors.

Power Rail Sequencing

Low-Voltage Sensor Interface

Use Scenario: Enabling auxiliary 3.3 V LDO only after main 5 V rail stabilizes in multi-rail systems.

IC Role / Device Role / Timing Role: High-side switch controlling LDO EN pin; base driven by RC-delayed 5 V signal.

Use Value: −45 V V_CEO provides 10 V margin above 3.3 V rail, preventing breakdown during transient overshoot.

Use Scenario: Amplifying weak analog signals from MEMS pressure sensors before ADC sampling.

IC Role / Device Role / Timing Role: Common-emitter preamplifier stage with fixed bias network.

Use Value: Stable h_FE across −55 °C to 150 °C ensures consistent gain calibration in automotive cabin sensors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BC807-25W	Same h_FE (160–400) but in SOT-323 package; 300 mW P_tot on FR4 vs. 480 mW for QCZ.	Larger thermal resistance (329 K/W) limits sustained current in high-density layouts.	Select when legacy SMT placement equipment lacks DFN support or board rework accessibility is prioritized.
MMBT3906LT1G	Lower h_FE (100–300), same −40 V V_CEO, but 310 mW P_tot and no side-wettable flanks.	Not AOI-compatible; requires post-solder X-ray inspection for void detection in production.	Choose for cost-sensitive consumer products where AOI is not mandated and thermal headroom is ample.

Compared with BC807-25W and MMBT3906LT1G, BC807-25QCZ delivers superior thermal performance and automated process verification - making it optimal for high-volume, space-constrained, and reliability-critical applications where solder joint integrity must be assured without added test steps.

Availability

BC807-25QCZ is available at Aetrix Electronics and suitable for LED driver circuits, microcontroller GPIO expansion, power rail sequencing, and low-voltage sensor interfaces requiring stable component supply across automotive infotainment, industrial IoT gateways, and medical wearable platforms.

Supply support for BC807-25QCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient logic, discrete, and MOSFET solutions for automotive, industrial, and mobile markets.

The BC807QC series targets compact, high-reliability general-purpose switching and amplification in space-constrained PCBs - emphasizing AOI-ready packaging, tight h_FE binning, and enhanced thermal performance over legacy SOT formats.

FAQ

What is the maximum allowable junction temperature for BC807-25QCZ?

The absolute maximum junction temperature (T_j) is 150 °C, as defined in the Absolute Maximum Ratings table. Operation beyond this limit risks permanent parametric shift or bond wire failure. Derating begins at 25 °C ambient, with P_tot decreasing linearly to zero at 150 °C for the 70 μm copper FR4 mounting condition.

Does BC807-25QCZ support reflow soldering with standard lead-free profiles?

Yes - the DFN1412D-3 package is qualified for IPC/JEDEC J-STD-020D-compliant lead-free reflow. Recommended peak temperature is 260 °C for ≤30 seconds, with ramp rates ≤3 °C/s. The side-wettable flanks ensure solder fillet visibility for AOI validation of all three terminals.

How does the h_FE of BC807-25QCZ vary with temperature?

h_FE increases with rising junction temperature: typical values rise ~0.5%/°C between 25 °C and 125 °C. Figure 8 shows h_FE = ~400 at I_C = −100 mA and T_amb = 150 °C, versus ~250 at −55 °C - critical for bias stability in wide-temperature-range sensor front-ends.

Can BC807-25QCZ replace BC807-25 in existing SOT-23 designs?

No - BC807-25QCZ uses the DFN1412D-3 (SOT8009) package, which is physically incompatible with SOT-23 footprints. Pad layout, stencil aperture, and reflow profile differ significantly. A redesign of the PCB land pattern and solder paste stencil is required to migrate from through-hole or SOT-23 variants.

BC807-25QCZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 3-XDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: -

Current - Collector (Ic) (Max):: 500 mA

Voltage - Collector Emitter Breakdown (Max):: 45 V

Vce Saturation (Max) @ Ib, Ic:: 700mV @ 50mA, 500mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 160 @ 100mA, 1V

Power - Max:: 380 mW

Frequency - Transition:: 80MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: DFN1412D-3

BC807-25QCZ FAQ

1.How can I place an order for BC807-25QCZ through Aetrix?

Please submit a Request for Quotation (RFQ) for BC807-25QCZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BC807-25QCZ reliable?

The price and inventory of BC807-25QCZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC807-25QCZ is usually 5 days.

3.What payment methods are accepted for BC807-25QCZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC807-25QCZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BC807-25QCZ?

BC807-25QCZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BC807-25QCZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BC807-25QCZ?

For technical support, including BC807-25QCZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC807-25QCZ requirements.

6.How does Aetrix verify that BC807-25QCZ is sourced from the original manufacturer or authorized distributors?

All BC807-25QCZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC807-25QCZ meets industry standards.

7.What is the process for return or replacement of BC807-25QCZ?

All BC807-25QCZ units undergo pre-shipment inspection (PSI). If there is an issue with BC807-25QCZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BC807-25QCZ part is unused and in its original packaging.

Return procedure for BC807-25QCZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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