Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BC817-16QBZ

Name: BC817-16QBZ
Brand: Nexperia USA Inc.
SKU: BC817-16QBZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BC817-16QBZ

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: 3-XDFN Exposed Pad

Datasheet:: BC817-16QBZ.pdf

Description:: TRANS NPN 45V 0.5A DFN1110D-3

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,441

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BC817-16QBZ from Nexperia is an AEC-Q101 qualified NPN general-purpose transistor in a DFN1110D-3 (SOT8015) leadless package, rated for 45 V V_CEO, 500 mA I_C, with h_FE = 100–250 at V_CE = 1 V and I_C = 100 mA, used for low-voltage switching and signal amplification in space-constrained automotive and industrial PCBs.

For engineers reviewing the BC817-16QBZ datasheet, BC817-16QBZ pinout, BC817-16QBZ application, or BC817-16QBZ equivalent, this page delivers verified electrical specs, thermal derating curves, side-wettable flank soldering guidance, and direct substitution options validated for automotive-grade reliability and AOI-compatible assembly.

Technical Context

This device operates as a silicon NPN bipolar junction transistor with base-controlled current amplification, optimized for linear amplification and saturated switching in DC-coupled and pulse-driven circuits. Its design supports IC/IB = 10 operation with V_CEsat ≤ 700 mV at I_C = 500 mA and I_B = 50 mA, and exhibits f_T = 100 MHz at V_CE = 5 V, I_C = 10 mA.

The DFN1110D-3 package enables high-density placement with side-wettable flanks for automated optical inspection of solder joints, while its 0.48 mm profile and 1.1 mm × 1.0 mm footprint reduce board area by >50% versus SOT23. Thermal resistance R_th(j-a) is 358 K/W on FR4 with 35 μm copper, enabling stable operation up to T_j = 150 °C.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	45 V - Maximum collector-emitter voltage before breakdown under open-base conditions; defines safe DC switching headroom in 24 V and 36 V automotive systems.
I_C	500 mA - Continuous collector current rating at 25 °C ambient; supports load switching for sensors, LEDs, and small relays without external heatsinking.
h_FE	100–250 - DC current gain range at V_CE = 1 V, I_C = 100 mA; ensures predictable base drive sizing across production lots and temperature extremes.
V_CEsat	≤700 mV - Collector-emitter saturation voltage at I_C = 500 mA, I_B = 50 mA; minimizes conduction loss and self-heating in high-duty-cycle switching.
f_T	100 MHz - Transition frequency at V_CE = 5 V, I_C = 10 mA; supports audio-frequency amplification and fast digital signal buffering up to ~10 MHz.
R_th(j-a)	358 K/W - Junction-to-ambient thermal resistance on standard FR4 (35 μm Cu); determines required PCB copper area for thermal management at full load.

Pinout & Package

DFN1110D-3 (SOT8015) is a 3-terminal, leadless, ultra-thin plastic package measuring 1.1 mm × 1.0 mm × 0.48 mm, featuring side-wettable flanks for AOI-compatible reflow soldering and enhanced thermal performance via bottom-side thermal pad contact.

Pin/Terminal	Circuit Role	Design Meaning
1	Base (B)	Current-controlled input node; requires 50 mA base drive for full 500 mA collector saturation; polarity-sensitive for correct biasing.
2	Emitter (E)	Reference terminal for current flow; internally connected to exposed thermal pad in DFN1110D-3; must be soldered to PCB ground plane for thermal and electrical stability.
3	Collector (C)	High-current output node; handles up to 500 mA continuous load; electrically isolated from package thermal pad except through die attachment.

Key Features

Feature	Design Value
AEC-Q101 qualification	Validated for automotive applications including engine control modules, body electronics, and ADAS sensor interfaces per stress test requirements.
Side-wettable flanks	Enables 100% automated optical inspection of solder joint integrity without X-ray; eliminates hidden voids in bottom-soldered terminals.
0.48 mm package height	Reduces system Z-height for ultra-thin modules such as infotainment displays, wearables, and compact power supplies.
Three h_FE bins	BC817-16QBZ (100–250), BC817-25QBZ (160–400), BC817-40QBZ (250–600) allow precise gain matching for analog feedback loops and current mirror accuracy.

Applications

Automotive Door Module

Industrial Sensor Interface

Use Scenario: Driving window lift motor relays and LED status indicators in door control units.

IC Role / Device Role / Timing Role: NPN switch controlling 12 V/300 mA inductive loads with flyback protection; operates in saturated mode with <1 µs turn-off delay.

Use Value: AEC-Q101 qualification ensures 15-year field reliability; side-wettable flanks guarantee solder joint integrity in high-vibration environments.

Use Scenario: Level-shifting and buffering analog signals from 3.3 V microcontrollers to 5 V industrial sensors.

IC Role / Device Role / Timing Role: Common-emitter amplifier with fixed-gain bias network; provides 20 dB voltage gain and <10 ns propagation delay.

Use Value: Tight h_FE binning (100–250) maintains consistent gain across production batches; low V_CEsat preserves dynamic range in rail-to-rail signal paths.

Compact Power Supply Enable

Smart Lighting Driver

Use Scenario: Enabling/disabling auxiliary 5 V LDO outputs in USB-C PD adapters and multi-rail SMPS controllers.

