Nexperia USA Inc. BC807-40QCZ

Overview

BC807-40QCZ from Nexperia is a PNP general-purpose bipolar junction transistor in a leadless DFN1412D-3 (SOT8009) package, rated for −45 V V_CEO, −500 mA I_C, and DC current gain (h_FE) of 250–600 at V_CE = −1 V and I_C = −100 mA. It serves as a compact, high-reliability switching and amplification device in space-constrained consumer, industrial, and power management circuits.

For engineers reviewing the BC807-40QCZ datasheet, BC807-40QCZ pinout, BC807-40QCZ application, or BC807-40QCZ equivalent, this page delivers verified electrical parameters, thermal derating behavior, side-wettable flank soldering guidance, and real-world use context for PCB layout, AOI compatibility, and thermal design validation.

Technical Context

This transistor operates as a low-voltage, medium-current PNP switch with guaranteed h_FE ≥250 at −100 mA collector current and −1 V V_CE, enabling robust base drive margin in digital logic interfacing and load control. Its DFN1412D-3 package features side-wettable flanks for automated optical inspection of solder joints and supports ≤0.5 mm profile height for ultra-thin assemblies.

Thermal performance is defined by R_th(j-a) = 329 K/W on standard FR4 (35 μm Cu) and 261 K/W on enhanced FR4 (70 μm Cu), with total power dissipation up to 380 mW at T_amb ≤25 °C. Absolute maximum ratings include −50 V V_CBO, −5 V V_EBO, and −1 A peak collector current (1 ms pulse).

Key Specifications

Pinout & Package

DFN1412D-3 (SOT8009) is a 3-terminal, leadless, ultra-thin plastic package with side-wettable flanks, measuring 1.4 mm × 1.2 mm × 0.48 mm and featuring a 0.8 mm pitch. Its low profile (0.5 mm max height) and exposed thermal pad enable high-density routing and improved thermal transfer in compact PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Compared with BC807-40,115 and MMBT3906LT1G, BC807-40QCZ uniquely combines AOI-ready side-wettable flanks, 1.4 × 1.2 mm footprint, and guaranteed h_FE ≥250 at full −500 mA rating-making it the optimal choice for high-volume, space-constrained, thermally managed PNP switching.

Availability

BC807-40QCZ is available at Aetrix Electronics and suitable for LED driver circuits, microcontroller interface modules, and relay coil control systems requiring stable component supply, consistent parametric performance, and AOI-compatible packaging.

Supply support for BC807-40QCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential system functionality, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The BC807QC series belongs to Nexperia's general-purpose transistor product line, engineered specifically for space-constrained, high-yield SMT applications demanding AOI-compliant packaging, tight h_FE binning, and robust thermal performance in ultra-thin form factors.

FAQ

What is the maximum allowable junction temperature for BC807-40QCZ?

The absolute maximum junction temperature (T_j) is 150 °C per the datasheet Limiting Values table. Operation above this threshold risks permanent degradation of h_FE, V_CE(sat), and leakage currents. Derating curves in Figure 1 confirm usable power drops linearly above 25 °C ambient, requiring thermal design validation for sustained −500 mA loads.

Does BC807-40QCZ support reflow soldering with standard lead-free profiles?

Yes-Nexperia specifies compatibility with JEDEC J-STD-020D.3 lead-free reflow profiles, including peak temperatures up to 260 °C. The DFN1412D-3 package's side-wettable flanks and recommended stencil thickness (0.1 mm) ensure reliable solder joint formation and AOI detectability per Figure 17 footprint guidelines.

How does the h_FE variation affect base resistor selection?

With h_FE spanning 250–600, base resistors must be sized for worst-case gain (250) to guarantee saturation at −500 mA. For example, using I_B = I_C/10 = −50 mA yields V_BE ≈ −1.2 V, so R_B = (V_GPIO − V_BE)/I_B ≈ 100 Ω for 3.3 V drive-ensuring deep saturation even at minimum h_FE.

Is BC807-40QCZ qualified for automotive applications?

No-this part is explicitly marked "non-automotive qualified" in the revision history (Section 13). It lacks AEC-Q101 stress testing and automotive-grade screening. For automotive use, Nexperia offers the BC807-40Q variants (e.g., BC807-40QB,115) with full qualification and extended temperature support (−40 °C to +150 °C).