Nexperia USA Inc. BC817-16QBH-QZ

Overview

BC817-16QBH-Q from Nexperia is an AEC-Q101-qualified NPN general-purpose transistor in a DFN1110D-3 (SOT8015) leadless package, rated for 45 V V_CEO, 500 mA I_C, and DC current gain (h_FE) of 100–250 at V_CE = 1 V, I_C = 100 mA. It operates up to 175 °C junction temperature and supports space-constrained automotive body electronics switching.

For engineers reviewing the BC817-16QBH-Q datasheet, BC817-16QBH-Q pinout, BC817-16QBH-Q application, or BC817-16QBH-Q equivalent, key selection criteria include its side-wettable flank design for AOI-compatible solder joint inspection, ultra-thin 0.5 mm profile, thermal resistance of 358 K/W on FR4 (35 μm Cu), and qualification for automotive-grade reliability under AEC-Q101.

Technical Context

This device functions as a medium-power NPN bipolar junction transistor optimized for linear amplification and saturated switching in low-voltage DC circuits. Its base-emitter saturation voltage is ≤1.2 V at I_C = 500 mA, and collector-emitter saturation voltage is ≤700 mV under same conditions, enabling efficient drive with modest base current.

The DFN1110D-3 package integrates thermal enhancement via exposed copper pad and side-wettable flanks, supporting automated optical inspection and high-density PCB layouts. Its 1.1 × 1.0 × 0.5 mm footprint delivers 40% area reduction versus SOT23 while maintaining robust power dissipation up to 420 mW at T_amb ≤ 25 °C.

Key Specifications

Pinout & Package

DFN1110D-3 (SOT8015) is a 3-terminal, leadless, thermally enhanced plastic package with side-wettable flanks, measuring 1.1 mm × 1.0 mm × 0.5 mm. Its exposed thermal pad improves heat transfer to PCB copper, and the 0.2–0.4 mm flank height enables reliable AOI detection of solder fillets.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose switching applications.

Compared with BC817-16,115 and MMBT3904LT1G, BC817-16QBH-Q uniquely combines AEC-Q101 qualification, side-wettable flanks for AOI, and superior thermal performance in a 1.1 × 1.0 mm footprint-making it the only choice for new automotive PCB designs requiring zero-defect solder joint verification and high-temperature reliability.

Availability

BC817-16QBH-Q is available at Aetrix Electronics and suitable for automotive interior lighting control, engine bay sensor signal conditioning, and body control module load switching requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for BC817-16QBH-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer markets.

The BC817QBH-Q series belongs to Nexperia's AEC-Q101-qualified discrete transistor portfolio, engineered specifically for automotive body electronics demanding high reliability, miniaturization, and AOI-compatible manufacturing.

FAQ

What is the maximum allowable base current for continuous operation?

The absolute maximum peak base current is 200 mA for single pulses ≤1 ms, but for continuous DC operation, the recommended limit is 50 mA to ensure V_CE(sat) remains ≤700 mV at I_C = 500 mA and prevent thermal runaway. Derating is required above 25 °C ambient per the power derating curve in Figure 1.

Does BC817-16QBH-Q require a heatsink in typical automotive applications?

No external heatsink is required. At 500 mA I_C and 700 mV V_CE(sat), power dissipation is 350 mW. With R_th(j-a) = 358 K/W on standard FR4 (35 μm Cu), junction temperature rise is ~125 K above ambient-well within the 175 °C T_j(max) limit even at 70 °C ambient.

Can BC817-16QBH-Q be used in linear amplifier configurations?

Yes-it supports linear operation with h_FE stability across −55 °C to +150 °C and low V_BE drift (~−2 mV/K). However, its 45 V V_CEO and 500 mA I_C limit usable output swing and power; best suited for pre-amplifier or sensor interface stages-not power output stages.

What PCB layout recommendations ensure optimal thermal performance?

Maximize copper area connected to the exposed thermal pad using ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Maintain ≥0.2 mm solder mask opening around flanks for full wetting. Follow the reflow footprint in Figure 17: 0.88 mm × 0.78 mm solder land with 0.1 mm stencil thickness for consistent paste volume.