IC Role / Device Role / Timing Role: Low-side enable switch sinking up to 400 mA enable current; driven directly from MCU GPIO with no level shifter.

Use Value: 500 mA I_C rating exceeds typical enable current requirements; 0.48 mm height allows stacking under connectors and shields.

Use Scenario: PWM-controlled current sink for RGB LED strings in architectural lighting and signage modules.

IC Role / Device Role / Timing Role: Linear current regulator operating in active region with constant I_B; modulates I_C from 10 mA to 450 mA at 1 kHz.

Use Value: f_T = 100 MHz ensures minimal phase lag at PWM frequencies; thermal resistance <360 K/W prevents thermal runaway during sustained dimming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BC817-16,115 (SOT23)	Same electrical specs but in larger SOT23-3 package (2.9 mm × 1.3 mm); no side-wettable flanks; R_th(j-a) = 450 K/W.	Lacks AOI support and thermal performance; suitable only for non-automotive prototypes or legacy designs with existing SOT23 footprints.	Select when board real estate is unconstrained and AOI is not required; avoid in new automotive or high-reliability designs.
MMBT3904LT1G (SOT23)	Lower V_CEO = 40 V; h_FE = 100–300; same I_C = 200 mA (derated to 500 mA only in pulsed mode); not AEC-Q101 qualified.	Not rated for 45 V automotive battery transients; unsuitable for 24 V systems with load dump; limited thermal margin at full DC load.	Acceptable only for consumer-grade 3.3/5 V logic interfacing where AEC-Q101 and 45 V rating are unnecessary.

Compared with BC817-16QBZ, the SOT23 alternatives trade AOI capability, thermal efficiency, and automotive qualification for broader distributor availability-making BC817-16QBZ the sole choice when space, reliability, and manufacturability are co-constrained.

Availability

BC817-16QBZ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, and compact power supply enable circuits requiring stable component supply, long-term lifecycle assurance, and AEC-Q101 compliance.

Supply support for BC817-16QBZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging technologies.

The BC817QB series belongs to Nexperia's AEC-Q101-qualified general-purpose transistor portfolio, engineered specifically for space-constrained automotive and industrial applications demanding AOI compatibility, thermal robustness, and parametric consistency.

FAQ

Is BC817-16QBZ pin-compatible with BC817-16,115?

No-BC817-16QBZ uses the DFN1110D-3 (SOT8015) package with side-wettable flanks and a 0.65 mm pin pitch, while BC817-16,115 uses SOT23-3 with 1.9 mm pitch and no wettable flanks. Footprint, soldering process, and thermal pad layout are incompatible; redesign is required for migration.

What is the maximum allowable PCB copper thickness for optimal thermal performance?

For best thermal performance, use FR4 with ≥70 μm single-sided copper (R_th(j-a) = 272 K/W). The datasheet specifies 35 μm copper yields 358 K/W; doubling copper thickness reduces junction-to-ambient resistance by 24%, directly improving power handling at elevated ambient temperatures.

Does BC817-16QBZ support 100% AOI verification out-of-the-box?

Yes-the side-wettable flanks (SWF) on pins 1 (B), 2 (E), and 3 (C) are explicitly designed for automated optical inspection of solder fillet geometry. No additional stencil modifications or post-process X-ray are needed when using the recommended 0.1 mm stencil thickness and IPC-7527-compliant reflow profile.

Can BC817-16QBZ replace BC847B in existing designs?

Only with circuit validation-BC847B has higher h_FE (200–450) and lower V_CEsat (≤600 mV), but lacks AEC-Q101 qualification and side-wettable flanks. BC817-16QBZ offers superior thermal performance and automotive reliability but requires checking base drive margin and transient voltage tolerance in the target application.

BC817-16QBZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: BC817QB

Package/Case:: 3-XDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: NPN

Current - Collector (Ic) (Max):: 500 mA

Voltage - Collector Emitter Breakdown (Max):: 45 V

Vce Saturation (Max) @ Ib, Ic:: 700mV @ 50mA, 500mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 100 @ 100mA, 1V

Power - Max:: 350 mW

Frequency - Transition:: 100MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: DFN1110D-3

BC817-16QBZ FAQ

1.How can I place an order for BC817-16QBZ through Aetrix?

Please submit a Request for Quotation (RFQ) for BC817-16QBZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BC817-16QBZ reliable?

The price and inventory of BC817-16QBZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC817-16QBZ is usually 5 days.

3.What payment methods are accepted for BC817-16QBZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC817-16QBZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BC817-16QBZ?

BC817-16QBZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BC817-16QBZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BC817-16QBZ?

For technical support, including BC817-16QBZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC817-16QBZ requirements.

6.How does Aetrix verify that BC817-16QBZ is sourced from the original manufacturer or authorized distributors?

All BC817-16QBZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC817-16QBZ meets industry standards.

7.What is the process for return or replacement of BC817-16QBZ?

All BC817-16QBZ units undergo pre-shipment inspection (PSI). If there is an issue with BC817-16QBZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BC817-16QBZ part is unused and in its original packaging.

Return procedure for BC817-16QBZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…