Nexperia USA Inc. BC807-40QC-QZ

Overview

BC807-40QC-Q from Nexperia is a PNP general-purpose bipolar junction transistor in a leadless DFN1412D-3 (SOT8009) package, rated for −45 V V_CEO, −500 mA I_C, and DC current gain (h_FE) of 250–600 at V_CE = −1 V and I_C = −100 mA. It delivers low V_CE(sat) (−700 mV max at I_C = −500 mA, I_B = −50 mA), supports automotive-grade reliability per AEC-Q101, and targets space-constrained switching and amplification in power management stages.

For engineers reviewing the BC807-40QC-Q datasheet, BC807-40QC-Q pinout, BC807-40QC-Q application, or BC807-40QC-Q equivalent, this page provides verified pin functions, thermal derating curves, side-wettable flank soldering guidance, and validated automotive-grade alternatives - all aligned with Nexperia's Rev. 2 (May 2021) product data sheet.

Technical Context

This PNP BJT operates as a medium-power discrete switch or linear amplifier with fixed polarity and base-controlled conduction. Its DFN1412D-3 package features side-wettable flanks for automated optical inspection (AOI) of solder joints and achieves 0.48 mm profile height on FR4 PCBs.

The device exhibits pulsed h_FE of 250–600 under standardized conditions (V_CE = −1 V, I_C = −100 mA, T_amb = 25 °C, δ ≤ 0.02), thermal resistance R_th(j-a) of 261 K/W (70 μm copper), and absolute maximum ratings including −50 V V_CBO, −5 V V_EBO, and 150 °C T_j.

Key Specifications

Pinout & Package

DFN1412D-3 (SOT8009) is a 3-terminal, leadless, ultra-thin plastic package measuring 1.4 × 1.2 × 0.48 mm with side-wettable flanks for AOI-compatible reflow soldering. Thermal performance depends on PCB copper thickness: 261 K/W (70 μm) or 329 K/W (35 μm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Compared with BC807-40QC-Q, the BC807-40,115 sacrifices AOI capability and thermal performance for backward compatibility, while MBT3906DW1T1G trades single-device precision and automotive robustness for dual-channel integration at reduced voltage margin.

Availability

BC807-40QC-Q is available at Aetrix Electronics and suitable for automotive body control, USB-C power delivery, industrial sensor conditioning, and space-constrained IoT node power sequencing requiring stable component supply across extended temperature ranges and high-volume manufacturing.

Supply support for BC807-40QC-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.

The BC807QC-Q series belongs to Nexperia's automotive-qualified general-purpose transistor portfolio, engineered specifically for robust, space-efficient switching and amplification in harsh-environment and miniaturized electronic systems.

FAQ

What is the maximum allowable base current for continuous operation?

The absolute maximum peak base current is −200 mA per datasheet Table 6, but continuous operation requires limiting I_B to ensure junction temperature stays within 150 °C. At I_C = −500 mA and h_FE ≥ 250, I_B ≤ −2 mA is sufficient for saturation; practical design uses −12 mA to guarantee overdrive across temperature and process variation.

Can BC807-40QC-Q be used in linear amplifier configurations?

Yes - its specified h_FE range (250–600), low V_CE(sat), and characterized f_T (80 MHz) support stable small-signal amplification. However, linearity is optimized at V_CE ≥ −1 V and I_C ≤ −100 mA; thermal drift of V_BE (−2 mV/K) must be compensated in precision DC-coupled stages.

Is the DFN1412D-3 package compatible with standard reflow profiles?

Yes - Nexperia provides a dedicated reflow footprint (Fig. 17) and qualifies the package for JEDEC J-STD-020 moisture sensitivity level 1. Recommended stencil thickness is 0.1 mm, and solder land dimensions (1.3 × 0.45 mm per pad) ensure reliable side-wettable flank wetting under standard Pb-free reflow profiles with peak temperatures up to 260 °C.

How does AEC-Q101 qualification impact long-term reliability in non-automotive applications?

AEC-Q101 qualification subjects BC807-40QC-Q to accelerated stress tests (HTSL, TC, UHAST, etc.) exceeding industrial requirements, resulting in demonstrated failure-in-time (FIT) rates <100 FIT and median lifetime >10× longer than non-qualified equivalents. This directly improves field reliability in industrial and medical equipment operating at elevated temperatures or with long service intervals.