Nexperia USA Inc. BC817K-16HR

Overview

BC817K-16HR from Nexperia is a 45 V, 500 mA NPN general-purpose transistor in SOT23 package, designed for low-voltage switching and linear amplification in consumer, industrial, and automotive-adjacent circuits. It delivers DC current gain (h_FE) of 100–250 at V_CE = 1 V and I_C = 100 mA, supports continuous operation up to 175 °C junction temperature, and features 700 mV V_CE(sat) at I_C = 500 mA / I_B = 50 mA.

For engineers reviewing the BC817K-16HR datasheet, BC817K-16HR pinout, BC817K-16HR application, or BC817K-16HR equivalent, this page provides verified electrical parameters, thermal derating curves, SOT23 footprint details, and validated alternatives for discrete BJT selection in cost-sensitive, space-constrained designs requiring stable gain and robust thermal performance.

Technical Context

This NPN bipolar junction transistor operates in active, saturation, and cutoff regions with defined absolute maximum ratings: V_CEO = 45 V, I_C = 500 mA, T_j = 175 °C. Its pulsed peak collector current reaches 1 A (t_p ≤ 1 ms), and base-emitter breakdown voltage is rated at 7 V.

The device exhibits typical transition frequency f_T = 100 MHz at V_CE = 5 V, I_C = 10 mA, enabling use in medium-speed switching (e.g., PWM dimming, relay drivers) and low-gain RF preamplifier stages where linearity and thermal stability are prioritized over ultra-high bandwidth.

Key Specifications

Pinout & Package

SOT23 plastic surface-mounted package (TO-236AB), 3-lead, 1.3 mm × 2.9 mm × 1.0 mm body, standard footprint per Fig. 44 (reflow) and Fig. 45 (wave).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Compared with BC817-16,115, BC817K-16HR offers lower saturation voltage and guaranteed 175 °C operation; versus MMBT3904LT1G, it delivers 2.5× higher continuous current and 12.5% higher breakdown voltage, making it suitable for higher-power discrete switching where thermal headroom matters.

Availability

BC817K-16HR is available at Aetrix Electronics and suitable for LED driver circuits, microcontroller GPIO expansion, and relay coil driving requiring stable component supply, consistent h_FE binning, and extended temperature capability.

Supply support for BC817K-16HR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading semiconductor manufacturer specializing in high-volume, high-reliability discrete and logic devices, with global manufacturing and quality systems certified to ISO 9001 and IATF 16949.

The BC817KH series belongs to Nexperia's general-purpose transistor product line, engineered for cost-effective, thermally robust switching and amplification in consumer, industrial, and infrastructure equipment where long-term supply stability and parametric consistency are essential.

FAQ

Is BC817K-16HR pin-compatible with BC817-16?

Yes - both use identical SOT23 (TO-236AB) package with pin 1 = Base, pin 2 = Emitter, pin 3 = Collector. Mechanical dimensions, solder footprint, and thermal pad layout match per Figures 43–45 in the datasheet. No PCB redesign is needed for substitution.

What is the maximum allowable base current for continuous operation?

The absolute maximum peak base current is 200 mA (single pulse, t_p ≤ 1 ms), but for continuous DC operation, I_B must be limited to ensure I_C ≤ 500 mA and V_CE(sat) remains within spec. At I_C = 500 mA and h_FE = 100 (min), I_B = 5 mA is sufficient; practical designs use 5–10 mA with margin.

Does BC817K-16HR support automotive applications?

No - per Revision History (Table 9), this part was changed to non-automotive qualification in Rev. 2 (2025). For automotive-grade equivalents, Nexperia recommends BC817-Q series variants, which undergo AEC-Q101 stress testing and include enhanced ESD protection and lot traceability.

How does thermal performance vary between PCB stack-ups?

R_th(j-a) ranges from 353 K/W (single-sided FR4, standard footprint) to 158 K/W (4-layer FR4, 1 cm² collector pad). Using a 4-layer board with dedicated thermal vias under pin 3 reduces junction temperature rise by up to 140 °C at 500 mW dissipation, directly extending lifetime and gain stability.